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Class Information
Number: 257/690
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With contact or lead
Description: Subject matter wherein the device is provided with a contact or lead, in addition to or as part of the package or housing.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6329708 |
Micro ball grid array semiconductor device and semiconductor module |
Dec. 11, 2001 |
| 6329709 |
Interconnections for a semiconductor device |
Dec. 11, 2001 |
| 6329712 |
High density flip chip memory arrays |
Dec. 11, 2001 |
| 6329714 |
Hybrid S.C. devices and method of manufacture thereof |
Dec. 11, 2001 |
| 6329722 |
Bonding pads for integrated circuits having copper interconnect metallization |
Dec. 11, 2001 |
| 6330165 |
Semiconductor device |
Dec. 11, 2001 |
| 6323545 |
Semiconductor device |
Nov. 27, 2001 |
| 6323735 |
Method and apparatus for synthesizing high-frequency signals utilizing on-package oscillator circuit inductors |
Nov. 27, 2001 |
| 6320247 |
Unit type clip lead terminal, clip lead terminal connecting method, lead terminal connecting board, and method of producing board with lead terminals |
Nov. 20, 2001 |
| 6320255 |
Rerouted semiconductor device and method of fabrication |
Nov. 20, 2001 |
| 6320258 |
Semiconductor device having alternating electrically insulative coated leads |
Nov. 20, 2001 |
| 6320268 |
Power semiconductor module |
Nov. 20, 2001 |
| 6313402 |
Stress relief bend useful in an integrated circuit redistribution patch |
Nov. 6, 2001 |
| 6313523 |
IC die power connection using canted coil spring |
Nov. 6, 2001 |
| 6313524 |
Chip module with a plurality of flat contact elements mountable on either an external printed circuit board or an external circuit board substrate |
Nov. 6, 2001 |
| 6313541 |
Bone-pad with pad edge strengthening structure |
Nov. 6, 2001 |
| 6310390 |
BGA package and method of fabrication |
Oct. 30, 2001 |
| 6310398 |
Routable high-density interfaces for integrated circuit devices |
Oct. 30, 2001 |
| 6307253 |
Lead frame and semiconductor device made by using it |
Oct. 23, 2001 |
| 6307261 |
Method for the manufacturing of a semiconductor device which comprises at least one chip and corresponding device |
Oct. 23, 2001 |
| 6303875 |
IC packages replaceable by IC packages having a smaller pin count and circuit device using the same |
Oct. 16, 2001 |
| 6303876 |
LSI package structure |
Oct. 16, 2001 |
| 6303974 |
Semiconductor chips encapsulated within a preformed sub-assembly |
Oct. 16, 2001 |
| 6303988 |
Wafer scale burn-in socket |
Oct. 16, 2001 |
| 6300678 |
I/O pin having solder dam for connecting substrates |
Oct. 9, 2001 |
| 6300685 |
Semiconductor package |
Oct. 9, 2001 |
| 6301122 |
Radio frequency module with thermally and electrically coupled metal film on insulating substrate |
Oct. 9, 2001 |
| 6297964 |
Semiconductor device, method of fabricating the same film carrier tape, circuit board, and electronic apparatus |
Oct. 2, 2001 |
| 6294100 |
Exposed die leadless plastic chip carrier |
Sep. 25, 2001 |
| 6291898 |
Ball grid array package |
Sep. 18, 2001 |
| 6288414 |
Liquid crystal display and a double layered metal contact |
Sep. 11, 2001 |
| 6285080 |
Planar metallized substrate with embedded camber control material and method thereof |
Sep. 4, 2001 |
| 6285558 |
Microprocessor subsystem module for PCB bottom-side BGA installation |
Sep. 4, 2001 |
| 6281090 |
Method for the manufacture of printed circuit boards with plated resistors |
Aug. 28, 2001 |
| 6281577 |
Chips arranged in plurality of planes and electrically connected to one another |
Aug. 28, 2001 |
| 6281579 |
Insert-molded leadframe to optimize interface between powertrain and driver board |
Aug. 28, 2001 |
| 6281588 |
Lead configurations |
Aug. 28, 2001 |
| 6278178 |
Integrated device package and fabrication methods thereof |
Aug. 21, 2001 |
| 6274926 |
Plate-shaped external storage device and method of producing the same |
Aug. 14, 2001 |
| 6271479 |
Method and apparatus for connecting an electric component to a printed circuit board |
Aug. 7, 2001 |
| 6271586 |
Integrated circuit chip and method for fabricating the same |
Aug. 7, 2001 |
| 6268643 |
Lead frame device for delivering electrical power to a semiconductor die |
Jul. 31, 2001 |
| 6268650 |
Semiconductor device, ball grid array connection system, and method of making |
Jul. 31, 2001 |
| 6265245 |
Compliant interconnect for testing a semiconductor die |
Jul. 24, 2001 |
| 6265759 |
Laterally situated stress/strain relieving lead for a semiconductor chip package |
Jul. 24, 2001 |
| 6265763 |
Multi-chip integrated circuit package structure for central pad chip |
Jul. 24, 2001 |
| 6262474 |
Semiconductor device |
Jul. 17, 2001 |
| 6259155 |
Polymer enhanced column grid array |
Jul. 10, 2001 |
| 6255740 |
Semiconductor device having a lead portion with outer connecting terminals |
Jul. 3, 2001 |
| 6252301 |
Compliant semiconductor chip assemblies and methods of making same |
Jun. 26, 2001 |
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