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Class Information
Number: 257/690
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With contact or lead
Description: Subject matter wherein the device is provided with a contact or lead, in addition to or as part of the package or housing.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7262495 |
3D interconnect with protruding contacts |
Aug. 28, 2007 |
| 7262493 |
System and method for mounting electrical devices |
Aug. 28, 2007 |
| 7259452 |
Leaded package integrated circuit stacking |
Aug. 21, 2007 |
| 7256488 |
Semiconductor package with crossing conductor assembly and method of manufacture |
Aug. 14, 2007 |
| 7256486 |
Packaging device for semiconductor die, semiconductor device incorporating same and method of making same |
Aug. 14, 2007 |
| 7253514 |
Self-supporting connecting element for a semiconductor chip |
Aug. 7, 2007 |
| 7253508 |
Semiconductor package with a flip chip on a solder-resist leadframe |
Aug. 7, 2007 |
| 7253506 |
Micro lead frame package |
Aug. 7, 2007 |
| 7250673 |
Signal isolation in a package substrate |
Jul. 31, 2007 |
| 7247944 |
Connector assembly |
Jul. 24, 2007 |
| 7247936 |
Tape circuit substrate having wavy beam leads and semiconductor chip package using the same |
Jul. 24, 2007 |
| 7245028 |
Split control pad for multiple signal |
Jul. 17, 2007 |
| 7245024 |
Electronic assembly with reduced leakage current |
Jul. 17, 2007 |
| 7242258 |
Temperature-compensated crystal oscillator |
Jul. 10, 2007 |
| 7242085 |
Semiconductor device including a semiconductor chip mounted on a metal base |
Jul. 10, 2007 |
| 7242082 |
Stackable layer containing ball grid array package |
Jul. 10, 2007 |
| 7242079 |
Method of manufacturing a data carrier |
Jul. 10, 2007 |
| 7242078 |
Surface mount multichip devices |
Jul. 10, 2007 |
| 7242076 |
Packaged integrated circuit with MLP leadframe and method of making same |
Jul. 10, 2007 |
| 7239009 |
Lead frame and semiconductor device having the same as well as method of resin-molding the same |
Jul. 3, 2007 |
| 7239008 |
Semiconductor apparatus and method for fabricating the same |
Jul. 3, 2007 |
| 7233063 |
Borderless contact structures |
Jun. 19, 2007 |
| 7233062 |
Integrated circuit package with improved electro-static discharge protection |
Jun. 19, 2007 |
| 7230340 |
Post passivation interconnection schemes on top of the IC chips |
Jun. 12, 2007 |
| 7227254 |
Integrated circuit package |
Jun. 5, 2007 |
| 7224076 |
Electronic component package |
May. 29, 2007 |
| 7224054 |
Semiconductor device and system having semiconductor device mounted thereon |
May. 29, 2007 |
| 7224053 |
Semiconductor device responsive to different levels of input and output signals and signal processing system using the same |
May. 29, 2007 |
| 7221048 |
Multilayer circuit carrier, panel, electronic device, and method for producing a multilayer circuit carrier |
May. 22, 2007 |
| 7217997 |
Ground arch for wirebond ball grid arrays |
May. 15, 2007 |
| 7211887 |
connection arrangement for micro lead frame plastic packages |
May. 1, 2007 |
| 7211883 |
Semiconductor chip package |
May. 1, 2007 |
| 7208840 |
Semiconductor module, electronic device and electronic equipment, and method for manufacturing semiconductor module |
Apr. 24, 2007 |
| 7208830 |
Interconnect shunt used for current distribution and reliability redundancy |
Apr. 24, 2007 |
| 7208829 |
Semiconductor component |
Apr. 24, 2007 |
| 7206515 |
Single-ended/differential wired radio frequency interface |
Apr. 17, 2007 |
| 7205673 |
Reduce or eliminate IMC cracking in post wire bonded dies by doping aluminum used in bond pads during Cu/Low-k BEOL processing |
Apr. 17, 2007 |
| 7205668 |
Multi-layer printed circuit board wiring layout |
Apr. 17, 2007 |
| 7205649 |
Ball grid array copper balancing |
Apr. 17, 2007 |
| 7205638 |
Silicon building blocks in integrated circuit packaging |
Apr. 17, 2007 |
| 7204017 |
Manufacturing method of a modularized leadframe |
Apr. 17, 2007 |
| 7202566 |
Crossed power strapped layout for full CMOS circuit design |
Apr. 10, 2007 |
| 7202545 |
Memory module and method for operating a memory module |
Apr. 10, 2007 |
| 7199460 |
Semiconductor device and method of manufacturing the same |
Apr. 3, 2007 |
| 7199459 |
Semiconductor package without bonding wires and fabrication method thereof |
Apr. 3, 2007 |
| 7196427 |
Structure having an integrated circuit on another integrated circuit with an intervening bent adhesive element |
Mar. 27, 2007 |
| 7196409 |
Semiconductor device, semiconductor body and method of manufacturing thereof |
Mar. 27, 2007 |
| 7193312 |
Castellation wafer level packaging of integrated circuit chips |
Mar. 20, 2007 |
| 7190080 |
Semiconductor chip assembly with embedded metal pillar |
Mar. 13, 2007 |
| 7189594 |
Wafer level packages and methods of fabrication |
Mar. 13, 2007 |
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