 |
|
 |
| |
 |
|
Class Information
Number: 257/690
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With contact or lead
Description: Subject matter wherein the device is provided with a contact or lead, in addition to or as part of the package or housing.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 5877549 |
UFBGA package equipped with interface assembly including a photosoluble layer |
Mar. 2, 1999 |
| 5877941 |
IC card and method of fabricating the same |
Mar. 2, 1999 |
| 5869884 |
Semiconductor device having lead terminal on only one side of a package |
Feb. 9, 1999 |
| 5866941 |
Ultra thin, leadless and molded surface mount integrated circuit package |
Feb. 2, 1999 |
| 5866953 |
Packaged die on PCB with heat sink encapsulant |
Feb. 2, 1999 |
| 5861663 |
Column grid array or ball grid array pad on via |
Jan. 19, 1999 |
| 5861668 |
Semiconductor package |
Jan. 19, 1999 |
| 5859472 |
Curved lead configurations |
Jan. 12, 1999 |
| 5854512 |
High density leaded ball-grid array package |
Dec. 29, 1998 |
| 5852326 |
Face-up semiconductor chip assembly |
Dec. 22, 1998 |
| 5847449 |
Semiconductor device |
Dec. 8, 1998 |
| 5844307 |
Plastic molded IC package with leads having small flatness fluctuation |
Dec. 1, 1998 |
| 5841191 |
Ball grid array package employing raised metal contact rings |
Nov. 24, 1998 |
| 5834831 |
Semiconductor device with improved heat dissipation efficiency |
Nov. 10, 1998 |
| 5828126 |
Chip on board package with top and bottom terminals |
Oct. 27, 1998 |
| 5825082 |
Semiconductor device in which a first resin-encapsulated package is mounted on a second resin-encapsulated package |
Oct. 20, 1998 |
| 5825628 |
Electronic package with enhanced pad design |
Oct. 20, 1998 |
| 5822190 |
Card type memory device and a method for manufacturing the same |
Oct. 13, 1998 |
| 5814880 |
Thick film copper metallization for microwave power transistor packages |
Sep. 29, 1998 |
| 5812381 |
Lead frame and integrated circuit package using the lead frame |
Sep. 22, 1998 |
| 5808872 |
Semiconductor package and method of mounting the same on circuit board |
Sep. 15, 1998 |
| 5808877 |
Multichip package having exposed common pads |
Sep. 15, 1998 |
| 5804882 |
Semiconductor device having a semiconductor chip electrically connected to a wiring substrate |
Sep. 8, 1998 |
| 5793103 |
Insulated cube with exposed wire lead |
Aug. 11, 1998 |
| 5793105 |
Inverted chip bonded with high packaging efficiency |
Aug. 11, 1998 |
| 5793668 |
Method and apparatus for using parasitic capacitances of a printed circuit board as a temporary data storage medium working with a remote device |
Aug. 11, 1998 |
| 5783868 |
Extended bond pads with a plurality of perforations |
Jul. 21, 1998 |
| 5777265 |
Multilayer molded plastic package design |
Jul. 7, 1998 |
| 5777379 |
Semiconductor assemblies with reinforced peripheral regions |
Jul. 7, 1998 |
| 5767528 |
Semiconductor device including pad portion for testing |
Jun. 16, 1998 |
| 5767568 |
Semiconductor device |
Jun. 16, 1998 |
| 5767569 |
Tab tape and semiconductor chip mounted on tab tape |
Jun. 16, 1998 |
| 5763941 |
Connection component with releasable leads |
Jun. 9, 1998 |
| 5763944 |
Semiconductor device having a reduced wiring area in and out of data path zone |
Jun. 9, 1998 |
| 5760470 |
Multi-layer electrical interconnection structures |
Jun. 2, 1998 |
| 5761040 |
Semiconductor device |
Jun. 2, 1998 |
| 5757082 |
Semiconductor chips, devices incorporating same and method of making same |
May. 26, 1998 |
| 5753971 |
Power semiconductor module with terminal pins |
May. 19, 1998 |
| 5748658 |
Semiconductor laser device and optical pickup head |
May. 5, 1998 |
| 5744858 |
Semiconductor packaging technique yielding increased inner lead count for a given die-receiving area |
Apr. 28, 1998 |
| 5721450 |
Moisture relief for chip carriers |
Feb. 24, 1998 |
| 5714800 |
Integrated circuit assembly having a stepped interposer and method |
Feb. 3, 1998 |
| 5705853 |
Power semiconductor module |
Jan. 6, 1998 |
| 5703405 |
Integrated circuit chip formed from processing two opposing surfaces of a wafer |
Dec. 30, 1997 |
| 5700975 |
Semiconductor device |
Dec. 23, 1997 |
| 5701032 |
Integrated circuit package |
Dec. 23, 1997 |
| 5689135 |
Multi-chip device and method of fabrication employing leads over and under processes |
Nov. 18, 1997 |
| 5679976 |
Molded electric parts and method of manufacturing the same |
Oct. 21, 1997 |
| 5679977 |
Semiconductor chip assemblies, methods of making same and components for same |
Oct. 21, 1997 |
| 5677570 |
Semiconductor integrated circuit devices for high-speed or high frequency |
Oct. 14, 1997 |
|
|
|
 |
|
 |
|
| |
Randomly Featured Patents |
|
