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Class Information
Number: 257/690
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With contact or lead
Description: Subject matter wherein the device is provided with a contact or lead, in addition to or as part of the package or housing.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6590279 |
Dual-chip integrated circuit package and method of manufacturing the same |
Jul. 8, 2003 |
| 6590283 |
Method for hermetic leadless device interconnect using a submount |
Jul. 8, 2003 |
| 6591410 |
Six-to-one signal/power ratio bump and trace pattern for flip chip design |
Jul. 8, 2003 |
| 6586824 |
Reduced thickness packaged electronic device |
Jul. 1, 2003 |
| 6585904 |
Method for the manufacture of printed circuit boards with plated resistors |
Jul. 1, 2003 |
| 6586273 |
Semiconductor device manufacturing method having a step of applying a copper foil on a substrate as a part of a wiring connecting an electrode pad to a mounting terminal |
Jul. 1, 2003 |
| 6580164 |
Semiconductor device and method of manufacturing same |
Jun. 17, 2003 |
| 6580175 |
Semiconductor layout structure for a conductive layer and contact hole |
Jun. 17, 2003 |
| 6576984 |
Semiconductor apparatus and electronic system |
Jun. 10, 2003 |
| 6576994 |
Semiconductor device |
Jun. 10, 2003 |
| 6576998 |
Thin semiconductor package with semiconductor chip and electronic discrete device |
Jun. 10, 2003 |
| 6577003 |
Semiconductor chip carrier affording a high-density external interface |
Jun. 10, 2003 |
| 6573459 |
Graded metallic leads for connection to microelectronic elements |
Jun. 3, 2003 |
| 6573593 |
Integrated circuit with a housing accommodating the integrated circuit |
Jun. 3, 2003 |
| 6570246 |
Multi-die package |
May. 27, 2003 |
| 6566744 |
Integrated circuit packages assembled utilizing fluidic self-assembly |
May. 20, 2003 |
| 6563201 |
System carrier for a semiconductor chip having a lead frame |
May. 13, 2003 |
| 6558500 |
Method of producing a lead frame with composite film attached, and use of the lead frame |
May. 6, 2003 |
| 6559525 |
Semiconductor package having heat sink at the outer surface |
May. 6, 2003 |
| 6555900 |
Package, semiconductor device and method for fabricating the semiconductor device |
Apr. 29, 2003 |
| 6552425 |
Integrated circuit package |
Apr. 22, 2003 |
| 6552430 |
Ball grid array substrate with improved traces formed from copper based metal |
Apr. 22, 2003 |
| 6552432 |
Mask on a polymer having an opening width less than that of the opening in the polymer |
Apr. 22, 2003 |
| 6545347 |
Enhanced leadless chip carrier |
Apr. 8, 2003 |
| 6545349 |
Semiconductor device |
Apr. 8, 2003 |
| 6545364 |
Circuit device and method of manufacturing the same |
Apr. 8, 2003 |
| 6541848 |
Semiconductor device including stud bumps as external connection terminals |
Apr. 1, 2003 |
| 6541850 |
Utilization of die active surfaces for laterally extending die internal and external connections |
Apr. 1, 2003 |
| 6541851 |
Lead frame for a semiconductor device |
Apr. 1, 2003 |
| 6538304 |
Corner bonding to lead frame |
Mar. 25, 2003 |
| 6538313 |
IC package with integral substrate capacitor |
Mar. 25, 2003 |
| 6538337 |
Ball grid array package for providing constant internal voltage via a PCB substrate routing configuration |
Mar. 25, 2003 |
| 6534847 |
Semiconductor device |
Mar. 18, 2003 |
| 6534852 |
Ball grid array semiconductor package with improved strength and electric performance and method for making the same |
Mar. 18, 2003 |
| 6534853 |
Semiconductor wafer designed to avoid probed marks while testing |
Mar. 18, 2003 |
| 6534878 |
Optimizing the power connection between chip and circuit board for a power switch |
Mar. 18, 2003 |
| 6528868 |
Lead frame device and method for producing the same |
Mar. 4, 2003 |
| 6528871 |
Structure and method for mounting semiconductor devices |
Mar. 4, 2003 |
| 6521983 |
Semiconductor device for electric power |
Feb. 18, 2003 |
| 6521988 |
Device for packaging electronic components |
Feb. 18, 2003 |
| 6521989 |
Methods and apparatus for hermetically sealing electronic packages |
Feb. 18, 2003 |
| 6521992 |
Semiconductor apparatus |
Feb. 18, 2003 |
| 6518598 |
III-nitride LED having a spiral electrode |
Feb. 11, 2003 |
| 6518649 |
Tape carrier type semiconductor device with gold/gold bonding of leads to bumps |
Feb. 11, 2003 |
| 6518650 |
Tape under frame for lead frame IC package assembly |
Feb. 11, 2003 |
| 6518663 |
Constant impedance routing for high performance integrated circuit packaging |
Feb. 11, 2003 |
| 6512288 |
Circuit board semiconductor package |
Jan. 28, 2003 |
| 6509628 |
IC chip |
Jan. 21, 2003 |
| 6509631 |
Semiconductor device and liquid crystal module |
Jan. 21, 2003 |
| 6509632 |
Method of fabricating a redundant pinout configuration for signal enhancement in an IC package |
Jan. 21, 2003 |
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