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Browse by Category: Main > Physics
Class Information
Number: 257/686
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > Multiple housings > Stacked arrangement
Description: Subject matter wherein a plurality of housings are placed one upon another, vertically.










Patents under this class:

Patent Number Title Of Patent Date Issued
8710677 Multi-chip package with a supporting member and method of manufacturing the same Apr. 29, 2014
8710676 Stacked structure and stacked method for three-dimensional chip Apr. 29, 2014
8710675 Integrated circuit package system with bonding lands Apr. 29, 2014
8710663 Method of manufacturing semiconductor device and semiconductor device Apr. 29, 2014
8710655 Die packages and systems having the die packages Apr. 29, 2014
8710654 Semiconductor device and manufacturing method thereof Apr. 29, 2014
8710653 Chip on chip semiconductor device including an underfill layer having a resin containing an amine-based curing agent Apr. 29, 2014
8710644 Semiconductor unit having a power semiconductor and semiconductor apparatus using the same Apr. 29, 2014
8710642 Semiconductor device, method of manufacturing semiconductor device, and electronic apparatus Apr. 29, 2014
8710641 Combination for composite layered chip package Apr. 29, 2014
8710640 Integrated circuit packaging system with heat slug and method of manufacture thereof Apr. 29, 2014
8709932 Integrated circuit packaging system with interconnects and method of manufacture thereof Apr. 29, 2014
8704384 Stacked die assembly Apr. 22, 2014
8704381 Very extremely thin semiconductor package Apr. 22, 2014
8704380 Methods for wafer-level packaging of microfeature devices and microfeature devices formed using such methods Apr. 22, 2014
8704379 Semiconductor die mount by conformal die coating Apr. 22, 2014
8704354 Package on package structures and methods for forming the same Apr. 22, 2014
8704353 Thermal management of stacked semiconductor chips with electrically non-functional interconnects Apr. 22, 2014
8704352 Semiconductor device having a liquid cooling module Apr. 22, 2014
8704351 Stacked microelectronic assemblies Apr. 22, 2014
8704350 Stacked wafer level package and method of manufacturing the same Apr. 22, 2014
8704349 Integrated circuit package system with exposed interconnects Apr. 22, 2014
8693209 Wiring board and method for manufacturing the same Apr. 8, 2014
8693203 Method of making an electronic device having a liquid crystal polymer solder mask laminated to an interconnect layer stack and related devices Apr. 8, 2014
8692387 Stacked die semiconductor package Apr. 8, 2014
8692365 Integrated circuit packaging system with thermal dispersal structures and method of manufacture thereof Apr. 8, 2014
8692362 Semiconductor structure having conductive vias and method for manufacturing the same Apr. 8, 2014
8692134 Brace for long wire bond Apr. 8, 2014
8686571 Bonding layer structure and method for wafer to wafer bonding Apr. 1, 2014
8686569 Die arrangement and method of forming a die arrangement Apr. 1, 2014
8686559 Semiconductor chip stacking for redundancy and yield improvement Apr. 1, 2014
8686552 Multilevel IC package using interconnect springs Apr. 1, 2014
8686551 Substrate for a microelectronic package and method of fabricating thereof Apr. 1, 2014
8686550 Method and apparatus for high pressure sensor device Apr. 1, 2014
8686549 Reconfigurable elements Apr. 1, 2014
8686546 Combined packaged power semiconductor device Apr. 1, 2014
8686537 Apparatus and methods for reducing impact of high RF loss plating Apr. 1, 2014
8686475 Reconfigurable elements Apr. 1, 2014
8686428 Semiconductor device and structure Apr. 1, 2014
8685796 Electronic device and method of manufacturing the same Apr. 1, 2014
8685793 Chip assembly having via interconnects joined by plating Apr. 1, 2014
8685792 Integrated circuit package system with interposer Apr. 1, 2014
8680667 Semiconductor devices, package substrates, semiconductor packages, package stack structures, and electronic systems having functionally asymmetric conductive elements Mar. 25, 2014
8680654 Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods Mar. 25, 2014
8680652 Stack package Mar. 25, 2014
8679896 DC/DC converter power module package incorporating a stacked controller and construction methodology Mar. 25, 2014
8674518 Chip package and method for forming the same Mar. 18, 2014
8674515 3D integrated circuits structure Mar. 18, 2014
8674510 Three-dimensional integrated circuit structure having improved power and thermal management Mar. 18, 2014
8674494 Semiconductor package having supporting plate and method of forming the same Mar. 18, 2014











 
 
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