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Class Information
Number: 257/688
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With large area flexible electrodes in press contact with opposite sides of active semiconductor chip and surrounded by an insulating element, e.g., ring
Description: Subject matter wherein the package or housing has two large area electrodes which are in press contact with opposite sides of a semiconductor chip and wherein the electrode edges are surrounded by an electrically insulating medium (e.g., a ring).
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7619304 |
Panel and semiconductor component having a composite board with semiconductor chips and plastic package molding compound and method for the production thereof |
Nov. 17, 2009 |
| 7615477 |
Method of fabricating a BGA package having decreased adhesion |
Nov. 10, 2009 |
| 7615416 |
Secure package with anti-tamper peripheral guard ring |
Nov. 10, 2009 |
| 7608923 |
Electronic device with flexible heat spreader |
Oct. 27, 2009 |
| 7608920 |
Memory card and method for devising |
Oct. 27, 2009 |
| 7605454 |
Memory card and method for devising |
Oct. 20, 2009 |
| 7592693 |
Interconnecting electrical devices |
Sep. 22, 2009 |
| 7586185 |
Semiconductor device having a functional surface |
Sep. 8, 2009 |
| 7573130 |
Crack trapping and arrest in thin film structures |
Aug. 11, 2009 |
| 7560809 |
Semiconductor device |
Jul. 14, 2009 |
| 7545040 |
Copper alloy for wiring, semiconductor device, method for forming wiring and method for manufacturing semiconductor device |
Jun. 9, 2009 |
| 7541671 |
Organic electronic devices having external barrier layer |
Jun. 2, 2009 |
| 7535092 |
Si power device mounted on a substrate including arrangements to prevent damage to connection layers due to heat treatment |
May. 19, 2009 |
| 7531899 |
Ball grid array package |
May. 12, 2009 |
| 7525187 |
Apparatus and method for connecting components |
Apr. 28, 2009 |
| 7511368 |
Carrier device for electronic chip |
Mar. 31, 2009 |
| 7508058 |
Stacked integrated circuit module |
Mar. 24, 2009 |
| 7504670 |
Sealing structure for mounting a semiconductor device to a substrate |
Mar. 17, 2009 |
| 7501695 |
High frequency integrated circuit (HFIC) microsystems assembly and method for fabricating the same |
Mar. 10, 2009 |
| 7498669 |
Semiconductor device |
Mar. 3, 2009 |
| 7485951 |
Modularized die stacking system and method |
Feb. 3, 2009 |
| 7476964 |
High voltage semiconductor device housing with increased clearance between housing can and die for improved flux flushing |
Jan. 13, 2009 |
| 7470986 |
Mounting structure, electro-optical device, and electronic apparatus |
Dec. 30, 2008 |
| 7452754 |
Method for manufacturing flexible printed circuit boards |
Nov. 18, 2008 |
| 7443018 |
Integrated circuit package system including ribbon bond interconnect |
Oct. 28, 2008 |
| 7413975 |
Interconnect substrate, semiconductor device, methods of manufacturing the same, circuit board, and electronic equipment |
Aug. 19, 2008 |
| 7408251 |
Semiconductor packaging device comprising a semiconductor chip including a MOSFET |
Aug. 5, 2008 |
| 7405470 |
Adaptable electronic storage apparatus |
Jul. 29, 2008 |
| 7397066 |
Microelectronic imagers with curved image sensors and methods for manufacturing microelectronic imagers |
Jul. 8, 2008 |
| 7345368 |
Semiconductor device and the manufacturing method for the same |
Mar. 18, 2008 |
| 7335975 |
Integrated circuit stacking system and method |
Feb. 26, 2008 |
| 7335970 |
Semiconductor device having a chip-size package |
Feb. 26, 2008 |
| 7327022 |
Assembly, contact and coupling interconnection for optoelectronics |
Feb. 5, 2008 |
| 7312520 |
Interface module for connecting LSI packages, and LSI-incorporating apparatus |
Dec. 25, 2007 |
| 7294919 |
Device having a complaint element pressed between substrates |
Nov. 13, 2007 |
| 7291907 |
Chip stack employing a flex circuit |
Nov. 6, 2007 |
| 7291904 |
Downsized package for electric wave device |
Nov. 6, 2007 |
| 7282749 |
Organic electroluminescent device and method of fabricating the same |
Oct. 16, 2007 |
| 7276792 |
Semiconductor device, circuit substrate, electro-optic device and electronic appliance |
Oct. 2, 2007 |
| 7268423 |
Flexible rewiring plate for semiconductor components, and process for producing it |
Sep. 11, 2007 |
| 7268417 |
Card-type circuit device |
Sep. 11, 2007 |
| 7253514 |
Self-supporting connecting element for a semiconductor chip |
Aug. 7, 2007 |
| 7242085 |
Semiconductor device including a semiconductor chip mounted on a metal base |
Jul. 10, 2007 |
| 7221047 |
Pressure-contact type semiconductor device |
May. 22, 2007 |
| 7205650 |
Composite devices of laminate type and processes |
Apr. 17, 2007 |
| 7196412 |
Multi-chip press-connected type semiconductor device |
Mar. 27, 2007 |
| 7190061 |
stack package made of chip scale packages |
Mar. 13, 2007 |
| 7180197 |
Semiconductor device containing stacked semiconductor chips and manufacturing method thereof |
Feb. 20, 2007 |
| 7173325 |
Expansion constrained die stack |
Feb. 6, 2007 |
| 7173328 |
Integrated circuit package and method having wire-bonded intra-die electrical connections |
Feb. 6, 2007 |
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