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Browse by Category: Main > Physics
Class Information
Number: 257/687
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > Housing or package filled with solid or liquid electrically insulating material
Description: Subject matter wherein the housing or package is filled with a solid or liquid electrically insulating material.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8710634 Integrated circuit packaging system with an integral-interposer-structure and method of manufacture thereof Apr. 29, 2014
8710643 Electronic package with fluid flow barriers Apr. 29, 2014
8710644 Semiconductor unit having a power semiconductor and semiconductor apparatus using the same Apr. 29, 2014
8710654 Semiconductor device and manufacturing method thereof Apr. 29, 2014
8692363 Electric part package and manufacturing method thereof Apr. 8, 2014
8685792 Integrated circuit package system with interposer Apr. 1, 2014
8686553 Semiconductor device and a method of manufacturing the same Apr. 1, 2014
8680692 Carrier, semiconductor package and fabrication method thereof Mar. 25, 2014
8670246 Computers including an undiced semiconductor wafer with Faraday Cages and internal flexibility sipes Mar. 11, 2014
8664757 High density chip stacked package, package-on-package and method of fabricating the same Mar. 4, 2014
8653636 Contactless communication medium Feb. 18, 2014
8650748 Universal chip carrier and method Feb. 18, 2014
8642388 Method for manufacturing light emitting diodes including forming circuit structures with a connecting section Feb. 4, 2014
8642408 Semiconductor device Feb. 4, 2014
8637971 Semiconductor device and method of manufacturing semiconductor device Jan. 28, 2014
8637970 Chip package and fabrication method thereof Jan. 28, 2014
8637943 Multi-axis integrated MEMS devices with CMOS circuits and method therefor Jan. 28, 2014
8624364 Integrated circuit packaging system with encapsulation connector and method of manufacture thereof Jan. 7, 2014
8618669 Combination substrate Dec. 31, 2013
8604361 Component package for maintaining safe operating temperature of components Dec. 10, 2013
8587105 Semiconductor device Nov. 19, 2013
8558367 Semiconductor module Oct. 15, 2013
8551813 Wafer level IC assembly method Oct. 8, 2013
8546926 Power converter Oct. 1, 2013
8536694 Semiconductor device Sep. 17, 2013
8535979 Method for manufacturing substrate for semiconductor element Sep. 17, 2013
8536691 Semiconductor device and method for manufacturing the same Sep. 17, 2013
8531022 Routable array metal integrated circuit package Sep. 10, 2013
8525295 Semiconductor device Sep. 3, 2013
8525321 Conductive chip disposed on lead semiconductor package Sep. 3, 2013
8513823 Semiconductor package having main stamp and sub-stamp Aug. 20, 2013
8508030 LED module Aug. 13, 2013
8498171 Distributed semiconductor device methods, apparatus, and systems Jul. 30, 2013
8497560 LED package and method of assembling the same Jul. 30, 2013
8482110 Electronic assemblies without solder and methods for their manufacture Jul. 9, 2013
8482113 Semiconductor device Jul. 9, 2013
8472232 Self-identifying stacked die semiconductor components Jun. 25, 2013
8471289 Semiconductor laser device, optical pickup device and semiconductor device Jun. 25, 2013
8466568 Multi-component device integrated into a matrix Jun. 18, 2013
8440916 Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method May. 14, 2013
8441114 Electronic circuit composed of sub-circuits and method for producing May. 14, 2013
8436453 Micromechanical device lubrication May. 7, 2013
8421203 Integrated circuit packaging system with foldable substrate and method of manufacture thereof Apr. 16, 2013
8421214 Semiconductor device and method for manufacturing a semiconductor device Apr. 16, 2013
8399992 Package-on-package type semiconductor package Mar. 19, 2013
8394678 Semiconductor chip stacked body and method of manufacturing the same Mar. 12, 2013
8395252 Integrated MEMS and CMOS package and method Mar. 12, 2013
8390108 Integrated circuit packaging system with stacking interconnect and method of manufacture thereof Mar. 5, 2013
8384203 Packaging structural member Feb. 26, 2013
8378472 Mounting structure for semiconductor element with underfill resin Feb. 19, 2013

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