| |
 |
|
Class Information
Number: 257/690
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With contact or lead
Description: Subject matter wherein the device is provided with a contact or lead, in addition to or as part of the package or housing.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6509640 |
Integral capacitor using embedded enclosure for effective electromagnetic radiation reduction |
Jan. 21, 2003 |
| 6509645 |
Spherical semiconductor device and method for fabricating the same |
Jan. 21, 2003 |
| 6507095 |
Wiring board, connected board and semiconductor device, method of manufacture thereof, circuit board, and electronic instrument |
Jan. 14, 2003 |
| 6507264 |
Integral fuse for use in semiconductor packages |
Jan. 14, 2003 |
| 6500528 |
Enhancements in sheet processing and lead formation |
Dec. 31, 2002 |
| 6501161 |
Semiconductor package having increased solder joint strength |
Dec. 31, 2002 |
| 6501176 |
Deflectable interconnect |
Dec. 31, 2002 |
| 6501183 |
Semiconductor device and a method of manufacturing the same and an electronic device |
Dec. 31, 2002 |
| 6498305 |
Interconnect mechanics for electromagnetic coupler |
Dec. 24, 2002 |
| 6495909 |
Low-pin-count chip package and manufacturing method thereof |
Dec. 17, 2002 |
| 6492200 |
Semiconductor chip package and fabrication method thereof |
Dec. 10, 2002 |
| 6489672 |
Integrated circuit package architecture with improved electrostatic discharge protection |
Dec. 3, 2002 |
| 6489673 |
Digital signal processor/known good die packaging using rerouted existing package for test and burn-in carriers |
Dec. 3, 2002 |
| 6486547 |
Microelectronic assembly incorporating lead regions defined by gaps in a polymeric sheet |
Nov. 26, 2002 |
| 6486548 |
Semiconductor module and power converting apparatus using the module |
Nov. 26, 2002 |
| 6483178 |
Semiconductor device package structure |
Nov. 19, 2002 |
| 6483181 |
Multi-chip package |
Nov. 19, 2002 |
| 6483182 |
Integrated-circuit case |
Nov. 19, 2002 |
| 6483190 |
Semiconductor chip element, semiconductor chip element mounting structure, semiconductor chip element mounting device and mounting method |
Nov. 19, 2002 |
| 6479839 |
III-V compounds semiconductor device with an AlxByInzGa1-x-y-zN non continuous quantum dot layer |
Nov. 12, 2002 |
| 6479888 |
Semiconductor device and a method of manufacturing the same |
Nov. 12, 2002 |
| 6479893 |
Ball-less clip bonding |
Nov. 12, 2002 |
| 6476425 |
Master-slice system semiconductor integrated circuit and design method thereof |
Nov. 5, 2002 |
| 6476478 |
Cavity semiconductor package with exposed leads and die pad |
Nov. 5, 2002 |
| 6476480 |
Press-fit IC power package and method therefor |
Nov. 5, 2002 |
| 6472251 |
Method for integrated circuit packaging |
Oct. 29, 2002 |
| 6468638 |
Web process interconnect in electronic assemblies |
Oct. 22, 2002 |
| 6469260 |
Wiring boards, semiconductor devices and their production processes |
Oct. 22, 2002 |
| 6469396 |
Integrated circuit chip having input/output terminals for testing and operation |
Oct. 22, 2002 |
| 6469909 |
MEMS package with flexible circuit interconnect |
Oct. 22, 2002 |
| 6465878 |
Compliant microelectronic assemblies |
Oct. 15, 2002 |
| 6465896 |
Coils integrated in IC-package |
Oct. 15, 2002 |
| 6462408 |
Contact member stacking system and method |
Oct. 8, 2002 |
| 6459146 |
Semiconductor apparatus |
Oct. 1, 2002 |
| 6459147 |
Attaching semiconductor dies to substrates with conductive straps |
Oct. 1, 2002 |
| 6459157 |
Semiconductor device and double-sided multi-chip package |
Oct. 1, 2002 |
| 6455929 |
Embedded type package of power semiconductor device |
Sep. 24, 2002 |
| 6452254 |
Optical package with dual interconnect capability |
Sep. 17, 2002 |
| 6452808 |
Electronics module having power components, and a method of manufacture |
Sep. 17, 2002 |
| 6451626 |
Three-dimensional stacked semiconductor package |
Sep. 17, 2002 |
| 6448634 |
Tape carrier, semiconductor assembly, semiconductor device and electronic instrument |
Sep. 10, 2002 |
| 6448639 |
Substrate having specific pad distribution |
Sep. 10, 2002 |
| 6444905 |
Semiconductor device |
Sep. 3, 2002 |
| 6445075 |
Semiconductor module package substrate |
Sep. 3, 2002 |
| 6441475 |
Chip scale surface mount package for semiconductor device and process of fabricating the same |
Aug. 27, 2002 |
| 6441478 |
Semiconductor package having metal-pattern bonding and method of fabricating the same |
Aug. 27, 2002 |
| 6432747 |
Repair method for broken or missing microcircuit package terminal lead |
Aug. 13, 2002 |
| 6433394 |
Over-voltage protection device for integrated circuits |
Aug. 13, 2002 |
| 6433418 |
Apparatus for a vertically accumulable semiconductor device with external leads secured by a positioning mechanism |
Aug. 13, 2002 |
| 6434008 |
Semiconductor device |
Aug. 13, 2002 |
|
|
|
