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Class Information
Number: 257/687
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > Housing or package filled with solid or liquid electrically insulating material
Description: Subject matter wherein the housing or package is filled with a solid or liquid electrically insulating material.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7615870 |
Semiconductor device, manufacturing method thereof, and connection method of circuit board |
Nov. 10, 2009 |
| 7607560 |
Semiconductor die attachment for high vacuum tubes |
Oct. 27, 2009 |
| 7598604 |
Low profile semiconductor package |
Oct. 6, 2009 |
| 7589403 |
Lead structure for a semiconductor component and method for producing the same |
Sep. 15, 2009 |
| 7589420 |
Print head with reduced bonding stress and method |
Sep. 15, 2009 |
| 7586185 |
Semiconductor device having a functional surface |
Sep. 8, 2009 |
| 7586193 |
Mm-wave antenna using conventional IC packaging |
Sep. 8, 2009 |
| 7567599 |
Semiconductor laser diode device with thermal conductive encapsulating resin and method for manufacturing the same |
Jul. 28, 2009 |
| 7534662 |
Methods for hermetic sealing of post media-filled MEMS package |
May. 19, 2009 |
| 7531229 |
Microstructured component and method for its manufacture |
May. 12, 2009 |
| 7528472 |
Chip package mechanism |
May. 5, 2009 |
| 7528469 |
Semiconductor equipment having multiple semiconductor devices and multiple lead frames |
May. 5, 2009 |
| 7514289 |
Methods and structures for facilitating proximity communication |
Apr. 7, 2009 |
| 7514777 |
Power semiconductor module |
Apr. 7, 2009 |
| 7504670 |
Sealing structure for mounting a semiconductor device to a substrate |
Mar. 17, 2009 |
| 7495328 |
Micromechanical component |
Feb. 24, 2009 |
| 7489031 |
High power radiation emitter device and heat dissipating package for electronic components |
Feb. 10, 2009 |
| 7482683 |
Integrated circuit encapsulation system with vent |
Jan. 27, 2009 |
| 7482686 |
Multipiece apparatus for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages and method of making the same |
Jan. 27, 2009 |
| 7476955 |
Die package having an adhesive flow restriction area |
Jan. 13, 2009 |
| 7473992 |
Multi-layer interconnection circuit module and manufacturing method thereof |
Jan. 6, 2009 |
| 7452754 |
Method for manufacturing flexible printed circuit boards |
Nov. 18, 2008 |
| 7449363 |
Semiconductor package substrate with embedded chip and fabrication method thereof |
Nov. 11, 2008 |
| 7442653 |
Inter-metal dielectric of semiconductor device and manufacturing method thereof including plasma treating a plasma enhanced fluorosilicate glass |
Oct. 28, 2008 |
| 7428255 |
Semiconductor laser |
Sep. 23, 2008 |
| 7417309 |
Circuit device and portable device with symmetrical arrangement |
Aug. 26, 2008 |
| 7408251 |
Semiconductor packaging device comprising a semiconductor chip including a MOSFET |
Aug. 5, 2008 |
| 7405469 |
Semiconductor device and method of manufacturing the same |
Jul. 29, 2008 |
| 7402900 |
Semiconductor device substrate, semiconductor device, and manufacturing method thereof |
Jul. 22, 2008 |
| 7397140 |
Chip module |
Jul. 8, 2008 |
| 7381996 |
Low thermal resistance LED package |
Jun. 3, 2008 |
| 7375433 |
Semiconductor device packaging substrate and semiconductor device packaging structure |
May. 20, 2008 |
| 7368319 |
Stacked integrated circuit package-in-package system |
May. 6, 2008 |
| 7364778 |
Container for an electronic component |
Apr. 29, 2008 |
| 7355275 |
Chip package and fabricating method thereof |
Apr. 8, 2008 |
| 7348681 |
Electronic component and manufacturing method of the electronic component |
Mar. 25, 2008 |
| 7344919 |
Method for using gel package structure enhancing thermal dissipation between compressed printed circuit board and heat sink mechanical stiffener |
Mar. 18, 2008 |
| 7342802 |
Multilayer wiring board for an electronic device |
Mar. 11, 2008 |
| 7332784 |
Method of providing an optoelectronic element with a non-protruding lens |
Feb. 19, 2008 |
| 7332806 |
Thin, thermally enhanced molded package with leadframe having protruding region |
Feb. 19, 2008 |
| 7327592 |
Self-identifying stacked die semiconductor components |
Feb. 5, 2008 |
| 7320902 |
Electronic device and method of manufacturing the same, chip carrier, circuit board, and electronic instrument |
Jan. 22, 2008 |
| 7309919 |
Sealing apparatus for semiconductor wafer, mold of sealing apparatus, and semiconductor wafer |
Dec. 18, 2007 |
| 7307773 |
Micro-optoelectromechanical system packages for a light modulator and methods of making the same |
Dec. 11, 2007 |
| 7298039 |
Electronic circuit device |
Nov. 20, 2007 |
| 7288843 |
Integrated circuit chip support substrate for placing in a mold, and associated method |
Oct. 30, 2007 |
| 7279781 |
Two-stage transfer molding device to encapsulate MMC module |
Oct. 9, 2007 |
| 7274097 |
Semiconductor package including redistribution pattern and method of manufacturing the same |
Sep. 25, 2007 |
| 7265453 |
Semiconductor component having dummy segments with trapped corner air |
Sep. 4, 2007 |
| 7247519 |
Method for making a semiconductor multi-package module having inverted bump chip carrier second package |
Jul. 24, 2007 |
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