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Class Information
Number: 257/690
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With contact or lead
Description: Subject matter wherein the device is provided with a contact or lead, in addition to or as part of the package or housing.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7368809 |
Pillar grid array package |
May. 6, 2008 |
| 7368803 |
System and method for protecting microelectromechanical systems array using back-plate with non-flat portion |
May. 6, 2008 |
| 7364941 |
Circuit device manufacturing method |
Apr. 29, 2008 |
| 7361997 |
Device package, a printed wiring board, and an electronic apparatus with efficiently spaced bottom electrodes including intervals between bottom electrodes of different lengths |
Apr. 22, 2008 |
| 7361983 |
Semiconductor device and semiconductor assembly module with a gap-controlling lead structure |
Apr. 22, 2008 |
| 7361935 |
Semiconductor device, LED print head, that uses the semiconductor, and image forming apparatus that uses the LED print head |
Apr. 22, 2008 |
| 7361880 |
Digital camera module for detachably mounting with flex printed circuit board |
Apr. 22, 2008 |
| 7352054 |
Semiconductor device having conducting portion of upper and lower conductive layers |
Apr. 1, 2008 |
| 7348666 |
Chip-to-chip trench circuit structure |
Mar. 25, 2008 |
| 7348661 |
Array capacitor apparatuses to filter input/output signal |
Mar. 25, 2008 |
| 7345362 |
Electronic component and method for manufacturing the same |
Mar. 18, 2008 |
| 7342318 |
Semiconductor package free of substrate and fabrication method thereof |
Mar. 11, 2008 |
| 7342262 |
Split-gate power module for suppressing oscillation therein |
Mar. 11, 2008 |
| 7339265 |
Capacitance type semiconductor sensor |
Mar. 4, 2008 |
| 7335977 |
Semiconductor chip mounting arrangement |
Feb. 26, 2008 |
| 7335976 |
Crosstalk reduction in electrical interconnects using differential signaling |
Feb. 26, 2008 |
| 7335951 |
Semiconductor device and method for manufacturing the same |
Feb. 26, 2008 |
| 7332817 |
Die and die-package interface metallization and bump design and arrangement |
Feb. 19, 2008 |
| 7332814 |
Bondwire utilized for coulomb counting and safety circuits |
Feb. 19, 2008 |
| 7332806 |
Thin, thermally enhanced molded package with leadframe having protruding region |
Feb. 19, 2008 |
| 7332802 |
Package for semiconductor light emitting element and semiconductor light emitting device |
Feb. 19, 2008 |
| 7332757 |
MOSFET package |
Feb. 19, 2008 |
| 7327018 |
Chip package structure, package substrate and manufacturing method thereof |
Feb. 5, 2008 |
| 7323776 |
Elevated heat dissipating device |
Jan. 29, 2008 |
| 7319599 |
Module incorporating a capacitor, method for manufacturing the same, and capacitor used therefor |
Jan. 15, 2008 |
| 7317245 |
Method for manufacturing a semiconductor device substrate |
Jan. 8, 2008 |
| 7317232 |
MEM switching device |
Jan. 8, 2008 |
| 7312528 |
Semiconductor device having antenna connection electrodes |
Dec. 25, 2007 |
| 7309915 |
Semiconductor chip having pads with plural junctions for different assembly methods |
Dec. 18, 2007 |
| 7307341 |
Integrated packaged having magnetic components |
Dec. 11, 2007 |
| RE39932 |
Semiconductor interconnect formed over an insulation and having moisture resistant material |
Dec. 4, 2007 |
| 7295453 |
Semiconductor device |
Nov. 13, 2007 |
| 7291927 |
Dual chips stacked packaging structure |
Nov. 6, 2007 |
| 7291908 |
Quad flat no-lead package structure and manufacturing method thereof |
Nov. 6, 2007 |
| 7291900 |
Lead frame-based semiconductor device packages incorporating at least one land grid array package |
Nov. 6, 2007 |
| 7291896 |
Voltage droop suppressing active interposer |
Nov. 6, 2007 |
| 7288838 |
Circuit board for mounting a semiconductor chip and manufacturing method thereof |
Oct. 30, 2007 |
| 7285849 |
Semiconductor die package using leadframe and clip and method of manufacturing |
Oct. 23, 2007 |
| 7285847 |
Chip stack package, connecting board, and method of connecting chips |
Oct. 23, 2007 |
| 7282796 |
Electronic assembly having a more dense arrangement of contacts that allows for routing of traces to the contacts |
Oct. 16, 2007 |
| 7282795 |
Modifying a semiconductor device to provide electrical parameter monitoring |
Oct. 16, 2007 |
| 7282790 |
Planar array contact memory cards |
Oct. 16, 2007 |
| 7279787 |
Microelectronic complex having clustered conductive members |
Oct. 9, 2007 |
| 7279780 |
Quad flat no-lead (QFN) grid array package, method of making and memory module and computer system including same |
Oct. 9, 2007 |
| 7276387 |
Castellation wafer level packaging of integrated circuit chips |
Oct. 2, 2007 |
| 7274098 |
Chip packaging structure without leadframe |
Sep. 25, 2007 |
| 7274092 |
Semiconductor component and method of assembling the same |
Sep. 25, 2007 |
| 7271489 |
Post passivation interconnection schemes on top of the IC chips |
Sep. 18, 2007 |
| 7268421 |
Semiconductor chip assembly with welded metal pillar that includes enlarged ball bond |
Sep. 11, 2007 |
| 7265440 |
Methods and apparatus for packaging integrated circuit devices |
Sep. 4, 2007 |
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