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Class Information
Number: 257/689
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With large area flexible electrodes in press contact with opposite sides of active semiconductor chip and surrounded by an insulating element, e.g., ring > Rigid electrode portion
Description: Subject matter wherein the large area electrodes are rigid in whole or in part.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7397066 |
Microelectronic imagers with curved image sensors and methods for manufacturing microelectronic imagers |
Jul. 8, 2008 |
| 7390973 |
Memory module and signal line arrangement method thereof |
Jun. 24, 2008 |
| 7368819 |
Multilayer printed wiring board and multilayer printed circuit board |
May. 6, 2008 |
| 7358602 |
Semiconductor chip, and semiconductor wafer including a variable thickness insulating layer |
Apr. 15, 2008 |
| 7335970 |
Semiconductor device having a chip-size package |
Feb. 26, 2008 |
| 7327023 |
Semiconductor component with plastic housing, and process for producing the same |
Feb. 5, 2008 |
| 7327022 |
Assembly, contact and coupling interconnection for optoelectronics |
Feb. 5, 2008 |
| 7312400 |
Multilayer wiring board, base for multilayer wiring board, printed wiring board and its manufacturing method |
Dec. 25, 2007 |
| 7268417 |
Card-type circuit device |
Sep. 11, 2007 |
| 7242085 |
Semiconductor device including a semiconductor chip mounted on a metal base |
Jul. 10, 2007 |
| 7208840 |
Semiconductor module, electronic device and electronic equipment, and method for manufacturing semiconductor module |
Apr. 24, 2007 |
| 7193328 |
Semiconductor device |
Mar. 20, 2007 |
| 7183647 |
Wiring substrate and electronic parts packaging structure |
Feb. 27, 2007 |
| 7183580 |
Electro-optical device, manufacturing method of the same, and electronic apparatus |
Feb. 27, 2007 |
| 7173325 |
Expansion constrained die stack |
Feb. 6, 2007 |
| 7170152 |
Wafer level semiconductor package with build-up layer and method for fabricating the same |
Jan. 30, 2007 |
| 7109575 |
Low-cost flexible film package module and method of manufacturing the same |
Sep. 19, 2006 |
| 7061090 |
Semiconductor device |
Jun. 13, 2006 |
| 7053479 |
Package of semiconductor device and its manufacturing method |
May. 30, 2006 |
| 7030476 |
Rectifier diode device |
Apr. 18, 2006 |
| 7009223 |
Rectification chip terminal structure |
Mar. 7, 2006 |
| 6977441 |
Interconnect substrate and method of manufacture thereof, electronic component and method of manufacturing thereof, circuit board and electronic instrument |
Dec. 20, 2005 |
| 6943436 |
EMI heatspreader/lid for integrated circuit packages |
Sep. 13, 2005 |
| 6936913 |
High performance vias for vertical IC packaging |
Aug. 30, 2005 |
| 6882040 |
Semiconductor device |
Apr. 19, 2005 |
| 6879033 |
Semiconductor device |
Apr. 12, 2005 |
| 6867496 |
Interconnect substrate, semiconductor device, methods of fabricating, inspecting, and mounting the semiconductor device, circuit board, and electronic instrument |
Mar. 15, 2005 |
| 6858922 |
Back-to-back connected power semiconductor device package |
Feb. 22, 2005 |
| 6853066 |
Semiconductor device |
Feb. 8, 2005 |
| 6833612 |
Flip-chip image sensor packages |
Dec. 21, 2004 |
| 6822318 |
Stress isolating die attach structure and method |
Nov. 23, 2004 |
| 6812558 |
Wafer scale package and method of assembly |
Nov. 2, 2004 |
| 6787892 |
Semiconductor device and semiconductor device manufacturing method |
Sep. 7, 2004 |
| 6753596 |
Resin-sealed semiconductor device |
Jun. 22, 2004 |
| 6710435 |
Semiconductor device arrangement and method of fabricating the same |
Mar. 23, 2004 |
| 6707144 |
Insulated high speed semiconductor switching device |
Mar. 16, 2004 |
| 6653168 |
LSI package and internal connecting method used therefor |
Nov. 25, 2003 |
| 6521483 |
Semiconductor device, method of manufacture thereof, circuit board, and electronic device |
Feb. 18, 2003 |
| 6492718 |
Stacked semiconductor device and semiconductor system |
Dec. 10, 2002 |
| 6479901 |
Semiconductor device having interconnected external electrode pads and wire bonding pads |
Nov. 12, 2002 |
| 6472305 |
Method of manufacturing bonded structure of film substrate and semiconductor chip |
Oct. 29, 2002 |
| 6469382 |
Semiconductor device substrate and method of manufacturing semiconductor device |
Oct. 22, 2002 |
| 6462408 |
Contact member stacking system and method |
Oct. 8, 2002 |
| 6452261 |
Flat semiconductor device and power converter employing the same |
Sep. 17, 2002 |
| 6387794 |
Electrode structure for semiconductor device, method for forming the same, mounted body including semiconductor device and semiconductor device |
May. 14, 2002 |
| 6380622 |
Electric apparatus having a contact intermediary member and method for manufacturing the same |
Apr. 30, 2002 |
| 6339253 |
Semiconductor package |
Jan. 15, 2002 |
| 6331730 |
Push-in type semiconductor device including heat spreader |
Dec. 18, 2001 |
| 6323547 |
Pressure contact type semiconductor device with ringshaped gate terminal |
Nov. 27, 2001 |
| 6320751 |
Sheet-framed IC carrier and method for producing the same |
Nov. 20, 2001 |
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