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Class Information
Number: 257/685
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > Multiple housings
Description: Subject matter wherein more than one housing is provided for a solid-state active electronic device, or wherein plural housings, each containing one or more solid-state active devices, are constructed as a unitary structure.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7459776 |
Stacked die assembly having semiconductor die projecting beyond support |
Dec. 2, 2008 |
| 7452754 |
Method for manufacturing flexible printed circuit boards |
Nov. 18, 2008 |
| 7449363 |
Semiconductor package substrate with embedded chip and fabrication method thereof |
Nov. 11, 2008 |
| 7446403 |
Carrier structure stacking system and method |
Nov. 4, 2008 |
| 7446404 |
Three-dimensional package and method of making the same |
Nov. 4, 2008 |
| 7443025 |
Thermally improved placement of power-dissipating components onto a circuit board |
Oct. 28, 2008 |
| 7443037 |
Stacked integrated circuit package system with connection protection |
Oct. 28, 2008 |
| 7436071 |
Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board |
Oct. 14, 2008 |
| 7432586 |
Apparatus and method for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages |
Oct. 7, 2008 |
| 7432587 |
Integrated device including connections on a separate wafer |
Oct. 7, 2008 |
| 7432599 |
Memory module having interconnected and stacked integrated circuits |
Oct. 7, 2008 |
| 7429782 |
Semiconductor stack block comprising semiconductor chips and methods for producing the same |
Sep. 30, 2008 |
| 7429793 |
Semiconductor device having an electronic circuit disposed therein |
Sep. 30, 2008 |
| 7427810 |
Semiconductor device including semiconductor element mounted on another semiconductor element |
Sep. 23, 2008 |
| 7427806 |
Semiconductor component emitting and/or receiving electromagnetic radiation, and housing base for such a component |
Sep. 23, 2008 |
| 7423335 |
Sensor module package structure and method of the same |
Sep. 9, 2008 |
| 7420269 |
Stacked integrated circuit package-in-package system |
Sep. 2, 2008 |
| 7417308 |
Stack type package module and method for manufacturing the same |
Aug. 26, 2008 |
| 7414305 |
Carrier for stacked type semiconductor device and method of fabricating stacked type semiconductor devices |
Aug. 19, 2008 |
| 7408244 |
Semiconductor package and stack arrangement thereof |
Aug. 5, 2008 |
| 7400032 |
Module assembly for stacked BGA packages |
Jul. 15, 2008 |
| 7400047 |
Integrated circuit with stacked-die configuration utilizing substrate conduction |
Jul. 15, 2008 |
| 7397132 |
Semiconductor device |
Jul. 8, 2008 |
| 7390973 |
Memory module and signal line arrangement method thereof |
Jun. 24, 2008 |
| 7388293 |
Interposer method of fabricating same, and semiconductor device using the same having two portions with different constructions |
Jun. 17, 2008 |
| 7385283 |
Three dimensional integrated circuit and method of making the same |
Jun. 10, 2008 |
| 7385281 |
Semiconductor integrated circuit device |
Jun. 10, 2008 |
| 7378726 |
Stacked packages with interconnecting pins |
May. 27, 2008 |
| 7378724 |
Cavity structure for semiconductor structures |
May. 27, 2008 |
| 7375421 |
High density multilayer circuit module |
May. 20, 2008 |
| 7375418 |
Interposer stacking system and method |
May. 20, 2008 |
| 7375420 |
Large area transducer array |
May. 20, 2008 |
| 7374969 |
Semiconductor package with conductive molding compound and manufacturing method thereof |
May. 20, 2008 |
| 7372140 |
Memory module with different types of multi chip packages |
May. 13, 2008 |
| 7372138 |
Routing element for use in multi-chip modules, multi-chip modules including the routing element and methods |
May. 13, 2008 |
| 7372139 |
Semiconductor chip package |
May. 13, 2008 |
| 7355264 |
Integrated passive devices with high Q inductors |
Apr. 8, 2008 |
| 7355271 |
Flexible assembly of stacked chips |
Apr. 8, 2008 |
| 7355274 |
Semiconductor package, manufacturing method thereof and IC chip |
Apr. 8, 2008 |
| 7352068 |
Multi-chip module |
Apr. 1, 2008 |
| 7345360 |
Multiple chips image sensor package |
Mar. 18, 2008 |
| 7342308 |
Component stacking for integrated circuit electronic package |
Mar. 11, 2008 |
| 7335975 |
Integrated circuit stacking system and method |
Feb. 26, 2008 |
| 7335974 |
Multi stack packaging chip and method of manufacturing the same |
Feb. 26, 2008 |
| 7335973 |
Adhesive of folder package |
Feb. 26, 2008 |
| 7332808 |
Semiconductor module and method of manufacturing the same |
Feb. 19, 2008 |
| 7332802 |
Package for semiconductor light emitting element and semiconductor light emitting device |
Feb. 19, 2008 |
| 7332799 |
Packaged chip having features for improved signal transmission on the package |
Feb. 19, 2008 |
| 7327022 |
Assembly, contact and coupling interconnection for optoelectronics |
Feb. 5, 2008 |
| 7327019 |
Semiconductor device of a charge storage type |
Feb. 5, 2008 |
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