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Class Information
Number: 257/685
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > Multiple housings
Description: Subject matter wherein more than one housing is provided for a solid-state active electronic device, or wherein plural housings, each containing one or more solid-state active devices, are constructed as a unitary structure.










Sub-classes under this class:

Class Number Class Name Patents
257/686 Stacked arrangement 3,730


Patents under this class:

Patent Number Title Of Patent Date Issued
8710677 Multi-chip package with a supporting member and method of manufacturing the same Apr. 29, 2014
8710655 Die packages and systems having the die packages Apr. 29, 2014
8710653 Chip on chip semiconductor device including an underfill layer having a resin containing an amine-based curing agent Apr. 29, 2014
8704384 Stacked die assembly Apr. 22, 2014
8691626 Semiconductor chip device with underfill Apr. 8, 2014
8680666 Bond wireless power module with double-sided single device cooling and immersion bath cooling Mar. 25, 2014
8670246 Computers including an undiced semiconductor wafer with Faraday Cages and internal flexibility sipes Mar. 11, 2014
8669664 Stacked die package for MEMS resonator system Mar. 11, 2014
8669656 Interconnect having ultra high speed signal transmission/reception Mar. 11, 2014
8664756 Reconstituted wafer package with high voltage discrete active dice and integrated field plate for high temperature leakage current stability Mar. 4, 2014
8664755 Power module package and method for manufacturing the same Mar. 4, 2014
8648469 Semiconductor package and method of mounting semiconductor die to opposite sides of TSV substrate Feb. 11, 2014
8637977 Semiconductor device and method of packaging a semiconductor device with a clip Jan. 28, 2014
8637967 Method for fabricating a semiconductor chip and semiconductor chip Jan. 28, 2014
8633597 Thermal vias in an integrated circuit package with an embedded die Jan. 21, 2014
8624375 Semiconductor package for selecting semiconductor chip from a chip stack Jan. 7, 2014
8623700 Inter-chip communication Jan. 7, 2014
8618645 Package process and package structure Dec. 31, 2013
8610266 Semiconductor device for radio frequency applications and method for making the same Dec. 17, 2013
8609537 Integrated void fill for through silicon via Dec. 17, 2013
8604615 Semiconductor device including a stack of semiconductor chips, underfill material and molding material Dec. 10, 2013
8598709 Method and system for routing electrical connections of semiconductor chips Dec. 3, 2013
8598694 Chip-package having a cavity and a manufacturing method thereof Dec. 3, 2013
8597981 Microelectronic devices and methods for manufacturing microelectronic devices Dec. 3, 2013
8592964 Apparatus and method for high density multi-chip structures Nov. 26, 2013
8592259 Method of fabricating a wafer level semiconductor package having a pre-formed dielectric layer Nov. 26, 2013
8587088 Side-mounted controller and methods for making the same Nov. 19, 2013
8578591 Method for manufacturing a stacked device conductive path connectivity Nov. 12, 2013
8575763 Semiconductor device and method of manufacturing the same Nov. 5, 2013
8569884 Multiple die in a face down package Oct. 29, 2013
8564011 Light-emitting diode package structure Oct. 22, 2013
8558399 Dual molded multi-chip package system Oct. 15, 2013
8558380 Stack package and method for manufacturing the same Oct. 15, 2013
8558377 Semiconductor package module Oct. 15, 2013
8552556 Wafer level fan out package Oct. 8, 2013
8552540 Wafer level package with thermal pad for higher power dissipation Oct. 8, 2013
8546929 Embedded integrated circuit package-on-package system Oct. 1, 2013
8546925 Synchronous buck converter having coplanar array of contact bumps of equal volume Oct. 1, 2013
8546187 Electronic part and method of manufacturing the same Oct. 1, 2013
8541889 Probe card including frame and cover plate for testing a semiconductor device Sep. 24, 2013
8541874 Semiconductor device Sep. 24, 2013
8541873 Microelectronic packages having cavities for receiving microelectronic elements Sep. 24, 2013
8541872 Integrated circuit package system with package stacking and method of manufacture thereof Sep. 24, 2013
8536713 System in package with heat sink Sep. 17, 2013
8536692 Mountable integrated circuit package system with mountable integrated circuit die Sep. 17, 2013
8536691 Semiconductor device and method for manufacturing the same Sep. 17, 2013
8531043 Planar encapsulation and mold cavity package in package system Sep. 10, 2013
8530282 Semiconductor device and programming method Sep. 10, 2013
8525322 Semiconductor package having a plurality of input/output members Sep. 3, 2013
8525317 Integrated chip package having intermediate substrate with capacitor Sep. 3, 2013











 
 
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