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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
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Class Information
Number: 257/690
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With contact or lead
Description: Subject matter wherein the device is provided with a contact or lead, in addition to or as part of the package or housing.


Sub-classes under this class:

Class Number Class Name Patents
257/691 Having power distribution means (e.g., bus structure) 1,056
257/700 Multiple contact layers separated from each other by insulator means and forming part of a package or housing (e.g., plural ceramic layer package) 1,170
257/692 With particular lead geometry 1,241
257/698 With specific electrical feedthrough structure 1,207


Patents under this class:

Patent Number Title Of Patent Date Issued
7432602 Semiconductor device Oct. 7, 2008
7432589 Semiconductor device Oct. 7, 2008
7432588 Semiconductor device and method of fabricating the same Oct. 7, 2008
7432585 Semiconductor device electronic component, circuit board, and electronic device Oct. 7, 2008
7432533 Encapsulation of electronic devices with shaped spacers Oct. 7, 2008
7425758 Metal core foldover package structures Sep. 16, 2008
7425757 Semiconductor power module Sep. 16, 2008
7423340 Semiconductor package free of substrate and fabrication method thereof Sep. 9, 2008
7420282 Connection structure for connecting semiconductor element and wiring board, and semiconductor device Sep. 2, 2008
7417317 Post passivation interconnection schemes on top of the IC chips Aug. 26, 2008
7417198 Radiofrequency power semiconductor module with cavity housing, and method for producing it Aug. 26, 2008
7414306 Preamplifier integrated circuit on flex circuit for magnetic media storing devices Aug. 19, 2008
7411179 Photodetector module with impedance matching Aug. 12, 2008
7408251 Semiconductor packaging device comprising a semiconductor chip including a MOSFET Aug. 5, 2008
7408243 High temperature package flip-chip bonding to ceramic Aug. 5, 2008
7402911 Multi-chip device and method for producing a multi-chip device Jul. 22, 2008
7400512 Module incorporating a capacitor, method for manufacturing the same, and capacitor used therefor Jul. 15, 2008
7394164 Semiconductor device having bumps in a same row for staggered probing Jul. 1, 2008
7394152 Wafer level chip size packaged chip device with an N-shape junction inside and method of fabricating the same Jul. 1, 2008
7394151 Semiconductor package with plated connection Jul. 1, 2008
7394150 Semiconductor package including die interposed between cup-shaped lead frame and lead frame having mesas and valleys Jul. 1, 2008
7394146 MOSFET package Jul. 1, 2008
7391107 Signal routing on redistribution layer Jun. 24, 2008
7388293 Interposer method of fabricating same, and semiconductor device using the same having two portions with different constructions Jun. 17, 2008
7387827 Interconnection designs and materials having improved strength and fatigue life Jun. 17, 2008
7382060 Semiconductor component having thinned die, polymer layers, contacts on opposing sides, and conductive vias connecting the contacts Jun. 3, 2008
7382052 Post passivation interconnection schemes on top of IC chip Jun. 3, 2008
7382044 Semiconductor device package diepad having features formed by electroplating Jun. 3, 2008
7375424 Wirebonded device packages for semiconductor devices having elongated electrodes May. 20, 2008
7372161 Post passivation interconnection schemes on top of the IC chips May. 13, 2008
7372139 Semiconductor chip package May. 13, 2008
7368825 Power semiconductor device May. 6, 2008
7368813 Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, an May. 6, 2008
7368809 Pillar grid array package May. 6, 2008
7368803 System and method for protecting microelectromechanical systems array using back-plate with non-flat portion May. 6, 2008
7364941 Circuit device manufacturing method Apr. 29, 2008
7361997 Device package, a printed wiring board, and an electronic apparatus with efficiently spaced bottom electrodes including intervals between bottom electrodes of different lengths Apr. 22, 2008
7361983 Semiconductor device and semiconductor assembly module with a gap-controlling lead structure Apr. 22, 2008
7361935 Semiconductor device, LED print head, that uses the semiconductor, and image forming apparatus that uses the LED print head Apr. 22, 2008
7361880 Digital camera module for detachably mounting with flex printed circuit board Apr. 22, 2008
7352054 Semiconductor device having conducting portion of upper and lower conductive layers Apr. 1, 2008
7348666 Chip-to-chip trench circuit structure Mar. 25, 2008
7348661 Array capacitor apparatuses to filter input/output signal Mar. 25, 2008
7345362 Electronic component and method for manufacturing the same Mar. 18, 2008
7342318 Semiconductor package free of substrate and fabrication method thereof Mar. 11, 2008
7342262 Split-gate power module for suppressing oscillation therein Mar. 11, 2008
7339265 Capacitance type semiconductor sensor Mar. 4, 2008
7335977 Semiconductor chip mounting arrangement Feb. 26, 2008
7335976 Crosstalk reduction in electrical interconnects using differential signaling Feb. 26, 2008
7335951 Semiconductor device and method for manufacturing the same Feb. 26, 2008



 
 
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