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Class Information
Number: 257/685
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > Multiple housings
Description: Subject matter wherein more than one housing is provided for a solid-state active electronic device, or wherein plural housings, each containing one or more solid-state active devices, are constructed as a unitary structure.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7619312 |
Method and apparatus for precisely aligning integrated circuit chips |
Nov. 17, 2009 |
| 7619313 |
Multi-chip module and methods |
Nov. 17, 2009 |
| 7619314 |
Integrated circuit package system including die stacking |
Nov. 17, 2009 |
| 7615870 |
Semiconductor device, manufacturing method thereof, and connection method of circuit board |
Nov. 10, 2009 |
| 7615856 |
Integrated antenna type circuit apparatus |
Nov. 10, 2009 |
| 7615842 |
Inductor integrated chip |
Nov. 10, 2009 |
| 7612439 |
Semiconductor package having improved thermal performance |
Nov. 3, 2009 |
| 7612443 |
Inter-chip communication |
Nov. 3, 2009 |
| 7612444 |
Semiconductor package with flow controller |
Nov. 3, 2009 |
| 7612448 |
Power module having a cooling device and semiconductor devices mounted on a resin substrate, method of producing same, and air conditioner |
Nov. 3, 2009 |
| 7608920 |
Memory card and method for devising |
Oct. 27, 2009 |
| 7608919 |
Interconnect packaging systems |
Oct. 27, 2009 |
| 7605452 |
Semiconductor light-emitting device, semiconductor light-emitting module, and method of manufacturing the semiconductor light-emitting module |
Oct. 20, 2009 |
| 7605454 |
Memory card and method for devising |
Oct. 20, 2009 |
| 7598619 |
Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board |
Oct. 6, 2009 |
| 7598617 |
Stack package utilizing through vias and re-distribution lines |
Oct. 6, 2009 |
| 7598606 |
Integrated circuit package system with die and package combination |
Oct. 6, 2009 |
| 7598605 |
Semiconductor device having capacitive insulation means and communication terminal using the device |
Oct. 6, 2009 |
| 7598125 |
Method for wafer level packaging and fabricating cap structures |
Oct. 6, 2009 |
| 7595550 |
Flex-based circuit module |
Sep. 29, 2009 |
| 7595552 |
Stacked semiconductor package in which semiconductor packages are connected using a connector |
Sep. 29, 2009 |
| 7592707 |
Method and apparatus for facilitating proximity communication and power delivery |
Sep. 22, 2009 |
| 7592689 |
Semiconductor module comprising semiconductor chips and method for producing the same |
Sep. 22, 2009 |
| 7586179 |
Wireless semiconductor package for efficient heat dissipation |
Sep. 8, 2009 |
| 7579682 |
Power semiconductor module |
Aug. 25, 2009 |
| 7579681 |
Super high density module with integrated wafer level packages |
Aug. 25, 2009 |
| 7576420 |
Semiconductor integrated circuit device having reduced terminals and I/O area |
Aug. 18, 2009 |
| 7573136 |
Semiconductor device assemblies and packages including multiple semiconductor device components |
Aug. 11, 2009 |
| 7569920 |
Electronic component having at least one vertical semiconductor power transistor |
Aug. 4, 2009 |
| 7569940 |
Method and device for connecting chips |
Aug. 4, 2009 |
| 7566978 |
Semiconductor device and programming method |
Jul. 28, 2009 |
| 7566958 |
Multi-chip package for reducing parasitic load of pin |
Jul. 28, 2009 |
| 7566959 |
Planar array contact memory cards |
Jul. 28, 2009 |
| 7564125 |
Electronic array and methods for fabricating same |
Jul. 21, 2009 |
| 7557437 |
Fan out type wafer level package structure and method of the same |
Jul. 7, 2009 |
| 7554183 |
Semiconductor device |
Jun. 30, 2009 |
| 7550832 |
Stackable semiconductor package |
Jun. 23, 2009 |
| 7550812 |
Camera module and method of fabricating the same |
Jun. 23, 2009 |
| 7547978 |
Underfill and encapsulation of semiconductor assemblies with materials having differing properties |
Jun. 16, 2009 |
| 7547961 |
IC card with bonding wire connections of different lengths |
Jun. 16, 2009 |
| 7547965 |
Package and package module of the package |
Jun. 16, 2009 |
| 7545031 |
Multipackage module having stacked packages with asymmetrically arranged die and molding |
Jun. 9, 2009 |
| 7545029 |
Stack microelectronic assemblies |
Jun. 9, 2009 |
| 7541680 |
Semiconductor device package |
Jun. 2, 2009 |
| 7538418 |
IC card |
May. 26, 2009 |
| 7538432 |
Temporary structure to reduce stress and warpage in a flip chip organic package |
May. 26, 2009 |
| 7535094 |
Substrate structure, a method and an arrangement for producing such substrate structure |
May. 19, 2009 |
| 7535090 |
LSI package provided with interface module |
May. 19, 2009 |
| 7535086 |
Integrated circuit package-on-package stacking system |
May. 19, 2009 |
| 7535087 |
Semiconductor device with lead frames |
May. 19, 2009 |
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