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Class Information
Number: 257/690
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With contact or lead
Description: Subject matter wherein the device is provided with a contact or lead, in addition to or as part of the package or housing.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7619307 |
Leadframe-based semiconductor package having arched bend in a supporting bar and leadframe for the package |
Nov. 17, 2009 |
| 7619306 |
Semiconductor device having projecting electrode formed by electrolytic plating, and manufacturing method thereof |
Nov. 17, 2009 |
| 7615870 |
Semiconductor device, manufacturing method thereof, and connection method of circuit board |
Nov. 10, 2009 |
| 7615406 |
Electronic device package manufacturing method and electronic device package |
Nov. 10, 2009 |
| 7612457 |
Semiconductor device including a stress buffer |
Nov. 3, 2009 |
| 7612436 |
Packaged microelectronic devices with a lead frame |
Nov. 3, 2009 |
| 7605462 |
Universal substrate for a semiconductor device having selectively activated fuses |
Oct. 20, 2009 |
| 7598621 |
Device package, a printed wiring board, and an electronic apparatus with efficiently spaced bottom electrodes including intervals between bottom electrodes of different lengths |
Oct. 6, 2009 |
| 7598609 |
Structure of polymer-matrix conductive film and method for fabricating the same |
Oct. 6, 2009 |
| 7598604 |
Low profile semiconductor package |
Oct. 6, 2009 |
| 7598603 |
Electronic component having a power switch with an anode thereof mounted on a die attach region of a heat sink |
Oct. 6, 2009 |
| 7595547 |
Semiconductor die package including cup-shaped leadframe |
Sep. 29, 2009 |
| 7595268 |
Semiconductor package having re-distribution lines for supplying power and a method for manufacturing the same |
Sep. 29, 2009 |
| 7595257 |
Process of forming an electronic device including a barrier layer |
Sep. 29, 2009 |
| 7595220 |
Image sensor package and fabrication method thereof |
Sep. 29, 2009 |
| 7592699 |
Hidden plating traces |
Sep. 22, 2009 |
| 7592694 |
Chip package and method of manufacturing the same |
Sep. 22, 2009 |
| 7589388 |
Semiconductor device and method of manufacturing the same |
Sep. 15, 2009 |
| 7586186 |
Ball grid array |
Sep. 8, 2009 |
| 7586180 |
Semiconductor packaging device comprising a semiconductor chip including a MOSFET |
Sep. 8, 2009 |
| 7582919 |
Functional coating of the SCFM preform |
Sep. 1, 2009 |
| 7579683 |
Memory interface optimized for stacked configurations |
Aug. 25, 2009 |
| 7579682 |
Power semiconductor module |
Aug. 25, 2009 |
| 7569923 |
Recyclying faulty multi-die packages |
Aug. 4, 2009 |
| 7566977 |
Semiconductor device and method for manufacturing the same |
Jul. 28, 2009 |
| 7566968 |
Biosensor with smart card configuration |
Jul. 28, 2009 |
| 7560810 |
Semiconductor device, method of manufacturing the same, circuit board, and electronic instrument |
Jul. 14, 2009 |
| 7557442 |
Power semiconductor arrangement |
Jul. 7, 2009 |
| 7554187 |
Connecting structure, printed substrate, circuit, circuit package and method of forming connecting structure |
Jun. 30, 2009 |
| 7554136 |
Micro-switch device and method for manufacturing the same |
Jun. 30, 2009 |
| 7550855 |
Vertically spaced plural microsprings |
Jun. 23, 2009 |
| 7550837 |
Semiconductor device and voltage regulator |
Jun. 23, 2009 |
| 7545032 |
Integrated circuit package system with stiffener |
Jun. 9, 2009 |
| 7538414 |
Semiconductor integrated circuit device |
May. 26, 2009 |
| 7535741 |
Semiconductor device |
May. 19, 2009 |
| 7531894 |
Method of electrically connecting a microelectronic component |
May. 12, 2009 |
| 7531443 |
Method and system for fabricating semiconductor components with through interconnects and back side redistribution conductors |
May. 12, 2009 |
| 7528495 |
Chip structure |
May. 5, 2009 |
| 7528477 |
Castellation wafer level packaging of integrated circuit chips |
May. 5, 2009 |
| 7526861 |
Method for fabricating structure of polymer-matrix conductive film |
May. 5, 2009 |
| 7525193 |
Semiconductor device and method of manufacturing the same |
Apr. 28, 2009 |
| 7525183 |
Surface mount multichip devices |
Apr. 28, 2009 |
| 7525181 |
Tape wiring substrate and tape package using the same |
Apr. 28, 2009 |
| 7525174 |
High performance system-on-chip using post passivation process |
Apr. 28, 2009 |
| 7524754 |
Interconnect shunt used for current distribution and reliability redundancy |
Apr. 28, 2009 |
| 7521805 |
Post passivation interconnection schemes on top of the IC chips |
Apr. 21, 2009 |
| 7518239 |
Semiconductor device with substrate having penetrating hole having a protrusion |
Apr. 14, 2009 |
| 7518228 |
Hybrid integrated circuit device, and method for fabricating the same, and electronic device |
Apr. 14, 2009 |
| 7514796 |
Semiconductor chip capable of being laminated and a semiconductor device including the lamination of a plurality of semiconductor chips |
Apr. 7, 2009 |
| 7514350 |
Electronic device and method of manufacturing the same, circuit board, and electronic instrument |
Apr. 7, 2009 |
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