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Class Information
Number: 257/690
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With contact or lead
Description: Subject matter wherein the device is provided with a contact or lead, in addition to or as part of the package or housing.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7187074 |
Semiconductor and electronic device with spring terminal |
Mar. 6, 2007 |
| 7187072 |
Fabrication process of semiconductor package and semiconductor package |
Mar. 6, 2007 |
| 7183646 |
Semiconductor chip carrier affording a high-density external interface |
Feb. 27, 2007 |
| 7183639 |
Semiconductor device and method of manufacturing the same |
Feb. 27, 2007 |
| 7180196 |
Semiconductor device mounting method, semiconductor device mounting structure, electro-optical device, electro-optical device manufacturing method and electronic device |
Feb. 20, 2007 |
| 7180169 |
Circuit component built-in module and method for manufacturing the same |
Feb. 20, 2007 |
| 7176565 |
Capacitors having separate terminals on three or more sides |
Feb. 13, 2007 |
| 7176560 |
Semiconductor device having a chip--chip structure |
Feb. 13, 2007 |
| 7176062 |
Lead-frame method and assembly for interconnecting circuits within a circuit module |
Feb. 13, 2007 |
| 7173321 |
Semiconductor package having multiple row of leads |
Feb. 6, 2007 |
| 7173232 |
Light detection device and mounting method thereof |
Feb. 6, 2007 |
| 7172924 |
Semiconductor device having a semiconductor chip mounted on external terminals and fabrication method thereof |
Feb. 6, 2007 |
| 7170187 |
Low stress conductive polymer bump |
Jan. 30, 2007 |
| 7170160 |
Chip structure and stacked-chip package |
Jan. 30, 2007 |
| 7166916 |
Manufacturing method for semiconductor integrated circuit, semiconductor integrated circuit, and semiconductor integrated circuit apparatus |
Jan. 23, 2007 |
| 7164201 |
Semiconductor module with scalable construction |
Jan. 16, 2007 |
| 7164196 |
Semiconductor device |
Jan. 16, 2007 |
| 7145224 |
Semiconductor device |
Dec. 5, 2006 |
| 7141868 |
Flash preventing substrate and method for fabricating the same |
Nov. 28, 2006 |
| 7138706 |
Semiconductor device and method for manufacturing the same |
Nov. 21, 2006 |
| 7135763 |
Technique for attaching die to leads |
Nov. 14, 2006 |
| 7129587 |
Semiconductor device, semiconductor package for use therein, and manufacturing method thereof |
Oct. 31, 2006 |
| 7129573 |
System having semiconductor component with encapsulated, bonded, interconnect contacts |
Oct. 31, 2006 |
| 7129566 |
Scribe street structure for backend interconnect semiconductor wafer integration |
Oct. 31, 2006 |
| 7126213 |
Rectification chip terminal structure |
Oct. 24, 2006 |
| 7126195 |
Method for forming a metallization layer |
Oct. 24, 2006 |
| 7122887 |
Chip scale surface mounted device and process of manufacture |
Oct. 17, 2006 |
| 7119448 |
Main power inductance based on bond wires for a switching power converter |
Oct. 10, 2006 |
| 7119438 |
Method of arranging microspheres with liquid, microsphere arranging device, and semiconductor device |
Oct. 10, 2006 |
| 7115984 |
Semiconductor devices including peripherally located bond pads, intermediates thereof, assemblies, and packages including the semiconductor devices, and support elements for the semiconductor |
Oct. 3, 2006 |
| 7115982 |
Semiconductor component having stiffener, stacked dice and circuit decals |
Oct. 3, 2006 |
| 7115977 |
Multi-chip package type semiconductor device |
Oct. 3, 2006 |
| 7112879 |
Microelectronic assemblies having compliant layers |
Sep. 26, 2006 |
| 7112871 |
Flipchip QFN package |
Sep. 26, 2006 |
| 7109577 |
Semiconductor device and power supply system |
Sep. 19, 2006 |
| 7109572 |
Quad flat no lead (QFN) grid array package |
Sep. 19, 2006 |
| 7105925 |
Differential planarization |
Sep. 12, 2006 |
| 7102208 |
Leadframe and semiconductor package with improved solder joint strength |
Sep. 5, 2006 |
| 7102221 |
Memory-Module with an increased density for mounting semiconductor chips |
Sep. 5, 2006 |
| 7102222 |
Conductive trace structure and semiconductor package having the conductive trace structure |
Sep. 5, 2006 |
| 7102230 |
Circuit carrier and fabrication method thereof |
Sep. 5, 2006 |
| 7098527 |
Integrated circuit package electrical enhancement with improved lead frame design |
Aug. 29, 2006 |
| 7095106 |
Collars, support structures, and forms for protruding conductive structures |
Aug. 22, 2006 |
| 7095115 |
Circuit substrates, semiconductor packages, and ball grid arrays |
Aug. 22, 2006 |
| 7091597 |
Power supply device |
Aug. 15, 2006 |
| 7091620 |
Semiconductor device and manufacturing method thereof |
Aug. 15, 2006 |
| 7088074 |
System level device for battery and integrated circuit integration |
Aug. 8, 2006 |
| 7084489 |
Computer system including at least one stress balanced semiconductor package |
Aug. 1, 2006 |
| 7081660 |
Hermetic package with internal ground pads |
Jul. 25, 2006 |
| 7081661 |
High-frequency module and method for manufacturing the same |
Jul. 25, 2006 |
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