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Class Information
Number: 257/688
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With large area flexible electrodes in press contact with opposite sides of active semiconductor chip and surrounded by an insulating element, e.g., ring
Description: Subject matter wherein the package or housing has two large area electrodes which are in press contact with opposite sides of a semiconductor chip and wherein the electrode edges are surrounded by an electrically insulating medium (e.g., a ring).










Sub-classes under this class:

Class Number Class Name Patents
257/689 Rigid electrode portion 192


Patents under this class:
1 2 3 4 5 6 7 8

Patent Number Title Of Patent Date Issued
8704355 Semiconductor device comprising through-electrode interconnect Apr. 22, 2014
8687668 Multi-wavelength semiconductor laser device Apr. 1, 2014
8674495 Package systems having a eutectic bonding material and manufacturing methods thereof Mar. 18, 2014
8653643 Semiconductor module Feb. 18, 2014
8643155 Liquid crystal display and chip on film thereof Feb. 4, 2014
8629547 Semiconductor chip package Jan. 14, 2014
8618649 Compliant printed circuit semiconductor package Dec. 31, 2013
8592993 Method and structure of integrated micro electro-mechanical systems and electronic devices using edge bond pads Nov. 26, 2013
8581373 Tape package Nov. 12, 2013
8575742 Semiconductor device with increased I/O leadframe including power bars Nov. 5, 2013
8569875 Integrally molded die and bezel structure for fingerprint sensors and the like Oct. 29, 2013
8564117 Compliant spring interposer for wafer level three dimensional (3D) integration and method of manufacturing Oct. 22, 2013
8558361 Power semiconductor module Oct. 15, 2013
8552544 Package structure Oct. 8, 2013
8531018 Component comprising a chip in a cavity and a stress-reduced attachment Sep. 10, 2013
8508031 Electronic device and method of producing the same Aug. 13, 2013
8476532 Multilayer flexible printed circuit board and electronic device Jul. 2, 2013
8466546 Chip-scale package Jun. 18, 2013
8446018 Package on package May. 21, 2013
8415750 Semiconductor device and method of fabricating the same Apr. 9, 2013
8389870 Coreless multi-layer circuit substrate with minimized pad capacitance Mar. 5, 2013
8384214 Semiconductor structure, pad structure and protection structure Feb. 26, 2013
8378508 Integrally molded die and bezel structure for fingerprint sensors and the like Feb. 19, 2013
8368227 Semiconductor element and package having semiconductor element Feb. 5, 2013
8368185 Semiconductor device packages with electromagnetic interference shielding Feb. 5, 2013
8367522 Method and structure of integrated micro electro-mechanical systems and electronic devices using edge bond pads Feb. 5, 2013
8362603 Flexible circuit light-emitting structures Jan. 29, 2013
8350378 Press-fit power diode Jan. 8, 2013
8330264 Packaging configurations for vertical electronic devices using conductive traces disposed on laminated board layers Dec. 11, 2012
8324726 Semiconductor device, electrode member and electrode member fabrication method Dec. 4, 2012
8310039 Semiconductor device Nov. 13, 2012
8299593 Stack package made of chip scale packages Oct. 30, 2012
8294263 Light-emitting diode packaging structure and module and assembling method thereof Oct. 23, 2012
8288845 Package including proximately-positioned lead frame Oct. 16, 2012
8283763 Power semiconductor module and fabrication method thereof Oct. 9, 2012
8278756 Single chip semiconductor coating structure and manufacturing method thereof Oct. 2, 2012
8268671 Semiconductor system-in-package and methods for making the same Sep. 18, 2012
8269883 Solid image capture device and electronic device incorporating same Sep. 18, 2012
8253237 Semiconductor module arrangement and method Aug. 28, 2012
8238110 Device to shield against interference from electrical appliances Aug. 7, 2012
8232138 Circuit board with notched stiffener frame Jul. 31, 2012
8217505 Packaged IC device comprising an embedded flex circuit on leadframe, and methods of making same Jul. 10, 2012
8193624 Semiconductor device having improved contact interface reliability and method therefor Jun. 5, 2012
8193628 Printed wiring board, a method of manufacturing printed wiring board, a sensor module, and a sensing device Jun. 5, 2012
8188594 Input/output package architectures May. 29, 2012
8183681 Semiconductor device May. 22, 2012
8174110 Semiconductor device having at least two terminals among the plurality of terminals electrically connected to each other while not being adjacent to one other and not being connected to intern May. 8, 2012
8168985 Semiconductor module including a switch and non-central diode May. 1, 2012
8169082 Semiconductor device and method for manufacturing the same May. 1, 2012
8164173 Panel, semiconductor device and method for the production thereof Apr. 24, 2012

1 2 3 4 5 6 7 8










 
 
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