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Class Information
Number: 257/690
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With contact or lead
Description: Subject matter wherein the device is provided with a contact or lead, in addition to or as part of the package or housing.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6144091 |
Semiconductor device |
Nov. 7, 2000 |
| 6140583 |
Lead member with multiple conductive layers and specific grain size |
Oct. 31, 2000 |
| 6137158 |
Leadframe and leadframe assembly for parallel optical computer link |
Oct. 24, 2000 |
| 6137165 |
Hybrid package including a power MOSFET die and a control and protection circuit die with a smaller sense MOSFET |
Oct. 24, 2000 |
| RE36907 |
Leadframe with power and ground planes |
Oct. 10, 2000 |
| 6130459 |
Over-voltage protection device for integrated circuits |
Oct. 10, 2000 |
| 6130475 |
Clock distribution system for synchronous circuit assemblies |
Oct. 10, 2000 |
| 6121683 |
Electronic device and integrated circuit |
Sep. 19, 2000 |
| 6115254 |
Vertical surface mount apparatus with thermal carrier |
Sep. 5, 2000 |
| 6111306 |
Semiconductor device and method of producing the same and semiconductor device unit and method of producing the same |
Aug. 29, 2000 |
| 6104086 |
Semiconductor device having lead terminals bent in J-shape |
Aug. 15, 2000 |
| 6104087 |
Microelectronic assemblies with multiple leads |
Aug. 15, 2000 |
| 6104619 |
Tape carrier package and its fabrication method therefor |
Aug. 15, 2000 |
| 6097612 |
Radio frequency module and method for fabricating the radio frequency module |
Aug. 1, 2000 |
| 6091137 |
Semiconductor device substrate and method of manufacturing the same |
Jul. 18, 2000 |
| 6091139 |
Semiconductor device |
Jul. 18, 2000 |
| RE36773 |
Method for plating using nested plating buses and semiconductor device having the same |
Jul. 11, 2000 |
| 6087715 |
Semiconductor device, and manufacturing method of the same |
Jul. 11, 2000 |
| 6087723 |
Vertical surface mount assembly and methods |
Jul. 11, 2000 |
| 6088230 |
Procedure for producing a chip mounting board and chip-mounting board thus produced |
Jul. 11, 2000 |
| 6084295 |
Semiconductor device and circuit board used therein |
Jul. 4, 2000 |
| 6081031 |
Semiconductor package consisting of multiple conductive layers |
Jun. 27, 2000 |
| 6077727 |
Method for manufacturing lead frame |
Jun. 20, 2000 |
| 6078100 |
Utilization of die repattern layers for die internal connections |
Jun. 20, 2000 |
| 6078505 |
Circuit board assembly method |
Jun. 20, 2000 |
| 6078514 |
Semiconductor device and semiconductor system for high-speed data transfer |
Jun. 20, 2000 |
| 6075282 |
Leadframe for a semiconductor device and associated method |
Jun. 13, 2000 |
| 6075283 |
Downset lead frame for semiconductor packages |
Jun. 13, 2000 |
| 6075712 |
Flip-chip having electrical contact pads on the backside of the chip |
Jun. 13, 2000 |
| 6069408 |
Semiconductor device and method of manufacturing semiconductor device |
May. 30, 2000 |
| 6060768 |
Semiconductor device, method of manufacturing the semiconductor device, and method of manufacturing lead frame |
May. 9, 2000 |
| 6060775 |
Semiconductor device |
May. 9, 2000 |
| 6057601 |
Heat spreader with a placement recess and bottom saw-teeth for connection to ground planes on a thin two-sided single-core BGA substrate |
May. 2, 2000 |
| 6054753 |
Plastic-encapsulated semiconductor device equipped with LOC package structure |
Apr. 25, 2000 |
| 6054757 |
Semiconductor apparatus, circuit board and combination thereof |
Apr. 25, 2000 |
| 6054759 |
Semiconductor chip and package with heat dissipation |
Apr. 25, 2000 |
| 6052289 |
Interdigitated leads-over-chip lead frame for supporting an integrated circuit die |
Apr. 18, 2000 |
| 6047467 |
Printed circuit board layout to minimize the clock delay caused by mismatch in length of metal lines and enhance the thermal performance of microelectronics packages via conduction through the |
Apr. 11, 2000 |
| 6049466 |
Substrate with embedded member for improving solder joint strength |
Apr. 11, 2000 |
| 6043559 |
Integrated circuit package which contains two in plane voltage busses and a wrap around conductive strip that connects a bond finger to one of the busses |
Mar. 28, 2000 |
| 6040621 |
Semiconductor device and wiring body |
Mar. 21, 2000 |
| 6036173 |
Semiconductor element having a carrying device and a lead frame and a semiconductor chip connected thereto |
Mar. 14, 2000 |
| 6031280 |
Semiconductor device having resin encapsulated package structure |
Feb. 29, 2000 |
| 6031283 |
Integrated circuit package |
Feb. 29, 2000 |
| 6031728 |
Device and method for interconnection between two electronic devices |
Feb. 29, 2000 |
| 6028348 |
Low thermal impedance integrated circuit |
Feb. 22, 2000 |
| 6025642 |
Ultra high density integrated circuit packages |
Feb. 15, 2000 |
| 6026008 |
Electronic memory device, in particular for use in implantable medical appliances |
Feb. 15, 2000 |
| 6020627 |
Chip card and method of manufacturing a chip card |
Feb. 1, 2000 |
| 6020630 |
Tape automated bonding package for a semiconductor chip employing corner member cross-slots |
Feb. 1, 2000 |
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