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Class Information
Number: 257/690
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With contact or lead
Description: Subject matter wherein the device is provided with a contact or lead, in addition to or as part of the package or housing.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6911736 |
Electrostatic discharge protection |
Jun. 28, 2005 |
| 6911737 |
Semiconductor device package and method |
Jun. 28, 2005 |
| 6911739 |
Methods and apparatus for improving high frequency input/output performance |
Jun. 28, 2005 |
| 6909173 |
Flexible substrate, semiconductor device, imaging device, radiation imaging device and radiation imaging system |
Jun. 21, 2005 |
| 6900532 |
Wafer level chip scale package |
May. 31, 2005 |
| 6897556 |
I/O architecture for integrated circuit package |
May. 24, 2005 |
| 6897557 |
Integrated electrical connector |
May. 24, 2005 |
| 6894373 |
Surface-mounting type of electronic circuit unit suitable for miniaturization and a method for fabricating the unit |
May. 17, 2005 |
| 6894382 |
Optimized electronic package |
May. 17, 2005 |
| 6894386 |
Apparatus and method for packaging circuits |
May. 17, 2005 |
| 6891255 |
Microelectronic packages having an array of resilient leads |
May. 10, 2005 |
| 6891258 |
Interposer providing low-inductance decoupling capacitance for a packaged integrated circuit |
May. 10, 2005 |
| 6891273 |
Semiconductor package and fabrication method thereof |
May. 10, 2005 |
| 6888233 |
Systems for buried electrical feedthroughs in a glass-silicon MEMS process |
May. 3, 2005 |
| 6888259 |
Potted hybrid integrated circuit |
May. 3, 2005 |
| 6885096 |
Semiconductor device having at least three power terminals superposed on each other |
Apr. 26, 2005 |
| 6885097 |
Semiconductor device |
Apr. 26, 2005 |
| 6880244 |
Circuit board having simultaneously and unitarily formed wiring patterns and protrusions |
Apr. 19, 2005 |
| 6882037 |
Die paddle for receiving an integrated circuit die in a plastic substrate |
Apr. 19, 2005 |
| 6882040 |
Semiconductor device |
Apr. 19, 2005 |
| 6882044 |
High speed electronic interconnection using a detachable substrate |
Apr. 19, 2005 |
| 6882047 |
Semiconductor package including a plurality of semiconductor chips therein |
Apr. 19, 2005 |
| 6882048 |
Lead frame and semiconductor package having a groove formed in the respective terminals for limiting a plating area |
Apr. 19, 2005 |
| 6879033 |
Semiconductor device |
Apr. 12, 2005 |
| 6879034 |
Semiconductor package including low temperature co-fired ceramic substrate |
Apr. 12, 2005 |
| 6876061 |
Chip scale surface mount package for semiconductor device and process of fabricating the same |
Apr. 5, 2005 |
| 6873032 |
Thermally enhanced chip scale lead on chip semiconductor package and method of making same |
Mar. 29, 2005 |
| 6873041 |
Power semiconductor package with strap |
Mar. 29, 2005 |
| 6870250 |
Chip package structure having .pi. filter |
Mar. 22, 2005 |
| 6870254 |
Flip clip attach and copper clip attach on MOSFET device |
Mar. 22, 2005 |
| 6870276 |
Apparatus for supporting microelectronic substrates |
Mar. 22, 2005 |
| 6867484 |
Semiconductor device |
Mar. 15, 2005 |
| 6867496 |
Interconnect substrate, semiconductor device, methods of fabricating, inspecting, and mounting the semiconductor device, circuit board, and electronic instrument |
Mar. 15, 2005 |
| 6864565 |
Post-passivation thick metal pre-routing for flip chip packaging |
Mar. 8, 2005 |
| 6864568 |
Packaging device for holding a plurality of semiconductor devices to be inspected |
Mar. 8, 2005 |
| 6864587 |
Semiconductor device |
Mar. 8, 2005 |
| 6865074 |
Method of producing electronic unit of radio system and electronic unit |
Mar. 8, 2005 |
| 6861732 |
Power source circuit device |
Mar. 1, 2005 |
| 6856011 |
Semiconductor chip package and method of fabricating same |
Feb. 15, 2005 |
| 6856012 |
Contact system |
Feb. 15, 2005 |
| 6853074 |
Electronic part, an electronic part mounting element and a process for manufacturing such the articles |
Feb. 8, 2005 |
| 6853086 |
Semiconductor device and method of manufacture thereof, circuit board, and electronic instrument |
Feb. 8, 2005 |
| 6853559 |
Thermal management of power delivery systems for integrated circuits |
Feb. 8, 2005 |
| 6849930 |
Semiconductor device with uneven metal plate to improve adhesion to molding compound |
Feb. 1, 2005 |
| 6849935 |
Low-cost circuit board materials and processes for area array electrical interconnections over a large area between a device and the circuit board |
Feb. 1, 2005 |
| 6849936 |
System and method for using film deposition techniques to provide an antenna within an integrated circuit package |
Feb. 1, 2005 |
| 6847101 |
Microelectronic package having a compliant layer with bumped protrusions |
Jan. 25, 2005 |
| 6847106 |
Semiconductor circuit with mechanically attached lid |
Jan. 25, 2005 |
| 6847107 |
Image forming apparatus with improved transfer efficiency |
Jan. 25, 2005 |
| 6847108 |
Semiconductor integrated circuit |
Jan. 25, 2005 |
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