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Class Information
Number: 257/690
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With contact or lead
Description: Subject matter wherein the device is provided with a contact or lead, in addition to or as part of the package or housing.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 5345363 |
Method and apparatus of coupling a die to a lead frame with a tape automated bonded tape that has openings which expose portions of the tape leads |
Sep. 6, 1994 |
| 5343076 |
Semiconductor device with an airtight space formed internally within a hollow package |
Aug. 30, 1994 |
| 5334874 |
Electronic device package |
Aug. 2, 1994 |
| 5331515 |
Module with leads from multiple chips shorted together only at edge contact locations |
Jul. 19, 1994 |
| 5326932 |
Semiconductor package |
Jul. 5, 1994 |
| 5325268 |
Interconnector for a multi-chip module or package |
Jun. 28, 1994 |
| 5313368 |
Electrical connections between printed circuit boards and integrated circuits surface mounted thereon |
May. 17, 1994 |
| 5309014 |
Transistor package |
May. 3, 1994 |
| 5306948 |
Semiconductor device and semiconductor module having auxiliary high power supplying terminals |
Apr. 26, 1994 |
| 5306949 |
Transistor module having external lead terminal with transient voltage suppression |
Apr. 26, 1994 |
| 5307240 |
Chiplid, multichip semiconductor package design concept |
Apr. 26, 1994 |
| 5297008 |
Polymeric composite lead wire and method for making same |
Mar. 22, 1994 |
| 5295045 |
Plastic-molded-type semiconductor device and producing method therefor |
Mar. 15, 1994 |
| 5285012 |
Low noise integrated circuit package |
Feb. 8, 1994 |
| H1267 |
Integrated circuit and lead frame assembly |
Dec. 7, 1993 |
| 5266833 |
Integrated circuit bus structure |
Nov. 30, 1993 |
| 5254871 |
Very large scale integrated circuit package, integrated circuit carrier and resultant interconnection board |
Oct. 19, 1993 |
| 5255156 |
Bonding pad interconnection on a multiple chip module having minimum channel width |
Oct. 19, 1993 |
| 5248901 |
Semiconductor devices and methods of assembly thereof |
Sep. 28, 1993 |
| 5248902 |
Surface mounting diode |
Sep. 28, 1993 |
| 5247134 |
Heat-resistant hermetic packages for electronic components |
Sep. 21, 1993 |
| 5243133 |
Ceramic chip carrier with lead frame or edge clip |
Sep. 7, 1993 |
| 5243496 |
Molded case integrated circuit with a dynamic impedance reducing device |
Sep. 7, 1993 |
| 5243497 |
Chip on board assembly |
Sep. 7, 1993 |
| 5243498 |
Multi-chip semiconductor module and method for making and testing |
Sep. 7, 1993 |
| 5237203 |
Multilayer overlay interconnect for high-density packaging of circuit elements |
Aug. 17, 1993 |
| 5233504 |
Noncollapsing multisolder interconnection |
Aug. 3, 1993 |
| 5216279 |
Power semiconductor device suitable for automation of production |
Jun. 1, 1993 |
| 5202578 |
Module-type semiconductor device of high power capacity |
Apr. 13, 1993 |
| 5166773 |
Hermetic package and packaged semiconductor chip having closely spaced leads extending through the package lid |
Nov. 24, 1992 |
| 5159433 |
Hybrid integrated circuit device having a particular casing structure |
Oct. 27, 1992 |
| 5159434 |
Semiconductor device having a particular chip pad structure |
Oct. 27, 1992 |
| 5151118 |
Method for producing a package-type semiconductor assembly |
Sep. 29, 1992 |
| 5151559 |
Planarized thin film surface covered wire bonded semiconductor package |
Sep. 29, 1992 |
| 5151774 |
Portable semiconductor data storage device with disconnectable ground connection |
Sep. 29, 1992 |
| 5133452 |
IC package storage container |
Jul. 28, 1992 |
| 5108950 |
Method for forming a bump electrode for a semiconductor device |
Apr. 28, 1992 |
| 5107328 |
Packaging means for a semiconductor die having particular shelf structure |
Apr. 21, 1992 |
| 5097318 |
Semiconductor package and computer using it |
Mar. 17, 1992 |
| 5095360 |
Ceramic chip-resistant chamfered integrated circuit package |
Mar. 10, 1992 |
| 5083186 |
Semiconductor device lead frame with rounded edges |
Jan. 21, 1992 |
| 5057648 |
High voltage hybrid package |
Oct. 15, 1991 |
| 5053852 |
Molded hybrid IC package and lead frame therefore |
Oct. 1, 1991 |
| 5023702 |
Semiconductor device, method of manufacturing the same, and apparatus for carrying out the method |
Jun. 11, 1991 |
| 5016086 |
IC card |
May. 14, 1991 |
| 5014114 |
High speed, high density semiconductor memory package with chip level repairability |
May. 7, 1991 |
| 5001829 |
Method for connecting a leadless chip carrier to a substrate |
Mar. 26, 1991 |
| 4994895 |
Hybrid integrated circuit package structure |
Feb. 19, 1991 |
| 4994902 |
Semiconductor devices and electronic system incorporating them |
Feb. 19, 1991 |
| 4992851 |
Characteristic impedance-correct chip carrier for microwave semiconductor components |
Feb. 12, 1991 |
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