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Class Information
Number: 257/690
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With contact or lead
Description: Subject matter wherein the device is provided with a contact or lead, in addition to or as part of the package or housing.


Sub-classes under this class:

Class Number Class Name Patents
257/691 Having power distribution means (e.g., bus structure) 1,118
257/700 Multiple contact layers separated from each other by insulator means and forming part of a package or housing (e.g., plural ceramic layer package) 1,262
257/692 With particular lead geometry 1,316
257/698 With specific electrical feedthrough structure 1,302


Patents under this class:

Patent Number Title Of Patent Date Issued
7619307 Leadframe-based semiconductor package having arched bend in a supporting bar and leadframe for the package Nov. 17, 2009
7619306 Semiconductor device having projecting electrode formed by electrolytic plating, and manufacturing method thereof Nov. 17, 2009
7615870 Semiconductor device, manufacturing method thereof, and connection method of circuit board Nov. 10, 2009
7615406 Electronic device package manufacturing method and electronic device package Nov. 10, 2009
7612457 Semiconductor device including a stress buffer Nov. 3, 2009
7612436 Packaged microelectronic devices with a lead frame Nov. 3, 2009
7605462 Universal substrate for a semiconductor device having selectively activated fuses Oct. 20, 2009
7598621 Device package, a printed wiring board, and an electronic apparatus with efficiently spaced bottom electrodes including intervals between bottom electrodes of different lengths Oct. 6, 2009
7598609 Structure of polymer-matrix conductive film and method for fabricating the same Oct. 6, 2009
7598604 Low profile semiconductor package Oct. 6, 2009
7598603 Electronic component having a power switch with an anode thereof mounted on a die attach region of a heat sink Oct. 6, 2009
7595547 Semiconductor die package including cup-shaped leadframe Sep. 29, 2009
7595268 Semiconductor package having re-distribution lines for supplying power and a method for manufacturing the same Sep. 29, 2009
7595257 Process of forming an electronic device including a barrier layer Sep. 29, 2009
7595220 Image sensor package and fabrication method thereof Sep. 29, 2009
7592699 Hidden plating traces Sep. 22, 2009
7592694 Chip package and method of manufacturing the same Sep. 22, 2009
7589388 Semiconductor device and method of manufacturing the same Sep. 15, 2009
7586186 Ball grid array Sep. 8, 2009
7586180 Semiconductor packaging device comprising a semiconductor chip including a MOSFET Sep. 8, 2009
7582919 Functional coating of the SCFM preform Sep. 1, 2009
7579683 Memory interface optimized for stacked configurations Aug. 25, 2009
7579682 Power semiconductor module Aug. 25, 2009
7569923 Recyclying faulty multi-die packages Aug. 4, 2009
7566977 Semiconductor device and method for manufacturing the same Jul. 28, 2009
7566968 Biosensor with smart card configuration Jul. 28, 2009
7560810 Semiconductor device, method of manufacturing the same, circuit board, and electronic instrument Jul. 14, 2009
7557442 Power semiconductor arrangement Jul. 7, 2009
7554187 Connecting structure, printed substrate, circuit, circuit package and method of forming connecting structure Jun. 30, 2009
7554136 Micro-switch device and method for manufacturing the same Jun. 30, 2009
7550855 Vertically spaced plural microsprings Jun. 23, 2009
7550837 Semiconductor device and voltage regulator Jun. 23, 2009
7545032 Integrated circuit package system with stiffener Jun. 9, 2009
7538414 Semiconductor integrated circuit device May. 26, 2009
7535741 Semiconductor device May. 19, 2009
7531894 Method of electrically connecting a microelectronic component May. 12, 2009
7531443 Method and system for fabricating semiconductor components with through interconnects and back side redistribution conductors May. 12, 2009
7528495 Chip structure May. 5, 2009
7528477 Castellation wafer level packaging of integrated circuit chips May. 5, 2009
7526861 Method for fabricating structure of polymer-matrix conductive film May. 5, 2009
7525193 Semiconductor device and method of manufacturing the same Apr. 28, 2009
7525183 Surface mount multichip devices Apr. 28, 2009
7525181 Tape wiring substrate and tape package using the same Apr. 28, 2009
7525174 High performance system-on-chip using post passivation process Apr. 28, 2009
7524754 Interconnect shunt used for current distribution and reliability redundancy Apr. 28, 2009
7521805 Post passivation interconnection schemes on top of the IC chips Apr. 21, 2009
7518239 Semiconductor device with substrate having penetrating hole having a protrusion Apr. 14, 2009
7518228 Hybrid integrated circuit device, and method for fabricating the same, and electronic device Apr. 14, 2009
7514796 Semiconductor chip capable of being laminated and a semiconductor device including the lamination of a plurality of semiconductor chips Apr. 7, 2009
7514350 Electronic device and method of manufacturing the same, circuit board, and electronic instrument Apr. 7, 2009



 
 
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