| |
 |
|
Class Information
Number: 257/690
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With contact or lead
Description: Subject matter wherein the device is provided with a contact or lead, in addition to or as part of the package or housing.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6847116 |
Chip-type semiconductor light-emitting device |
Jan. 25, 2005 |
| 6847123 |
Vertically staggered bondpad array |
Jan. 25, 2005 |
| 6844576 |
Master slice type semiconductor integrated circuit and method for designing the same |
Jan. 18, 2005 |
| 6845496 |
Semiconductor integrated circuit device using programmable peripheral control |
Jan. 18, 2005 |
| 6841849 |
Semiconductor device and method of manufacturing the same, circuit board and electronic instrument |
Jan. 11, 2005 |
| 6841853 |
Semiconductor device having grooves to relieve stress between external electrodes and conductive patterns |
Jan. 11, 2005 |
| 6838755 |
Leadframe for integrated circuit chips having low resistance connections |
Jan. 4, 2005 |
| 6838762 |
Water-level package with bump ring |
Jan. 4, 2005 |
| 6836004 |
Lead frame, and method for manufacturing semiconductor device and method for inspecting electrical properties of small device using the lead frame |
Dec. 28, 2004 |
| 6836010 |
Semiconductor device include relay chip connecting semiconductor chip pads to external pads |
Dec. 28, 2004 |
| 6833620 |
Apparatus having reduced input output area and method thereof |
Dec. 21, 2004 |
| 6828600 |
Power semiconductor module with ceramic substrate |
Dec. 7, 2004 |
| 6828667 |
Surface mounting type electronic component |
Dec. 7, 2004 |
| 6828668 |
Flexible lead structures and methods of making same |
Dec. 7, 2004 |
| 6828669 |
Interconnection substrate having metal columns covered by a resin film, and manufacturing method thereof |
Dec. 7, 2004 |
| 6828681 |
Semiconductor devices having contact pads and methods of manufacturing the same |
Dec. 7, 2004 |
| 6825547 |
Semiconductor device including edge bond pads |
Nov. 30, 2004 |
| 6825552 |
Connection components with anisotropic conductive material interconnection |
Nov. 30, 2004 |
| 6822164 |
Semiconductor device and electro-optical device including the same |
Nov. 23, 2004 |
| 6822322 |
Substrate for mounting a semiconductor chip and method for manufacturing a semiconductor device |
Nov. 23, 2004 |
| 6822338 |
Wiring structure of semiconductor device |
Nov. 23, 2004 |
| 6815621 |
Chip scale package, printed circuit board, and method of designing a printed circuit board |
Nov. 9, 2004 |
| 6815789 |
Semiconductor electronic device and method of manufacturing thereof |
Nov. 9, 2004 |
| 6815806 |
Asymmetric partially-etched leads for finer pitch semiconductor chip package |
Nov. 9, 2004 |
| 6812552 |
Partially patterned lead frames and methods of making and using the same in semiconductor packaging |
Nov. 2, 2004 |
| 6812554 |
Semiconductor device and a method of manufacturing the same |
Nov. 2, 2004 |
| 6812561 |
Thin high-frequency module having integrated circuit chip with little breakage |
Nov. 2, 2004 |
| 6812581 |
Chip size package with stress relieving internal terminal |
Nov. 2, 2004 |
| 6813154 |
Reversible heat sink packaging assembly for an integrated circuit |
Nov. 2, 2004 |
| 6809411 |
Low-inductance semiconductor components |
Oct. 26, 2004 |
| 6806560 |
Semiconductor device and method for fabricating same |
Oct. 19, 2004 |
| 6803667 |
Semiconductor device having a protective film |
Oct. 12, 2004 |
| 6794741 |
Three-dimensional stacked semiconductor package with pillars in pillar cavities |
Sep. 21, 2004 |
| 6794742 |
Inverter module having a plurality of terminals at a predetermined pitch |
Sep. 21, 2004 |
| 6794745 |
Lead on chip type semiconductor package |
Sep. 21, 2004 |
| 6790711 |
Method of making semiconductor device |
Sep. 14, 2004 |
| 6791110 |
Semiconductor-package measuring method, measuring socket, and semiconductor package |
Sep. 14, 2004 |
| 6791176 |
Lithographic contact elements |
Sep. 14, 2004 |
| 6787892 |
Semiconductor device and semiconductor device manufacturing method |
Sep. 7, 2004 |
| 6787894 |
Apparatus and method for leadless packaging of semiconductor devices |
Sep. 7, 2004 |
| 6787902 |
Package structure with increased capacitance and method |
Sep. 7, 2004 |
| 6787927 |
Semiconductor device and wire bonding apparatus |
Sep. 7, 2004 |
| 6784554 |
Semiconductor device and manufacturing method thereof |
Aug. 31, 2004 |
| 6780696 |
Method and apparatus for self-assembly of functional blocks on a substrate facilitated by electrode pairs |
Aug. 24, 2004 |
| 6781222 |
Semiconductor package having vertically mounted passive devices under a chip and a fabricating method thereof |
Aug. 24, 2004 |
| 6781225 |
Glueless integrated circuit system in a packaging module |
Aug. 24, 2004 |
| 6781230 |
Flat circuit interconnecting device |
Aug. 24, 2004 |
| 6781243 |
Leadless leadframe package substitute and stack package |
Aug. 24, 2004 |
| 6777800 |
Semiconductor die package including drain clip |
Aug. 17, 2004 |
| 6777801 |
Semiconductor device and method of manufacturing same |
Aug. 17, 2004 |
|
|
|
