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Class Information
Number: 257/690
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With contact or lead
Description: Subject matter wherein the device is provided with a contact or lead, in addition to or as part of the package or housing.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 5504373 |
Semiconductor memory module |
Apr. 2, 1996 |
| 5502333 |
Semiconductor stack structures and fabrication/sparing methods utilizing programmable spare circuit |
Mar. 26, 1996 |
| 5498903 |
Surface mountable integrated circuit package with integrated battery mount |
Mar. 12, 1996 |
| 5479318 |
Bus communication system for stacked high density integrated circuit packages with trifurcated distal lead ends |
Dec. 26, 1995 |
| 5477083 |
Chip carrier for enabling production of high performance microwave semiconductor device by disposing semiconductor chip thereon |
Dec. 19, 1995 |
| 5475236 |
Semiconductor chip for mounting on a semiconductor package substrate by a flip-clip process |
Dec. 12, 1995 |
| 5475260 |
Electronic read-only module |
Dec. 12, 1995 |
| 5473193 |
Package for parallel subelement semiconductor devices |
Dec. 5, 1995 |
| 5473196 |
Semiconductor memory component comprising stacked memory modules |
Dec. 5, 1995 |
| 5471368 |
Module having vertical peripheral edge connection |
Nov. 28, 1995 |
| 5463249 |
Electronic circuit system unit with wiring substrate |
Oct. 31, 1995 |
| 5461197 |
Electronic device having a chip with an external bump terminal equal or smaller than a via hole on a board |
Oct. 24, 1995 |
| 5461544 |
Structure and method for connecting leads from multiple chips |
Oct. 24, 1995 |
| 5459102 |
Method of electroplating lead pins of integrated circuit package |
Oct. 17, 1995 |
| 5457340 |
Leadframe with power and ground planes |
Oct. 10, 1995 |
| 5455455 |
Methods for producing packaged integrated circuit devices and packaged integrated circuit devices produced thereby |
Oct. 3, 1995 |
| 5455740 |
Bus communication system for stacked high density integrated circuit packages |
Oct. 3, 1995 |
| 5455745 |
Coated bonding wires in high lead count packages |
Oct. 3, 1995 |
| 5452183 |
Chip carrier system |
Sep. 19, 1995 |
| 5444295 |
Linear dual switch module |
Aug. 22, 1995 |
| 5442231 |
Semiconductor device |
Aug. 15, 1995 |
| 5440451 |
Memory Assembly |
Aug. 8, 1995 |
| 5440452 |
Surface mount components and semifinished products thereof |
Aug. 8, 1995 |
| 5434357 |
Reduced semiconductor size package |
Jul. 18, 1995 |
| 5434449 |
Semiconductor device in a single package with high wiring density and a heat sink |
Jul. 18, 1995 |
| 5434450 |
PGA package type semiconductor device having leads to be supplied with power source potential |
Jul. 18, 1995 |
| 5432678 |
High power dissipation vertical mounted package for surface mount application |
Jul. 11, 1995 |
| 5430326 |
Semiconductor device for mounting on a printed wiring board |
Jul. 4, 1995 |
| 5428505 |
Printed circuit board |
Jun. 27, 1995 |
| 5424579 |
Semiconductor device having low floating inductance |
Jun. 13, 1995 |
| 5414298 |
Semiconductor chip assemblies and components with pressure contact |
May. 9, 1995 |
| 5408128 |
High power semiconductor device module with low thermal resistance and simplified manufacturing |
Apr. 18, 1995 |
| 5399809 |
Multi-layer lead frame for a semiconductor device |
Mar. 21, 1995 |
| 5398166 |
Electronic component and mounting structure thereof |
Mar. 14, 1995 |
| 5394298 |
Semiconductor devices |
Feb. 28, 1995 |
| 5394303 |
Semiconductor device |
Feb. 28, 1995 |
| 5391917 |
Multiprocessor module packaging |
Feb. 21, 1995 |
| 5389819 |
Socket for an IC carrier having a flexible wiring sheet superimposed over an IC body and an elastic backup member elastically pressing the flexible wiring sheet into contact with the IC body |
Feb. 14, 1995 |
| 5387814 |
Integrated circuit with supports for mounting an electrical component |
Feb. 7, 1995 |
| 5388029 |
Semiconductor chip carrier capable of stably mounting a semiconductor chip |
Feb. 7, 1995 |
| 5386142 |
Semiconductor structures having environmentally isolated elements and method for making the same |
Jan. 31, 1995 |
| 5384484 |
Electronic read-only memory module |
Jan. 24, 1995 |
| 5381038 |
Semiconductor device having passivation protrusions defining electrical bonding area |
Jan. 10, 1995 |
| 5379188 |
Arrangement for mounting an integrated circuit chip carrier on a printed circuit board |
Jan. 3, 1995 |
| 5373420 |
Chip carrier for fastening a chip to a printed circuit board |
Dec. 13, 1994 |
| 5367124 |
Compliant lead for surface mounting a chip package to a substrate |
Nov. 22, 1994 |
| 5367196 |
Molded plastic semiconductor package including an aluminum alloy heat spreader |
Nov. 22, 1994 |
| 5362986 |
Vertical chip mount memory package with packaging substrate and memory chip pairs |
Nov. 8, 1994 |
| 5360993 |
Cooling unit capable of speedily cooling an integrated circuit chip |
Nov. 1, 1994 |
| 5347160 |
Power semiconductor integrated circuit package |
Sep. 13, 1994 |
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