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Class Information
Number: 257/688
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With large area flexible electrodes in press contact with opposite sides of active semiconductor chip and surrounded by an insulating element, e.g., ring
Description: Subject matter wherein the package or housing has two large area electrodes which are in press contact with opposite sides of a semiconductor chip and wherein the electrode edges are surrounded by an electrically insulating medium (e.g., a ring).
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7452754 |
Method for manufacturing flexible printed circuit boards |
Nov. 18, 2008 |
| 7443018 |
Integrated circuit package system including ribbon bond interconnect |
Oct. 28, 2008 |
| 7413975 |
Interconnect substrate, semiconductor device, methods of manufacturing the same, circuit board, and electronic equipment |
Aug. 19, 2008 |
| 7408251 |
Semiconductor packaging device comprising a semiconductor chip including a MOSFET |
Aug. 5, 2008 |
| 7405470 |
Adaptable electronic storage apparatus |
Jul. 29, 2008 |
| 7397066 |
Microelectronic imagers with curved image sensors and methods for manufacturing microelectronic imagers |
Jul. 8, 2008 |
| 7345368 |
Semiconductor device and the manufacturing method for the same |
Mar. 18, 2008 |
| 7335970 |
Semiconductor device having a chip-size package |
Feb. 26, 2008 |
| 7335975 |
Integrated circuit stacking system and method |
Feb. 26, 2008 |
| 7327022 |
Assembly, contact and coupling interconnection for optoelectronics |
Feb. 5, 2008 |
| 7312520 |
Interface module for connecting LSI packages, and LSI-incorporating apparatus |
Dec. 25, 2007 |
| 7294919 |
Device having a complaint element pressed between substrates |
Nov. 13, 2007 |
| 7291907 |
Chip stack employing a flex circuit |
Nov. 6, 2007 |
| 7291904 |
Downsized package for electric wave device |
Nov. 6, 2007 |
| 7282749 |
Organic electroluminescent device and method of fabricating the same |
Oct. 16, 2007 |
| 7276792 |
Semiconductor device, circuit substrate, electro-optic device and electronic appliance |
Oct. 2, 2007 |
| 7268423 |
Flexible rewiring plate for semiconductor components, and process for producing it |
Sep. 11, 2007 |
| 7268417 |
Card-type circuit device |
Sep. 11, 2007 |
| 7253514 |
Self-supporting connecting element for a semiconductor chip |
Aug. 7, 2007 |
| 7242085 |
Semiconductor device including a semiconductor chip mounted on a metal base |
Jul. 10, 2007 |
| 7221047 |
Pressure-contact type semiconductor device |
May. 22, 2007 |
| 7205650 |
Composite devices of laminate type and processes |
Apr. 17, 2007 |
| 7196412 |
Multi-chip press-connected type semiconductor device |
Mar. 27, 2007 |
| 7190061 |
stack package made of chip scale packages |
Mar. 13, 2007 |
| 7180197 |
Semiconductor device containing stacked semiconductor chips and manufacturing method thereof |
Feb. 20, 2007 |
| 7173325 |
Expansion constrained die stack |
Feb. 6, 2007 |
| 7173328 |
Integrated circuit package and method having wire-bonded intra-die electrical connections |
Feb. 6, 2007 |
| 7170171 |
Support ring for use with a contact pad and semiconductor device components including the same |
Jan. 30, 2007 |
| 7154188 |
Semiconductor chip, semiconductor device, circuit board, and electronic instrument |
Dec. 26, 2006 |
| 7154180 |
Electronic device, method of manufacture of the same, and sputtering target |
Dec. 26, 2006 |
| 7154171 |
Stacking structure for semiconductor devices using a folded over flexible substrate and method therefor |
Dec. 26, 2006 |
| 7132698 |
Compression assembled electronic package having a plastic molded insulation ring |
Nov. 7, 2006 |
| 7129572 |
Submember mounted on a chip of electrical device for electrical connection |
Oct. 31, 2006 |
| 7126213 |
Rectification chip terminal structure |
Oct. 24, 2006 |
| 7109575 |
Low-cost flexible film package module and method of manufacturing the same |
Sep. 19, 2006 |
| 7105918 |
Interposer with flexible solder pad elements and methods of manufacturing the same |
Sep. 12, 2006 |
| 7098539 |
Electronic device, method of manufacture of the same, and sputtering target |
Aug. 29, 2006 |
| 7067912 |
Wired circuit board |
Jun. 27, 2006 |
| 7061084 |
Lead-bond type chip package and manufacturing method thereof |
Jun. 13, 2006 |
| 7061090 |
Semiconductor device |
Jun. 13, 2006 |
| 7061091 |
Surface mount package with integral electro-static charge dissipating ring using lead frame as ESD device |
Jun. 13, 2006 |
| 7045899 |
Semiconductor device and fabrication method of the same |
May. 16, 2006 |
| 7030508 |
Substrate for semiconductor package and wire bonding method using thereof |
Apr. 18, 2006 |
| 7030476 |
Rectifier diode device |
Apr. 18, 2006 |
| 7009223 |
Rectification chip terminal structure |
Mar. 7, 2006 |
| 7009293 |
Interconnect substrate, semiconductor device, methods of fabricating, inspecting, and mounting the semiconductor device, circuit board, and electronic instrument |
Mar. 7, 2006 |
| 7005734 |
Double-sided cooling isolated packaged power semiconductor device |
Feb. 28, 2006 |
| 7002237 |
Spherical shaped semiconductor device, a flexible printed wiring substrate, and mounting method thereof |
Feb. 21, 2006 |
| 6998704 |
Semiconductor device and method for manufacturing the same, circuit board, electronic apparatus, and semiconductor device manufacturing apparatus |
Feb. 14, 2006 |
| 6995464 |
Pressure-contact type semiconductor device |
Feb. 7, 2006 |
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