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Class Information
Number: 257/690
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With contact or lead
Description: Subject matter wherein the device is provided with a contact or lead, in addition to or as part of the package or housing.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 5672910 |
Semiconductor device and semiconductor module |
Sep. 30, 1997 |
| 5668406 |
Semiconductor device having shielding structure made of electrically conductive paste |
Sep. 16, 1997 |
| 5656857 |
Semiconductor device with insulating resin layer and substrate having low sheet resistance |
Aug. 12, 1997 |
| 5650918 |
Semiconductor device capable of preventing occurrence of a shearing stress |
Jul. 22, 1997 |
| 5648680 |
Lead-on-chip semiconductor device |
Jul. 15, 1997 |
| 5644162 |
Semiconductor chip having chip metal layer and transfer metal layer composed of same metal, and corresponding electronic module |
Jul. 1, 1997 |
| 5644476 |
Flexible fastening member and object provided with such a fastening member, and support provided with both |
Jul. 1, 1997 |
| 5641995 |
Attachment of ceramic chip carriers to printed circuit boards |
Jun. 24, 1997 |
| 5637912 |
Three-dimensional monolithic electronic module having stacked planar arrays of integrated circuit chips |
Jun. 10, 1997 |
| 5637918 |
Semiconductor stack |
Jun. 10, 1997 |
| 5637919 |
Perimeter independent precision locating member |
Jun. 10, 1997 |
| 5635758 |
Film IC with connection terminals |
Jun. 3, 1997 |
| 5631498 |
Thin film metallization process for improved metal to substrate adhesion |
May. 20, 1997 |
| 5627406 |
Inverted chip bonded module with high packaging efficiency |
May. 6, 1997 |
| 5625235 |
Multichip integrated circuit module with crossed bonding wires |
Apr. 29, 1997 |
| 5621237 |
Semiconductor device |
Apr. 15, 1997 |
| 5619068 |
Externally bondable overmolded package arrangements |
Apr. 8, 1997 |
| 5619069 |
Bipolar device and production thereof |
Apr. 8, 1997 |
| 5616931 |
Semiconductor device |
Apr. 1, 1997 |
| 5616955 |
Power transistor module wiring structure |
Apr. 1, 1997 |
| 5610440 |
Semiconductor devide having improved junction construction between heat radiation plate and ceramic substrate |
Mar. 11, 1997 |
| 5606200 |
Resin sealed semiconductor device with improved structural integrity |
Feb. 25, 1997 |
| 5600178 |
Semiconductor package having interdigitated leads |
Feb. 4, 1997 |
| 5600179 |
Package for packaging a semiconductor device suitable for being connected to a connection object by soldering |
Feb. 4, 1997 |
| 5598036 |
Ball grid array having reduced mechanical stress |
Jan. 28, 1997 |
| 5596226 |
Semiconductor chip having a chip metal layer and a transfer metal and corresponding electronic module |
Jan. 21, 1997 |
| 5592025 |
Pad array semiconductor device |
Jan. 7, 1997 |
| 5587607 |
Semiconductor integrated circuit device having improvement arrangement of pads |
Dec. 24, 1996 |
| 5586009 |
Bus communication system for stacked high density integrated circuit packages |
Dec. 17, 1996 |
| 5583374 |
Semiconductor device having a reduced wiring area in and out of data path zone |
Dec. 10, 1996 |
| 5583380 |
Integrated circuit contacts with secured stringers |
Dec. 10, 1996 |
| 5581382 |
Liquid crystal display device having connection pads insulated by double layered anodic oxide material |
Dec. 3, 1996 |
| 5572069 |
Conductive epoxy grid array semiconductor packages |
Nov. 5, 1996 |
| 5569957 |
Low inductance conductor topography for MOSFET circuit |
Oct. 29, 1996 |
| 5566054 |
Outside-insulated electronic element of cubic chip type storable in a disk package |
Oct. 15, 1996 |
| 5563441 |
Lead frame assembly including a semiconductor device and a resistance wire |
Oct. 8, 1996 |
| 5559373 |
Hermetically sealed surface mount diode package |
Sep. 24, 1996 |
| 5557116 |
Semiconductor laser device and resin layer |
Sep. 17, 1996 |
| 5552632 |
Plate-shaped external storage device and method of producing the same |
Sep. 3, 1996 |
| 5541451 |
Packaged semiconductor device with external leads having anchor holes provided at polyamide/glass sealed regions |
Jul. 30, 1996 |
| 5539252 |
Fastener with onboard memory |
Jul. 23, 1996 |
| 5532906 |
Wiring substrate |
Jul. 2, 1996 |
| 5532910 |
Hybrid integrated circuit and process for producing same |
Jul. 2, 1996 |
| 5528463 |
Low profile sockets and modules for surface mountable applications |
Jun. 18, 1996 |
| 5523620 |
Coplanar linear dual switch module |
Jun. 4, 1996 |
| 5521425 |
Tape automated bonded (TAB) circuit |
May. 28, 1996 |
| 5519252 |
Power semiconductor device employing pin block connection arrangement for facilitated and economized manufacture |
May. 21, 1996 |
| 5519579 |
Method and apparatus for replacing directly attached chip |
May. 21, 1996 |
| 5512780 |
Inorganic chip-to-package interconnection circuit |
Apr. 30, 1996 |
| 5506447 |
Hybrid integrated circuit |
Apr. 9, 1996 |
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