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Browse by Category: Main > Physics
Class Information
Number: 257/686
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > Multiple housings > Stacked arrangement
Description: Subject matter wherein a plurality of housings are placed one upon another, vertically.


Patents under this class:

Patent Number Title Of Patent Date Issued
7619314 Integrated circuit package system including die stacking Nov. 17, 2009
7619305 Semiconductor package-on-package (POP) device avoiding crack at solder joints of micro contacts during package stacking Nov. 17, 2009
7618848 Integrated circuit package system with supported stacked die Nov. 17, 2009
7615859 Thin semiconductor package having stackable lead frame and method of manufacturing the same Nov. 10, 2009
7615858 Stacked-type semiconductor device package Nov. 10, 2009
7615857 Modular three-dimensional chip multiprocessor Nov. 10, 2009
7615856 Integrated antenna type circuit apparatus Nov. 10, 2009
7615853 Chip-stacked package structure having leadframe with multi-piece bus bar Nov. 10, 2009
7612444 Semiconductor package with flow controller Nov. 3, 2009
7612439 Semiconductor package having improved thermal performance Nov. 3, 2009
7612434 Electronic device having wiring substrate and lead frame Nov. 3, 2009
7608924 Liquid cooled power electronic circuit comprising stacked direct die cooled packages Oct. 27, 2009
7608921 Multi-layer semiconductor package Oct. 27, 2009
7608920 Memory card and method for devising Oct. 27, 2009
7608919 Interconnect packaging systems Oct. 27, 2009
7605478 Semiconductor package and method of manufacturing the same Oct. 20, 2009
7605477 Stacked integrated circuit assembly Oct. 20, 2009
7605476 Stacked die semiconductor package Oct. 20, 2009
7605459 Coreless substrate and manufacturing thereof Oct. 20, 2009
7605458 Method and apparatus for integrating capacitors in stacked integrated circuits Oct. 20, 2009
7605457 Semiconductor device and method of manufacturing the same Oct. 20, 2009
7605454 Memory card and method for devising Oct. 20, 2009
7602630 Configurable inputs and outputs for memory stacking system and method Oct. 13, 2009
7602057 Signal light using phosphor coated LEDs Oct. 13, 2009
7598619 Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board Oct. 6, 2009
7598618 Semiconductor device Oct. 6, 2009
7598617 Stack package utilizing through vias and re-distribution lines Oct. 6, 2009
7598607 Semiconductor packages with enhanced joint reliability and methods of fabricating the same Oct. 6, 2009
7598606 Integrated circuit package system with die and package combination Oct. 6, 2009
7598605 Semiconductor device having capacitive insulation means and communication terminal using the device Oct. 6, 2009
7598604 Low profile semiconductor package Oct. 6, 2009
7598523 Test structures for stacking dies having through-silicon vias Oct. 6, 2009
7598123 Semiconductor component and method of manufacture Oct. 6, 2009
7595552 Stacked semiconductor package in which semiconductor packages are connected using a connector Sep. 29, 2009
7595551 Semiconductor package for a large die Sep. 29, 2009
7592709 Board on chip package and method of manufacturing the same Sep. 22, 2009
7592707 Method and apparatus for facilitating proximity communication and power delivery Sep. 22, 2009
7592700 Semiconductor chip and method of manufacturing semiconductor chip Sep. 22, 2009
7592693 Interconnecting electrical devices Sep. 22, 2009
7592692 Semiconductor device with a dummy electrode Sep. 22, 2009
7592691 High density stacked die assemblies, structures incorporated therein and methods of fabricating the assemblies Sep. 22, 2009
7592690 Semiconductor device including semiconductor elements mounted on base plate Sep. 22, 2009
7592689 Semiconductor module comprising semiconductor chips and method for producing the same Sep. 22, 2009
7589410 Molded reconfigured wafer, stack package using the same, and method for manufacturing the stack package Sep. 15, 2009
7589409 Stacked packages and microelectronic assemblies incorporating the same Sep. 15, 2009
7589408 Stackable semiconductor package Sep. 15, 2009
7589407 Semiconductor multipackage module including tape substrate land grid array package stacked over ball grid array package Sep. 15, 2009
7589406 Stacked semiconductor component Sep. 15, 2009
7588964 Methods of stacking semiconductor devices and methods of fabricating semiconductor device packages using the same Sep. 15, 2009
7586184 Electronic package Sep. 8, 2009



 
 
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