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Class Information
Number: 257/686
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > Multiple housings > Stacked arrangement
Description: Subject matter wherein a plurality of housings are placed one upon another, vertically.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7619314 |
Integrated circuit package system including die stacking |
Nov. 17, 2009 |
| 7619305 |
Semiconductor package-on-package (POP) device avoiding crack at solder joints of micro contacts during package stacking |
Nov. 17, 2009 |
| 7618848 |
Integrated circuit package system with supported stacked die |
Nov. 17, 2009 |
| 7615859 |
Thin semiconductor package having stackable lead frame and method of manufacturing the same |
Nov. 10, 2009 |
| 7615858 |
Stacked-type semiconductor device package |
Nov. 10, 2009 |
| 7615857 |
Modular three-dimensional chip multiprocessor |
Nov. 10, 2009 |
| 7615856 |
Integrated antenna type circuit apparatus |
Nov. 10, 2009 |
| 7615853 |
Chip-stacked package structure having leadframe with multi-piece bus bar |
Nov. 10, 2009 |
| 7612444 |
Semiconductor package with flow controller |
Nov. 3, 2009 |
| 7612439 |
Semiconductor package having improved thermal performance |
Nov. 3, 2009 |
| 7612434 |
Electronic device having wiring substrate and lead frame |
Nov. 3, 2009 |
| 7608924 |
Liquid cooled power electronic circuit comprising stacked direct die cooled packages |
Oct. 27, 2009 |
| 7608921 |
Multi-layer semiconductor package |
Oct. 27, 2009 |
| 7608920 |
Memory card and method for devising |
Oct. 27, 2009 |
| 7608919 |
Interconnect packaging systems |
Oct. 27, 2009 |
| 7605478 |
Semiconductor package and method of manufacturing the same |
Oct. 20, 2009 |
| 7605477 |
Stacked integrated circuit assembly |
Oct. 20, 2009 |
| 7605476 |
Stacked die semiconductor package |
Oct. 20, 2009 |
| 7605459 |
Coreless substrate and manufacturing thereof |
Oct. 20, 2009 |
| 7605458 |
Method and apparatus for integrating capacitors in stacked integrated circuits |
Oct. 20, 2009 |
| 7605457 |
Semiconductor device and method of manufacturing the same |
Oct. 20, 2009 |
| 7605454 |
Memory card and method for devising |
Oct. 20, 2009 |
| 7602630 |
Configurable inputs and outputs for memory stacking system and method |
Oct. 13, 2009 |
| 7602057 |
Signal light using phosphor coated LEDs |
Oct. 13, 2009 |
| 7598619 |
Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board |
Oct. 6, 2009 |
| 7598618 |
Semiconductor device |
Oct. 6, 2009 |
| 7598617 |
Stack package utilizing through vias and re-distribution lines |
Oct. 6, 2009 |
| 7598607 |
Semiconductor packages with enhanced joint reliability and methods of fabricating the same |
Oct. 6, 2009 |
| 7598606 |
Integrated circuit package system with die and package combination |
Oct. 6, 2009 |
| 7598605 |
Semiconductor device having capacitive insulation means and communication terminal using the device |
Oct. 6, 2009 |
| 7598604 |
Low profile semiconductor package |
Oct. 6, 2009 |
| 7598523 |
Test structures for stacking dies having through-silicon vias |
Oct. 6, 2009 |
| 7598123 |
Semiconductor component and method of manufacture |
Oct. 6, 2009 |
| 7595552 |
Stacked semiconductor package in which semiconductor packages are connected using a connector |
Sep. 29, 2009 |
| 7595551 |
Semiconductor package for a large die |
Sep. 29, 2009 |
| 7592709 |
Board on chip package and method of manufacturing the same |
Sep. 22, 2009 |
| 7592707 |
Method and apparatus for facilitating proximity communication and power delivery |
Sep. 22, 2009 |
| 7592700 |
Semiconductor chip and method of manufacturing semiconductor chip |
Sep. 22, 2009 |
| 7592693 |
Interconnecting electrical devices |
Sep. 22, 2009 |
| 7592692 |
Semiconductor device with a dummy electrode |
Sep. 22, 2009 |
| 7592691 |
High density stacked die assemblies, structures incorporated therein and methods of fabricating the assemblies |
Sep. 22, 2009 |
| 7592690 |
Semiconductor device including semiconductor elements mounted on base plate |
Sep. 22, 2009 |
| 7592689 |
Semiconductor module comprising semiconductor chips and method for producing the same |
Sep. 22, 2009 |
| 7589410 |
Molded reconfigured wafer, stack package using the same, and method for manufacturing the stack package |
Sep. 15, 2009 |
| 7589409 |
Stacked packages and microelectronic assemblies incorporating the same |
Sep. 15, 2009 |
| 7589408 |
Stackable semiconductor package |
Sep. 15, 2009 |
| 7589407 |
Semiconductor multipackage module including tape substrate land grid array package stacked over ball grid array package |
Sep. 15, 2009 |
| 7589406 |
Stacked semiconductor component |
Sep. 15, 2009 |
| 7588964 |
Methods of stacking semiconductor devices and methods of fabricating semiconductor device packages using the same |
Sep. 15, 2009 |
| 7586184 |
Electronic package |
Sep. 8, 2009 |
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