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Class Information
Number: 257/690
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With contact or lead
Description: Subject matter wherein the device is provided with a contact or lead, in addition to or as part of the package or housing.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6429509 |
Integrated circuit with improved interconnect structure and process for making same |
Aug. 6, 2002 |
| 6429510 |
Liquid damping of high frequency bond wire vibration |
Aug. 6, 2002 |
| 6429514 |
Integrated circuit chip and method for fabricating the same |
Aug. 6, 2002 |
| 6426550 |
Interleaved signal trace routing |
Jul. 30, 2002 |
| 6424025 |
Cross grid array package structure and method of manufacture |
Jul. 23, 2002 |
| 6424028 |
Semiconductor devices configured to tolerate connection misalignment |
Jul. 23, 2002 |
| 6420661 |
Connector element for connecting microelectronic elements |
Jul. 16, 2002 |
| 6417562 |
Silicon verification with embedded testbenches |
Jul. 9, 2002 |
| 6414374 |
Semiconductor device including edge bond pads and methods |
Jul. 2, 2002 |
| 6414385 |
Quad flat non-lead package of semiconductor |
Jul. 2, 2002 |
| 6410987 |
Semiconductor device and a method of manufacturing the same and an electronic device |
Jun. 25, 2002 |
| 6410989 |
Chip-scale package |
Jun. 25, 2002 |
| 6407344 |
Multilayer circuit board |
Jun. 18, 2002 |
| 6407449 |
Pin layout of semiconductor integrated circuits including dual band amplifier and receiving mixer |
Jun. 18, 2002 |
| 6404045 |
IGBT and free-wheeling diode combination |
Jun. 11, 2002 |
| 6404046 |
Module of stacked integrated circuit packages including an interposer |
Jun. 11, 2002 |
| 6404065 |
Electrically isolated power semiconductor package |
Jun. 11, 2002 |
| 6400004 |
Leadless semiconductor package |
Jun. 4, 2002 |
| 6396139 |
Semiconductor package structure with exposed die pad |
May. 28, 2002 |
| 6396154 |
Semiconductor device |
May. 28, 2002 |
| 6392287 |
Semiconductor package and fabricating method thereof |
May. 21, 2002 |
| 6392293 |
Semiconductor package with sloped outer leads |
May. 21, 2002 |
| 6392294 |
Semiconductor device with stable protection coating |
May. 21, 2002 |
| 6392295 |
Semiconductor device |
May. 21, 2002 |
| 6392305 |
Chip scale package of semiconductor |
May. 21, 2002 |
| 6387730 |
Hybrid S.C. devices and method of manufacture thereof |
May. 14, 2002 |
| 6388312 |
Repairable multi-chip package |
May. 14, 2002 |
| 6388336 |
Multichip semiconductor assembly |
May. 14, 2002 |
| 6384472 |
Leadless image sensor package structure and method for making the same |
May. 7, 2002 |
| 6384474 |
Housing for receiving a planar power transistor |
May. 7, 2002 |
| 6384475 |
Lead formation using grids |
May. 7, 2002 |
| 6379997 |
Semiconductor device and method of producing the same and semiconductor device unit and method of producing the same |
Apr. 30, 2002 |
| 6380633 |
Pattern layout structure in substrate |
Apr. 30, 2002 |
| 6376905 |
Semiconductor package |
Apr. 23, 2002 |
| 6373140 |
Semiconductor device |
Apr. 16, 2002 |
| 6369441 |
Method of producing a semiconductor chip having an underplate metal layer |
Apr. 9, 2002 |
| 6369447 |
Plastic-packaged semiconductor device including a plurality of chips |
Apr. 9, 2002 |
| 6365424 |
Sensor device and method of producing a sensor device |
Apr. 2, 2002 |
| 6362531 |
Recessed bond pad |
Mar. 26, 2002 |
| 6353258 |
Semiconductor module |
Mar. 5, 2002 |
| 6353267 |
Semiconductor device having first and second sealing resins |
Mar. 5, 2002 |
| 6351025 |
Semiconductor chip having an underplate metal layer |
Feb. 26, 2002 |
| 6351030 |
Electronic package utilizing protective coating |
Feb. 26, 2002 |
| 6344683 |
Stacked semiconductor package with flexible tape |
Feb. 5, 2002 |
| 6344684 |
Multi-layered pin grid array interposer apparatus and method for testing semiconductor devices having a non-pin grid array footprint |
Feb. 5, 2002 |
| 6344696 |
Chip size package semiconductor device and method of forming the same |
Feb. 5, 2002 |
| 6340841 |
Build-up board package for semiconductor devices |
Jan. 22, 2002 |
| 6339255 |
Stacked semiconductor chips in a single semiconductor package |
Jan. 15, 2002 |
| 6335564 |
Single Paddle having a semiconductor device and a passive electronic component |
Jan. 1, 2002 |
| 6331736 |
Utilization of die repattern layers for die internal connections |
Dec. 18, 2001 |
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