| |
 |
|
Class Information
Number: 257/690
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With contact or lead
Description: Subject matter wherein the device is provided with a contact or lead, in addition to or as part of the package or housing.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6696749 |
Package structure having tapering support bars and leads |
Feb. 24, 2004 |
| 6686649 |
Multi-chip semiconductor package with integral shield and antenna |
Feb. 3, 2004 |
| 6683375 |
Semiconductor die including conductive columns |
Jan. 27, 2004 |
| 6677663 |
End grid array semiconductor package |
Jan. 13, 2004 |
| 6677665 |
Dual-die integrated circuit package |
Jan. 13, 2004 |
| 6674174 |
Controlled impedance transmission lines in a redistribution layer |
Jan. 6, 2004 |
| 6670550 |
Underfill coating for LOC package |
Dec. 30, 2003 |
| 6670700 |
Interconnect substrate and semiconductor device electronic instrument |
Dec. 30, 2003 |
| 6670707 |
Integrated circuit chip |
Dec. 30, 2003 |
| 6667439 |
Integrated circuit package including opening exposing portion of an IC |
Dec. 23, 2003 |
| 6664615 |
Method and apparatus for lead-frame based grid array IC packaging |
Dec. 16, 2003 |
| 6664620 |
Integrated circuit die and/or package having a variable pitch contact array for maximization of number of signal lines per routing layer |
Dec. 16, 2003 |
| 6661099 |
Semiconductor device, semiconductor package for use therein, and manufacturing method thereof |
Dec. 9, 2003 |
| 6655011 |
Method for fabricating a switch structure |
Dec. 2, 2003 |
| 6656768 |
Flip-chip assembly of protected micromechanical devices |
Dec. 2, 2003 |
| 6657124 |
Advanced electronic package |
Dec. 2, 2003 |
| 6657293 |
Chip scale package in which layout of wiring lines is improved |
Dec. 2, 2003 |
| 6657298 |
Integrated circuit chip package having an internal lead |
Dec. 2, 2003 |
| 6653725 |
Chip package and method of manufacturing the same |
Nov. 25, 2003 |
| 6654919 |
Automated system for inserting and reading of probe points in silicon embedded testbenches |
Nov. 25, 2003 |
| 6649999 |
Semiconductor chip configuration with a layer sequence with functional elements contacted by contact pads |
Nov. 18, 2003 |
| 6650008 |
Stacked semiconductor packaging device |
Nov. 18, 2003 |
| 6650021 |
Recessed bond pad |
Nov. 18, 2003 |
| 6646330 |
Lead frame for semiconductor device, process for producing the same and semiconductor device using the same |
Nov. 11, 2003 |
| 6642576 |
Power semiconductor device having layered structure of power semiconductor elements and terminal members |
Nov. 4, 2003 |
| 6642614 |
Multi-functional memory chip connector |
Nov. 4, 2003 |
| 6643418 |
Electric or opto-electric component with a packaging of plastic and a method for varying the impedance of a terminal lead of the component by attaching a dielectric plate to at least one termi |
Nov. 4, 2003 |
| 6639310 |
Pin arrangement for high frequency integrated circuit |
Oct. 28, 2003 |
| 6635553 |
Microelectronic assemblies with multiple leads |
Oct. 21, 2003 |
| 6627982 |
Electric connection structure for electronic power devices, and method of connection |
Sep. 30, 2003 |
| 6627986 |
Substrate for semiconductor device and semiconductor device fabrication using the same |
Sep. 30, 2003 |
| 6624509 |
Semiconductor device |
Sep. 23, 2003 |
| 6621150 |
Lead frame adaptable to the trend of IC packaging |
Sep. 16, 2003 |
| 6621152 |
Thin, small-sized power semiconductor package |
Sep. 16, 2003 |
| 6621173 |
Semiconductor device having an adhesive and a sealant |
Sep. 16, 2003 |
| 6621280 |
Method of testing an integrated circuit |
Sep. 16, 2003 |
| 6611053 |
Protective structure for bond wires |
Aug. 26, 2003 |
| 6608366 |
Lead frame with plated end leads |
Aug. 19, 2003 |
| 6608368 |
Semiconductor device with power source conductor pattern and grounding conductor pattern |
Aug. 19, 2003 |
| 6608373 |
Support structure for power element |
Aug. 19, 2003 |
| 6608374 |
Semiconductor chip assembly with bumped conductive trace |
Aug. 19, 2003 |
| 6608376 |
Integrated circuit package substrate with high density routing mechanism |
Aug. 19, 2003 |
| 6605867 |
Surface mount type semiconductor package and manufacturing method therefor |
Aug. 12, 2003 |
| 6603207 |
Electrode structure for semiconductor device, method for forming the same, mounted body including semiconductor device and semiconductor device |
Aug. 5, 2003 |
| 6600215 |
Method and apparatus for coupling a semiconductor die to die terminals |
Jul. 29, 2003 |
| 6600218 |
Semiconductor device |
Jul. 29, 2003 |
| 6600221 |
Semiconductor device with stacked semiconductor chips |
Jul. 29, 2003 |
| 6600223 |
Hermetically sealing enclosure for housing photo-semiconductor devices and photo-semiconductor module incorporating the enclosure |
Jul. 29, 2003 |
| 6597059 |
Thermally enhanced chip scale lead on chip semiconductor package |
Jul. 22, 2003 |
| 6597070 |
Semiconductor device and method of manufacturing the same |
Jul. 22, 2003 |
|
|
|
