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Class Information
Number: 257/690
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With contact or lead
Description: Subject matter wherein the device is provided with a contact or lead, in addition to or as part of the package or housing.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6252308 |
Packaged die PCB with heat sink encapsulant |
Jun. 26, 2001 |
| 6252760 |
Discrete silicon capacitor |
Jun. 26, 2001 |
| 6249045 |
Tented plated through-holes and method for fabrication thereof |
Jun. 19, 2001 |
| 6249046 |
Semiconductor device and method for manufacturing and mounting thereof, and circuit board mounted with the semiconductor device |
Jun. 19, 2001 |
| 6246112 |
Interleaved signal trace routing |
Jun. 12, 2001 |
| 6246113 |
Integrated circuit package architecture with improved electrostatic discharge protection |
Jun. 12, 2001 |
| 6239383 |
Ball-grid array IC packaging frame |
May. 29, 2001 |
| 6239489 |
Reinforcement of lead bonding in microelectronics packages |
May. 29, 2001 |
| 6236109 |
Multi-chip chip scale package |
May. 22, 2001 |
| 6232655 |
Semiconductor element having external connection terminals, method of manufacturing the semiconductor element, and semiconductor device equipped with the semiconductor element |
May. 15, 2001 |
| 6232656 |
Semiconductor interconnect formed over an insulation and having moisture resistant material |
May. 15, 2001 |
| 6232668 |
Semiconductor device of chip-on-chip structure and semiconductor chip for use therein |
May. 15, 2001 |
| 6229199 |
Packaged semiconductor device |
May. 8, 2001 |
| 6229206 |
Bonding pad test configuration |
May. 8, 2001 |
| 6229207 |
Organic pin grid array flip chip carrier package |
May. 8, 2001 |
| 6225558 |
Chip size semiconductor package and fabrication method thereof |
May. 1, 2001 |
| 6222259 |
Stack package and method of fabricating the same |
Apr. 24, 2001 |
| 6218736 |
Circuit board and semiconductor device, and method of manufacturing the same |
Apr. 17, 2001 |
| 6215171 |
IC module |
Apr. 10, 2001 |
| 6215191 |
Compliant lead structures for microelectronic devices |
Apr. 10, 2001 |
| 6211463 |
Electronic circuit package with diamond film heat conductor |
Apr. 3, 2001 |
| 6208021 |
Semiconductor device, manufacturing method thereof and aggregate type semiconductor device |
Mar. 27, 2001 |
| 6208023 |
Lead frame for use with an RF powered semiconductor |
Mar. 27, 2001 |
| 6205032 |
Low temperature co-fired ceramic with improved registration |
Mar. 20, 2001 |
| 6201295 |
Plate-shaped external storage device and method of producing the same |
Mar. 13, 2001 |
| 6201297 |
Semiconductor device |
Mar. 13, 2001 |
| RE37082 |
RF transistor package with nickel oxide barrier |
Mar. 6, 2001 |
| 6198166 |
Power semiconductor mounting package containing ball grid array |
Mar. 6, 2001 |
| 6194291 |
Microelectronic assemblies with multiple leads |
Feb. 27, 2001 |
| 6194786 |
Integrated circuit package providing bond wire clearance over intervening conductive regions |
Feb. 27, 2001 |
| 6191368 |
Flexible, releasable strip leads |
Feb. 20, 2001 |
| 6191434 |
Semiconductor device measuring socket having socket position adjustment member |
Feb. 20, 2001 |
| 6184060 |
Integrated circuits and methods for their fabrication |
Feb. 6, 2001 |
| 6184576 |
Packaging and interconnection of contact structure |
Feb. 6, 2001 |
| 6184589 |
Constraining ring for use in electronic packaging |
Feb. 6, 2001 |
| 6181003 |
Semiconductor device packaged in plastic package |
Jan. 30, 2001 |
| 6181005 |
Semiconductor device wiring structure |
Jan. 30, 2001 |
| 6177720 |
Method of manufacturing a semiconductor device with a pair of radiating terminals and a plurality of lead terminals formed from a single lead frame |
Jan. 23, 2001 |
| 6177722 |
Leadless array package |
Jan. 23, 2001 |
| 6175149 |
Mounting multiple semiconductor dies in a package |
Jan. 16, 2001 |
| 6175151 |
Film carrier tape, semiconductor assembly, semiconductor device, and method of manufacturing the same, mounted board, and electronic instrument |
Jan. 16, 2001 |
| 6175152 |
Semiconductor device |
Jan. 16, 2001 |
| 6169331 |
Apparatus for electrically coupling bond pads of a microelectronic device |
Jan. 2, 2001 |
| 6165818 |
Method of manufacturing a semiconductor device with a pair of radiating terminals and a plurality of lead terminals formed from a single lead frame |
Dec. 26, 2000 |
| 6157075 |
Semiconductor assemblies with reinforced peripheral regions |
Dec. 5, 2000 |
| 6153928 |
Substrate for semiconductor package, fabrication method thereof, and stacked-type semiconductor package using the substrate |
Nov. 28, 2000 |
| 6150262 |
Silver-gold wire for wire bonding |
Nov. 21, 2000 |
| 6150714 |
Current sense element incorporated into integrated circuit package lead frame |
Nov. 21, 2000 |
| 6147398 |
Semiconductor device package |
Nov. 14, 2000 |
| 6144090 |
Ball grid array package having electrodes on peripheral side surfaces of a package board |
Nov. 7, 2000 |
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