| |
 |
|
Class Information
Number: 257/686
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > Multiple housings > Stacked arrangement
Description: Subject matter wherein a plurality of housings are placed one upon another, vertically.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7459777 |
Semiconductor package containing multi-layered semiconductor chips |
Dec. 2, 2008 |
| 7459776 |
Stacked die assembly having semiconductor die projecting beyond support |
Dec. 2, 2008 |
| 7459774 |
Stacked chip package using photosensitive polymer and manufacturing method thereof |
Dec. 2, 2008 |
| 7459773 |
Stackable ball grid array |
Dec. 2, 2008 |
| 7459772 |
Face-to-face bonded I/O circuit die and functional logic circuit die system |
Dec. 2, 2008 |
| 7456495 |
Semiconductor module with a semiconductor stack, and methods for its production |
Nov. 25, 2008 |
| 7453153 |
Circuit device |
Nov. 18, 2008 |
| 7452754 |
Method for manufacturing flexible printed circuit boards |
Nov. 18, 2008 |
| 7452751 |
Semiconductor device and method of manufacturing the same |
Nov. 18, 2008 |
| 7449773 |
Microelectromechanical device packages with integral heaters |
Nov. 11, 2008 |
| 7446404 |
Three-dimensional package and method of making the same |
Nov. 4, 2008 |
| 7446403 |
Carrier structure stacking system and method |
Nov. 4, 2008 |
| 7446396 |
Stacked integrated circuit leadframe package system |
Nov. 4, 2008 |
| 7443037 |
Stacked integrated circuit package system with connection protection |
Oct. 28, 2008 |
| 7443014 |
Electronic module and method of assembling the same |
Oct. 28, 2008 |
| 7439620 |
Integrated circuit package-in-package system |
Oct. 21, 2008 |
| 7436071 |
Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board |
Oct. 14, 2008 |
| 7436055 |
Packaging method of a plurality of chips stacked on each other and package structure thereof |
Oct. 14, 2008 |
| 7436054 |
MEMS microphone with a stacked PCB package and method of producing the same |
Oct. 14, 2008 |
| 7435619 |
Method of fabricating a 3-D package stacking system |
Oct. 14, 2008 |
| 7432600 |
System having semiconductor component with multiple stacked dice |
Oct. 7, 2008 |
| 7432599 |
Memory module having interconnected and stacked integrated circuits |
Oct. 7, 2008 |
| 7432593 |
Semiconductor package assembly and method for electrically isolating modules |
Oct. 7, 2008 |
| 7432588 |
Semiconductor device and method of fabricating the same |
Oct. 7, 2008 |
| 7432587 |
Integrated device including connections on a separate wafer |
Oct. 7, 2008 |
| 7429792 |
Stack package with vertically formed heat sink |
Sep. 30, 2008 |
| 7429788 |
Thin multichip flex-module |
Sep. 30, 2008 |
| 7429787 |
Semiconductor assembly including chip scale package and second substrate with exposed surfaces on upper and lower sides |
Sep. 30, 2008 |
| 7429786 |
Semiconductor package including second substrate and having exposed substrate surfaces on upper and lower sides |
Sep. 30, 2008 |
| 7429785 |
Stacked integrated circuit chip assembly |
Sep. 30, 2008 |
| 7429784 |
Package structure |
Sep. 30, 2008 |
| 7429782 |
Semiconductor stack block comprising semiconductor chips and methods for producing the same |
Sep. 30, 2008 |
| 7427810 |
Semiconductor device including semiconductor element mounted on another semiconductor element |
Sep. 23, 2008 |
| 7425758 |
Metal core foldover package structures |
Sep. 16, 2008 |
| 7423339 |
Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice |
Sep. 9, 2008 |
| 7423338 |
Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice |
Sep. 9, 2008 |
| 7423337 |
Integrated circuit device package having a support coating for improved reliability during temperature cycling |
Sep. 9, 2008 |
| 7423336 |
Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devices |
Sep. 9, 2008 |
| 7423335 |
Sensor module package structure and method of the same |
Sep. 9, 2008 |
| 7420814 |
Package stack and manufacturing method thereof |
Sep. 2, 2008 |
| 7420269 |
Stacked integrated circuit package-in-package system |
Sep. 2, 2008 |
| 7420268 |
Semiconductor chip package and application device thereof |
Sep. 2, 2008 |
| 7420129 |
Semiconductor package including a semiconductor device, and method of manufacturing the same |
Sep. 2, 2008 |
| 7417308 |
Stack type package module and method for manufacturing the same |
Aug. 26, 2008 |
| 7417293 |
Image sensor packaging structure |
Aug. 26, 2008 |
| 7414505 |
High frequency inductor having low inductance and low inductance variation and method of manufacturing the same |
Aug. 19, 2008 |
| 7414305 |
Carrier for stacked type semiconductor device and method of fabricating stacked type semiconductor devices |
Aug. 19, 2008 |
| 7413928 |
Die-wafer package and method of fabricating same |
Aug. 19, 2008 |
| 7411286 |
Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice |
Aug. 12, 2008 |
| 7411285 |
Low profile stacked semiconductor chip package |
Aug. 12, 2008 |
|
|
|
