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Class Information
Number: 257/690
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With contact or lead
Description: Subject matter wherein the device is provided with a contact or lead, in addition to or as part of the package or housing.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6992386 |
Semiconductor device and a method of manufacturing the same |
Jan. 31, 2006 |
| 6987313 |
Semiconductor device |
Jan. 17, 2006 |
| 6987323 |
Chip-size semiconductor package |
Jan. 17, 2006 |
| 6987326 |
Methods and apparatus for improving high frequency input/output performance |
Jan. 17, 2006 |
| 6984883 |
Semiconductor power module |
Jan. 10, 2006 |
| 6984890 |
Chip-scale package |
Jan. 10, 2006 |
| 6982479 |
Semiconductor package with leadframe inductors |
Jan. 3, 2006 |
| 6979889 |
Plastic lead frames for semiconductor devices |
Dec. 27, 2005 |
| 6977430 |
Transistor module |
Dec. 20, 2005 |
| 6977444 |
Methods and apparatus for improving high frequency input/output performance |
Dec. 20, 2005 |
| 6975039 |
Method of forming a ball grid array package |
Dec. 13, 2005 |
| 6972445 |
Input/output structure and integrated circuit using the same |
Dec. 6, 2005 |
| 6972483 |
Semiconductor package with improved thermal emission property |
Dec. 6, 2005 |
| 6963082 |
Multi-chip package device including a semiconductor memory chip |
Nov. 8, 2005 |
| 6963127 |
Protective structures for bond wires |
Nov. 8, 2005 |
| 6963385 |
Electrooptic device, driving IC, and electronic apparatus |
Nov. 8, 2005 |
| 6958285 |
Methods of manufacturing devices having substrates with opening passing through the substrates and conductors in the openings |
Oct. 25, 2005 |
| 6958527 |
Wiring board having interconnect pattern with land, and semiconductor device, circuit board, and electronic equipment incorporating the same |
Oct. 25, 2005 |
| 6958534 |
Power semiconductor module |
Oct. 25, 2005 |
| 6956283 |
Encapsulants for protecting MEMS devices during post-packaging release etch |
Oct. 18, 2005 |
| 6953291 |
Compact package design for vertical cavity surface emitting laser array to optical fiber cable connection |
Oct. 11, 2005 |
| 6953893 |
Circuit board for connecting an integrated circuit to a support and IC BGA package using same |
Oct. 11, 2005 |
| 6953991 |
Semiconductor device |
Oct. 11, 2005 |
| 6953992 |
Electronic component with at least one semiconductor chip and method for its manufacture |
Oct. 11, 2005 |
| 6952048 |
Semiconductor device with improved design freedom of external terminal |
Oct. 4, 2005 |
| 6946725 |
Electronic device having microscopically small contact areas and methods for producing the electronic device |
Sep. 20, 2005 |
| 6946746 |
Method to reduce number of wire-bond loop heights versus the total quantity of power and signal rings |
Sep. 20, 2005 |
| 6943436 |
EMI heatspreader/lid for integrated circuit packages |
Sep. 13, 2005 |
| 6943440 |
Methods of processing thick ILD layers using spray coating or lamination for C4 wafer level thick metal integrated flow |
Sep. 13, 2005 |
| 6940093 |
Special contact points for accessing internal circuitry of an integrated circuit |
Sep. 6, 2005 |
| 6940155 |
IC package, optical transmitter, and optical receiver |
Sep. 6, 2005 |
| 6936915 |
Lead frame having chip mounting part and leads of different thicknesses |
Aug. 30, 2005 |
| 6933593 |
Power module having a heat sink |
Aug. 23, 2005 |
| 6933599 |
Electromagnetic noise shielding in semiconductor packages using caged interconnect structures |
Aug. 23, 2005 |
| 6933600 |
Substrate for semiconductor package |
Aug. 23, 2005 |
| 6930355 |
Silicided trench gate power mosfets ultrasonically bonded to a surface source electrode |
Aug. 16, 2005 |
| 6930379 |
Power gridding scheme |
Aug. 16, 2005 |
| 6930383 |
Electronic component including a housing and a substrate |
Aug. 16, 2005 |
| 6927485 |
Substrate for semiconductor package |
Aug. 9, 2005 |
| 6927486 |
Photo-interrupter and semiconductor device using the same |
Aug. 9, 2005 |
| 6927489 |
Semiconductor device provided with rewiring layer |
Aug. 9, 2005 |
| 6921980 |
Integrated semiconductor circuit including electronic component connected between different component connection portions |
Jul. 26, 2005 |
| 6919625 |
Surface mount multichip devices |
Jul. 19, 2005 |
| 6917101 |
Apparatus carrying electronic device |
Jul. 12, 2005 |
| 6917102 |
Contact structure and production method thereof and probe contact assembly using same |
Jul. 12, 2005 |
| 6914327 |
Semiconductor device and manufacturing method thereof |
Jul. 5, 2005 |
| 6911721 |
Semiconductor device, method for manufacturing semiconductor device and electronic equipment |
Jun. 28, 2005 |
| 6911726 |
Microelectronic packaging and methods for thermally protecting package interconnects and components |
Jun. 28, 2005 |
| 6911732 |
Integrated circuit |
Jun. 28, 2005 |
| 6911735 |
Collar positionable about a periphery of a contact pad and around a conductive structure secured to the contact pads, semiconductor device components including same, and methods for fabricatin |
Jun. 28, 2005 |
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