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Browse by Category: Main > Physics
Class Information
Number: 257/686
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > Multiple housings > Stacked arrangement
Description: Subject matter wherein a plurality of housings are placed one upon another, vertically.


Patents under this class:

Patent Number Title Of Patent Date Issued
7459777 Semiconductor package containing multi-layered semiconductor chips Dec. 2, 2008
7459776 Stacked die assembly having semiconductor die projecting beyond support Dec. 2, 2008
7459774 Stacked chip package using photosensitive polymer and manufacturing method thereof Dec. 2, 2008
7459773 Stackable ball grid array Dec. 2, 2008
7459772 Face-to-face bonded I/O circuit die and functional logic circuit die system Dec. 2, 2008
7456495 Semiconductor module with a semiconductor stack, and methods for its production Nov. 25, 2008
7453153 Circuit device Nov. 18, 2008
7452754 Method for manufacturing flexible printed circuit boards Nov. 18, 2008
7452751 Semiconductor device and method of manufacturing the same Nov. 18, 2008
7449773 Microelectromechanical device packages with integral heaters Nov. 11, 2008
7446404 Three-dimensional package and method of making the same Nov. 4, 2008
7446403 Carrier structure stacking system and method Nov. 4, 2008
7446396 Stacked integrated circuit leadframe package system Nov. 4, 2008
7443037 Stacked integrated circuit package system with connection protection Oct. 28, 2008
7443014 Electronic module and method of assembling the same Oct. 28, 2008
7439620 Integrated circuit package-in-package system Oct. 21, 2008
7436071 Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board Oct. 14, 2008
7436055 Packaging method of a plurality of chips stacked on each other and package structure thereof Oct. 14, 2008
7436054 MEMS microphone with a stacked PCB package and method of producing the same Oct. 14, 2008
7435619 Method of fabricating a 3-D package stacking system Oct. 14, 2008
7432600 System having semiconductor component with multiple stacked dice Oct. 7, 2008
7432599 Memory module having interconnected and stacked integrated circuits Oct. 7, 2008
7432593 Semiconductor package assembly and method for electrically isolating modules Oct. 7, 2008
7432588 Semiconductor device and method of fabricating the same Oct. 7, 2008
7432587 Integrated device including connections on a separate wafer Oct. 7, 2008
7429792 Stack package with vertically formed heat sink Sep. 30, 2008
7429788 Thin multichip flex-module Sep. 30, 2008
7429787 Semiconductor assembly including chip scale package and second substrate with exposed surfaces on upper and lower sides Sep. 30, 2008
7429786 Semiconductor package including second substrate and having exposed substrate surfaces on upper and lower sides Sep. 30, 2008
7429785 Stacked integrated circuit chip assembly Sep. 30, 2008
7429784 Package structure Sep. 30, 2008
7429782 Semiconductor stack block comprising semiconductor chips and methods for producing the same Sep. 30, 2008
7427810 Semiconductor device including semiconductor element mounted on another semiconductor element Sep. 23, 2008
7425758 Metal core foldover package structures Sep. 16, 2008
7423339 Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice Sep. 9, 2008
7423338 Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice Sep. 9, 2008
7423337 Integrated circuit device package having a support coating for improved reliability during temperature cycling Sep. 9, 2008
7423336 Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devices Sep. 9, 2008
7423335 Sensor module package structure and method of the same Sep. 9, 2008
7420814 Package stack and manufacturing method thereof Sep. 2, 2008
7420269 Stacked integrated circuit package-in-package system Sep. 2, 2008
7420268 Semiconductor chip package and application device thereof Sep. 2, 2008
7420129 Semiconductor package including a semiconductor device, and method of manufacturing the same Sep. 2, 2008
7417308 Stack type package module and method for manufacturing the same Aug. 26, 2008
7417293 Image sensor packaging structure Aug. 26, 2008
7414505 High frequency inductor having low inductance and low inductance variation and method of manufacturing the same Aug. 19, 2008
7414305 Carrier for stacked type semiconductor device and method of fabricating stacked type semiconductor devices Aug. 19, 2008
7413928 Die-wafer package and method of fabricating same Aug. 19, 2008
7411286 Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice Aug. 12, 2008
7411285 Low profile stacked semiconductor chip package Aug. 12, 2008



 
 
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