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Class Information
Number: 257/690
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With contact or lead
Description: Subject matter wherein the device is provided with a contact or lead, in addition to or as part of the package or housing.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7432602 |
Semiconductor device |
Oct. 7, 2008 |
| 7432589 |
Semiconductor device |
Oct. 7, 2008 |
| 7432588 |
Semiconductor device and method of fabricating the same |
Oct. 7, 2008 |
| 7432585 |
Semiconductor device electronic component, circuit board, and electronic device |
Oct. 7, 2008 |
| 7432533 |
Encapsulation of electronic devices with shaped spacers |
Oct. 7, 2008 |
| 7425758 |
Metal core foldover package structures |
Sep. 16, 2008 |
| 7425757 |
Semiconductor power module |
Sep. 16, 2008 |
| 7423340 |
Semiconductor package free of substrate and fabrication method thereof |
Sep. 9, 2008 |
| 7420282 |
Connection structure for connecting semiconductor element and wiring board, and semiconductor device |
Sep. 2, 2008 |
| 7417317 |
Post passivation interconnection schemes on top of the IC chips |
Aug. 26, 2008 |
| 7417198 |
Radiofrequency power semiconductor module with cavity housing, and method for producing it |
Aug. 26, 2008 |
| 7414306 |
Preamplifier integrated circuit on flex circuit for magnetic media storing devices |
Aug. 19, 2008 |
| 7411179 |
Photodetector module with impedance matching |
Aug. 12, 2008 |
| 7408251 |
Semiconductor packaging device comprising a semiconductor chip including a MOSFET |
Aug. 5, 2008 |
| 7408243 |
High temperature package flip-chip bonding to ceramic |
Aug. 5, 2008 |
| 7402911 |
Multi-chip device and method for producing a multi-chip device |
Jul. 22, 2008 |
| 7400512 |
Module incorporating a capacitor, method for manufacturing the same, and capacitor used therefor |
Jul. 15, 2008 |
| 7394164 |
Semiconductor device having bumps in a same row for staggered probing |
Jul. 1, 2008 |
| 7394152 |
Wafer level chip size packaged chip device with an N-shape junction inside and method of fabricating the same |
Jul. 1, 2008 |
| 7394151 |
Semiconductor package with plated connection |
Jul. 1, 2008 |
| 7394150 |
Semiconductor package including die interposed between cup-shaped lead frame and lead frame having mesas and valleys |
Jul. 1, 2008 |
| 7394146 |
MOSFET package |
Jul. 1, 2008 |
| 7391107 |
Signal routing on redistribution layer |
Jun. 24, 2008 |
| 7388293 |
Interposer method of fabricating same, and semiconductor device using the same having two portions with different constructions |
Jun. 17, 2008 |
| 7387827 |
Interconnection designs and materials having improved strength and fatigue life |
Jun. 17, 2008 |
| 7382060 |
Semiconductor component having thinned die, polymer layers, contacts on opposing sides, and conductive vias connecting the contacts |
Jun. 3, 2008 |
| 7382052 |
Post passivation interconnection schemes on top of IC chip |
Jun. 3, 2008 |
| 7382044 |
Semiconductor device package diepad having features formed by electroplating |
Jun. 3, 2008 |
| 7375424 |
Wirebonded device packages for semiconductor devices having elongated electrodes |
May. 20, 2008 |
| 7372161 |
Post passivation interconnection schemes on top of the IC chips |
May. 13, 2008 |
| 7372139 |
Semiconductor chip package |
May. 13, 2008 |
| 7368825 |
Power semiconductor device |
May. 6, 2008 |
| 7368813 |
Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, an |
May. 6, 2008 |
| 7368809 |
Pillar grid array package |
May. 6, 2008 |
| 7368803 |
System and method for protecting microelectromechanical systems array using back-plate with non-flat portion |
May. 6, 2008 |
| 7364941 |
Circuit device manufacturing method |
Apr. 29, 2008 |
| 7361997 |
Device package, a printed wiring board, and an electronic apparatus with efficiently spaced bottom electrodes including intervals between bottom electrodes of different lengths |
Apr. 22, 2008 |
| 7361983 |
Semiconductor device and semiconductor assembly module with a gap-controlling lead structure |
Apr. 22, 2008 |
| 7361935 |
Semiconductor device, LED print head, that uses the semiconductor, and image forming apparatus that uses the LED print head |
Apr. 22, 2008 |
| 7361880 |
Digital camera module for detachably mounting with flex printed circuit board |
Apr. 22, 2008 |
| 7352054 |
Semiconductor device having conducting portion of upper and lower conductive layers |
Apr. 1, 2008 |
| 7348666 |
Chip-to-chip trench circuit structure |
Mar. 25, 2008 |
| 7348661 |
Array capacitor apparatuses to filter input/output signal |
Mar. 25, 2008 |
| 7345362 |
Electronic component and method for manufacturing the same |
Mar. 18, 2008 |
| 7342318 |
Semiconductor package free of substrate and fabrication method thereof |
Mar. 11, 2008 |
| 7342262 |
Split-gate power module for suppressing oscillation therein |
Mar. 11, 2008 |
| 7339265 |
Capacitance type semiconductor sensor |
Mar. 4, 2008 |
| 7335977 |
Semiconductor chip mounting arrangement |
Feb. 26, 2008 |
| 7335976 |
Crosstalk reduction in electrical interconnects using differential signaling |
Feb. 26, 2008 |
| 7335951 |
Semiconductor device and method for manufacturing the same |
Feb. 26, 2008 |
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