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Class Information
Number: 257/687
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > Housing or package filled with solid or liquid electrically insulating material
Description: Subject matter wherein the housing or package is filled with a solid or liquid electrically insulating material.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7452754 |
Method for manufacturing flexible printed circuit boards |
Nov. 18, 2008 |
| 7449363 |
Semiconductor package substrate with embedded chip and fabrication method thereof |
Nov. 11, 2008 |
| 7442653 |
Inter-metal dielectric of semiconductor device and manufacturing method thereof including plasma treating a plasma enhanced fluorosilicate glass |
Oct. 28, 2008 |
| 7428255 |
Semiconductor laser |
Sep. 23, 2008 |
| 7417309 |
Circuit device and portable device with symmetrical arrangement |
Aug. 26, 2008 |
| 7408251 |
Semiconductor packaging device comprising a semiconductor chip including a MOSFET |
Aug. 5, 2008 |
| 7405469 |
Semiconductor device and method of manufacturing the same |
Jul. 29, 2008 |
| 7402900 |
Semiconductor device substrate, semiconductor device, and manufacturing method thereof |
Jul. 22, 2008 |
| 7397140 |
Chip module |
Jul. 8, 2008 |
| 7381996 |
Low thermal resistance LED package |
Jun. 3, 2008 |
| 7375433 |
Semiconductor device packaging substrate and semiconductor device packaging structure |
May. 20, 2008 |
| 7368319 |
Stacked integrated circuit package-in-package system |
May. 6, 2008 |
| 7364778 |
Container for an electronic component |
Apr. 29, 2008 |
| 7355275 |
Chip package and fabricating method thereof |
Apr. 8, 2008 |
| 7348681 |
Electronic component and manufacturing method of the electronic component |
Mar. 25, 2008 |
| 7344919 |
Method for using gel package structure enhancing thermal dissipation between compressed printed circuit board and heat sink mechanical stiffener |
Mar. 18, 2008 |
| 7342802 |
Multilayer wiring board for an electronic device |
Mar. 11, 2008 |
| 7332784 |
Method of providing an optoelectronic element with a non-protruding lens |
Feb. 19, 2008 |
| 7332806 |
Thin, thermally enhanced molded package with leadframe having protruding region |
Feb. 19, 2008 |
| 7327592 |
Self-identifying stacked die semiconductor components |
Feb. 5, 2008 |
| 7320902 |
Electronic device and method of manufacturing the same, chip carrier, circuit board, and electronic instrument |
Jan. 22, 2008 |
| 7309919 |
Sealing apparatus for semiconductor wafer, mold of sealing apparatus, and semiconductor wafer |
Dec. 18, 2007 |
| 7307773 |
Micro-optoelectromechanical system packages for a light modulator and methods of making the same |
Dec. 11, 2007 |
| 7298039 |
Electronic circuit device |
Nov. 20, 2007 |
| 7288843 |
Integrated circuit chip support substrate for placing in a mold, and associated method |
Oct. 30, 2007 |
| 7279781 |
Two-stage transfer molding device to encapsulate MMC module |
Oct. 9, 2007 |
| 7274097 |
Semiconductor package including redistribution pattern and method of manufacturing the same |
Sep. 25, 2007 |
| 7265453 |
Semiconductor component having dummy segments with trapped corner air |
Sep. 4, 2007 |
| 7247519 |
Method for making a semiconductor multi-package module having inverted bump chip carrier second package |
Jul. 24, 2007 |
| 7245500 |
Ball grid array package with stepped stiffener layer |
Jul. 17, 2007 |
| 7235871 |
Stacked microelectronic dies |
Jun. 26, 2007 |
| 7230331 |
Chip package structure and process for fabricating the same |
Jun. 12, 2007 |
| 7224044 |
Semiconductor chip mounting substrate and flat display |
May. 29, 2007 |
| 7221004 |
Semiconductor module |
May. 22, 2007 |
| 7221047 |
Pressure-contact type semiconductor device |
May. 22, 2007 |
| 7218000 |
Liquid solder thermal interface material contained within a cold-formed barrier and methods of making same |
May. 15, 2007 |
| 7208828 |
Semiconductor package with wire bonded stacked dice and multi-layer metal bumps |
Apr. 24, 2007 |
| 7208827 |
Encasing arrangement for a semiconductor component |
Apr. 24, 2007 |
| 7208826 |
Semiconductor device and method of manufacturing the same |
Apr. 24, 2007 |
| 7202556 |
Semiconductor package having substrate with multi-layer metal bumps |
Apr. 10, 2007 |
| 7196406 |
ESD protection apparatus for an electrical device |
Mar. 27, 2007 |
| 7193311 |
Multi-chip circuit module and method for producing the same |
Mar. 20, 2007 |
| 7185426 |
Method of manufacturing a semiconductor package |
Mar. 6, 2007 |
| 7186629 |
Protecting thin semiconductor wafers during back-grinding in high-volume production |
Mar. 6, 2007 |
| 7187074 |
Semiconductor and electronic device with spring terminal |
Mar. 6, 2007 |
| 7183629 |
Metal line having an increased resistance to electromigration along an interface of a dielectric barrier layer by implanting material into the metal line |
Feb. 27, 2007 |
| 7183634 |
Printed circuit board tact switch |
Feb. 27, 2007 |
| 7180197 |
Semiconductor device containing stacked semiconductor chips and manufacturing method thereof |
Feb. 20, 2007 |
| 7180064 |
Infrared sensor package |
Feb. 20, 2007 |
| 7176567 |
Semiconductor device protective structure and method for fabricating the same |
Feb. 13, 2007 |
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