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Class Information
Number: 257/690
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With contact or lead
Description: Subject matter wherein the device is provided with a contact or lead, in addition to or as part of the package or housing.










Sub-classes under this class:

Class Number Class Name Patents
257/691 Having power distribution means (e.g., bus structure) 1,502
257/700 Multiple contact layers separated from each other by insulator means and forming part of a package or housing (e.g., plural ceramic layer package) 1,740
257/692 With particular lead geometry 1,848
257/698 With specific electrical feedthrough structure 1,953


Patents under this class:

Patent Number Title Of Patent Date Issued
8710678 Device and method including a soldering process Apr. 29, 2014
8710644 Semiconductor unit having a power semiconductor and semiconductor apparatus using the same Apr. 29, 2014
8709873 Leadless integrated circuit packaging system and method of manufacture thereof Apr. 29, 2014
8704385 Semiconductor device having pad region for wire-bonding and method of manufacturing the semiconductor device Apr. 22, 2014
8704347 Packaged semiconductor chips Apr. 22, 2014
8692367 Wafer-level packaged device having self-assembled resilient leads Apr. 8, 2014
8692363 Electric part package and manufacturing method thereof Apr. 8, 2014
8692362 Semiconductor structure having conductive vias and method for manufacturing the same Apr. 8, 2014
8687668 Multi-wavelength semiconductor laser device Apr. 1, 2014
8686551 Substrate for a microelectronic package and method of fabricating thereof Apr. 1, 2014
8686547 Stack die structure for stress reduction and facilitation of electromagnetic shielding Apr. 1, 2014
8685793 Chip assembly having via interconnects joined by plating Apr. 1, 2014
8680683 Wafer level package with embedded passive components and method of manufacturing Mar. 25, 2014
8680677 Carbon nanotube-based conductive connections for integrated circuit devices Mar. 25, 2014
8680668 Device including a semiconductor chip and metal foils Mar. 25, 2014
8680660 Brace for bond wire Mar. 25, 2014
8680568 Semiconductor light-emitting device Mar. 25, 2014
8674496 System and method for fine pitch PoP structure Mar. 18, 2014
8674491 Semiconductor device Mar. 18, 2014
8674463 Multifunction MEMS element and integrated method for making MOS and multifunction MEMS Mar. 18, 2014
8669652 Lead component and method for manufacturing the same, and semiconductor package Mar. 11, 2014
8669581 Light emitting device package including UV light emitting diode Mar. 11, 2014
8665605 Substrate structure and package structure using the same Mar. 4, 2014
8664656 Devices and methods for embedding semiconductors in printed circuit boards Mar. 4, 2014
8664038 Integrated circuit packaging system with stacked paddle and method of manufacture thereof Mar. 4, 2014
8659146 Lead frame based, over-molded semiconductor package with integrated through hole technology (THT) heat spreader pin(s) and associated method of manufacturing Feb. 25, 2014
8659138 Semiconductor package having electrode on side surface, and semiconductor device Feb. 25, 2014
8659134 Multi-chip package and manufacturing method Feb. 25, 2014
8659128 Flip chip package structure with heat dissipation enhancement and its application Feb. 25, 2014
8653644 Packaged semiconductor chips with array Feb. 18, 2014
8648456 Embedded integrated circuit package and method for manufacturing an embedded integrated circuit package Feb. 11, 2014
8643189 Packaged semiconductor die with power rail pads Feb. 4, 2014
8643184 Crosstalk polarity reversal and cancellation through substrate material tuning Feb. 4, 2014
8643165 Semiconductor device having agglomerate terminals Feb. 4, 2014
8642902 Surface mountable device Feb. 4, 2014
8642465 Method for manufacturing and making planar contact with an electronic apparatus, and correspondingly manufactured apparatus Feb. 4, 2014
8642388 Method for manufacturing light emitting diodes including forming circuit structures with a connecting section Feb. 4, 2014
8637977 Semiconductor device and method of packaging a semiconductor device with a clip Jan. 28, 2014
8637976 Semiconductor device with lead terminals having portions thereof extending obliquely Jan. 28, 2014
8637973 Packaged microelectronic components with terminals exposed through encapsulant Jan. 28, 2014
8633582 Chip package and fabrication method thereof Jan. 21, 2014
8633581 Semiconductor device Jan. 21, 2014
8629545 Stub minimization for assemblies without wirebonds to package substrate Jan. 14, 2014
8624242 Semiconductor integrated circuit Jan. 7, 2014
8623753 Stackable protruding via package and method Jan. 7, 2014
8618671 Semiconductor packages having passive elements mounted thereonto Dec. 31, 2013
8617927 Method of mounting electronic chips Dec. 31, 2013
8610260 Stub minimization for assemblies without wirebonds to package substrate Dec. 17, 2013
8610257 Semiconductor device and method for producing such a device Dec. 17, 2013
8610156 Light emitting device package Dec. 17, 2013











 
 
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