| |
 |
|
Class Information
Number: 257/690
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With contact or lead
Description: Subject matter wherein the device is provided with a contact or lead, in addition to or as part of the package or housing.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6013945 |
Electronic module for data cards |
Jan. 11, 2000 |
| 6011302 |
Semiconductor device with reduced amount of sealing resin |
Jan. 4, 2000 |
| 6011306 |
Semiconductor device and method for fabricating same |
Jan. 4, 2000 |
| 6008534 |
Integrated circuit package having signal traces interposed between power and ground conductors in order to form stripline transmission lines |
Dec. 28, 1999 |
| 6005292 |
Lead-free interconnection for electronic devices |
Dec. 21, 1999 |
| 6002170 |
Chip carrier with embedded leads and chip package using same |
Dec. 14, 1999 |
| 5991185 |
Semiconductor memory |
Nov. 23, 1999 |
| 5982043 |
Semiconductor device having two or more bonding option pads |
Nov. 9, 1999 |
| 5982628 |
Circuit configuration having a smart card module and a coil connected thereto |
Nov. 9, 1999 |
| 5982629 |
Silicon semiconductor device,electrode structure therefor, and circuit board mounted therewith |
Nov. 9, 1999 |
| 5977614 |
Lead on chip type semiconductor integrated circuit device to avoid bonding wire short |
Nov. 2, 1999 |
| 5977623 |
Semiconductor package and socket thereof and methods of fabricating same |
Nov. 2, 1999 |
| 5977631 |
Semiconductor device including a semiconductor package with electromagnetic coupling slots |
Nov. 2, 1999 |
| 5973393 |
Apparatus and method for stackable molded lead frame ball grid array packaging of integrated circuits |
Oct. 26, 1999 |
| 5973394 |
Small contactor for test probes, chip packaging and the like |
Oct. 26, 1999 |
| 5973397 |
Semiconductor device and fabrication method which advantageously combine wire bonding and tab techniques to increase integrated circuit I/O pad density |
Oct. 26, 1999 |
| 5973935 |
Interdigitated leads-over-chip lead frame for supporting an integrated circuit die |
Oct. 26, 1999 |
| 5969410 |
Semiconductor IC device having chip support element and electrodes on the same surface |
Oct. 19, 1999 |
| 5969413 |
Semiconductor device having a tab chip on a tape carrier with lead wirings provided on the tape carrier used as external leads |
Oct. 19, 1999 |
| 5969426 |
Substrateless resin encapsulated semiconductor device |
Oct. 19, 1999 |
| 5959846 |
Modular surface mount circuit device and a manufacturing method thereof |
Sep. 28, 1999 |
| 5960262 |
Stitch bond enhancement for hard-to-bond materials |
Sep. 28, 1999 |
| 5955780 |
Contact converting structure of semiconductor chip and process for manufacturing semiconductor chip having said contact converting structure |
Sep. 21, 1999 |
| 5956232 |
Chip support arrangement and chip support for the manufacture of a chip casing |
Sep. 21, 1999 |
| 5956237 |
Primary printed wiring board |
Sep. 21, 1999 |
| 5952715 |
Chip type electronic part |
Sep. 14, 1999 |
| 5939780 |
Power supply circuit for a semiconductor integrated circuit |
Aug. 17, 1999 |
| 5936844 |
Memory system printed circuit board |
Aug. 10, 1999 |
| 5930602 |
Leadframe finger support |
Jul. 27, 1999 |
| 5926375 |
Surface mounting structure |
Jul. 20, 1999 |
| 5926380 |
Lead frame lattice and integrated package fabrication method applied thereto |
Jul. 20, 1999 |
| 5917234 |
Semiconductor device |
Jun. 29, 1999 |
| 5917238 |
Liquid crystal display driver |
Jun. 29, 1999 |
| 5915169 |
Semiconductor chip scale package and method of producing such |
Jun. 22, 1999 |
| 5903437 |
High density edge mounting of chips |
May. 11, 1999 |
| 5903440 |
Method of forming assemblies of circuit boards in different planes |
May. 11, 1999 |
| 5903443 |
Interdigitated leads-over-chip lead frame, device, and method for supporting an integrated circuit die |
May. 11, 1999 |
| 5901049 |
Two-tiered plug for two chip cards |
May. 4, 1999 |
| 5901050 |
Wired base plate and package for electronic parts |
May. 4, 1999 |
| 5898217 |
Semiconductor device including a substrate having clustered interconnects |
Apr. 27, 1999 |
| 5895965 |
Semiconductor device |
Apr. 20, 1999 |
| 5895966 |
Integrated circuit and supply decoupling capacitor therefor |
Apr. 20, 1999 |
| 5894171 |
Semiconductor integrated circuit having a grounding terminal |
Apr. 13, 1999 |
| 5891758 |
Semiconductor device and method for manufacturing semiconductor device |
Apr. 6, 1999 |
| 5892273 |
Semiconductor package integral with semiconductor chip |
Apr. 6, 1999 |
| 5892275 |
High performance power and ground edge connect IC package |
Apr. 6, 1999 |
| 5892288 |
Semiconductor integrated circuit device |
Apr. 6, 1999 |
| 5889333 |
Semiconductor device and method for manufacturing such |
Mar. 30, 1999 |
| 5883427 |
Semiconductor device power supply wiring structure |
Mar. 16, 1999 |
| 5877548 |
Terminal configuration in semiconductor IC device |
Mar. 2, 1999 |
|
|
|
