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Class Information
Number: 257/690
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With contact or lead
Description: Subject matter wherein the device is provided with a contact or lead, in addition to or as part of the package or housing.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7078792 |
Universal interconnect die |
Jul. 18, 2006 |
| 7078794 |
Chip package and process for forming the same |
Jul. 18, 2006 |
| 7078796 |
Corrosion-resistant copper bond pad and integrated device |
Jul. 18, 2006 |
| 7078797 |
Hybrid integrated circuit device |
Jul. 18, 2006 |
| 7078808 |
Double density method for wirebond interconnect |
Jul. 18, 2006 |
| 7075173 |
Interposer including adhesive tape |
Jul. 11, 2006 |
| 7075181 |
Semiconductor package having semiconductor constructing body and method of manufacturing the same |
Jul. 11, 2006 |
| 7071523 |
Encapsulated light receiving and processing semiconductor module with enhanced shielding and grounding properties |
Jul. 4, 2006 |
| 7071551 |
Device used to produce or examine semiconductors |
Jul. 4, 2006 |
| 7064423 |
IC module and IC card |
Jun. 20, 2006 |
| 7061085 |
Semiconductor component and system having stiffener and circuit decal |
Jun. 13, 2006 |
| 7061091 |
Surface mount package with integral electro-static charge dissipating ring using lead frame as ESD device |
Jun. 13, 2006 |
| 7061092 |
High-density modularity for ICS |
Jun. 13, 2006 |
| 7061093 |
Semiconductor device and voltage regulator |
Jun. 13, 2006 |
| 7057283 |
Semiconductor device and method for producing the same |
Jun. 6, 2006 |
| 7057292 |
Solder bar for high power flip chips |
Jun. 6, 2006 |
| 7053474 |
Semiconductor component having at least two chips which are integrated in a housing and with which contact is made by a common contact chip |
May. 30, 2006 |
| 7049180 |
Method of fabricating a memory transistor array utilizing insulated word lines as gate electrodes |
May. 23, 2006 |
| 7049682 |
Multi-chip semiconductor package with integral shield and antenna |
May. 23, 2006 |
| 7049693 |
Electrical contact array for substrate assemblies |
May. 23, 2006 |
| 7049694 |
Semiconductor package with crossing conductor assembly and method of manufacture |
May. 23, 2006 |
| 7049696 |
IC package with electrically conductive heat-radiating mechanism, connection structure and electronic device |
May. 23, 2006 |
| 7049705 |
Chip structure |
May. 23, 2006 |
| 7045883 |
Thermally enhanced chip scale lead on chip semiconductor package and method of making same |
May. 16, 2006 |
| 7042078 |
Semiconductor package |
May. 9, 2006 |
| 7042080 |
Semiconductor interconnect having compliant conductive contacts |
May. 9, 2006 |
| 7036218 |
Method for producing a wafer interposer for use in a wafer interposer assembly |
May. 2, 2006 |
| 7038309 |
Chip package structure with glass substrate |
May. 2, 2006 |
| 7038310 |
Power module with improved heat dissipation |
May. 2, 2006 |
| 7034389 |
Flip chip package, circuit board thereof and packaging method thereof |
Apr. 25, 2006 |
| 7030474 |
Plastic integrated circuit package and method and leadframe for making the package |
Apr. 18, 2006 |
| 7030476 |
Rectifier diode device |
Apr. 18, 2006 |
| 7030479 |
Integrated circuit die and/or package having a variable pitch contact array for maximization of number of signal lines per routing layer |
Apr. 18, 2006 |
| 7030496 |
Semiconductor device having aluminum and metal electrodes and method for manufacturing the same |
Apr. 18, 2006 |
| 7023076 |
Multiple chip semiconductor packages |
Apr. 4, 2006 |
| 7023078 |
Packages for communication devices |
Apr. 4, 2006 |
| 7023086 |
Semiconductor component arrangement with a reduced oscillation tendency |
Apr. 4, 2006 |
| 7015574 |
Electronic device carrier adapted for transmitting high frequency signals |
Mar. 21, 2006 |
| 7015585 |
Packaged integrated circuit having wire bonds and method therefor |
Mar. 21, 2006 |
| 7012329 |
Memory transistor array utilizing insulated word lines as gate electrodes |
Mar. 14, 2006 |
| 7008824 |
Method of fabricating mounted multiple semiconductor dies in a package |
Mar. 7, 2006 |
| 7009223 |
Rectification chip terminal structure |
Mar. 7, 2006 |
| 7009282 |
Packaged integrated circuit providing trace access to high-speed leads |
Mar. 7, 2006 |
| 7009288 |
Semiconductor component with electromagnetic shielding device |
Mar. 7, 2006 |
| 7009293 |
Interconnect substrate, semiconductor device, methods of fabricating, inspecting, and mounting the semiconductor device, circuit board, and electronic instrument |
Mar. 7, 2006 |
| 7009308 |
Methods and apparatus for improving high frequency input/output performance |
Mar. 7, 2006 |
| 7005739 |
High power semiconductor module |
Feb. 28, 2006 |
| 7002237 |
Spherical shaped semiconductor device, a flexible printed wiring substrate, and mounting method thereof |
Feb. 21, 2006 |
| 7002803 |
Electronic product with heat radiating plate |
Feb. 21, 2006 |
| 6992377 |
Semiconductor package with crossing conductor assembly and method of manufacture |
Jan. 31, 2006 |
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