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Class Information
Number: 257/684
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With semiconductor element forming part (e.g., base, of housing)
Description: Subject matter wherein part of the housing is formed by a semiconductor element.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7615274 |
Storage magazine for microstructured molded parts and fabrication procedure |
Nov. 10, 2009 |
| 7608918 |
Semiconductor device |
Oct. 27, 2009 |
| 7608922 |
Semiconductor device including amplifier and frequency converter |
Oct. 27, 2009 |
| 7598604 |
Low profile semiconductor package |
Oct. 6, 2009 |
| 7598125 |
Method for wafer level packaging and fabricating cap structures |
Oct. 6, 2009 |
| 7598534 |
LED light source with integrated circuit and light guide |
Oct. 6, 2009 |
| 7586181 |
Semiconductor device and method for manufacturing |
Sep. 8, 2009 |
| 7586188 |
Chip package and coreless package substrate thereof |
Sep. 8, 2009 |
| 7582969 |
Hermetic interconnect structure and method of manufacture |
Sep. 1, 2009 |
| 7579680 |
Packaging system for semiconductor devices |
Aug. 25, 2009 |
| 7579683 |
Memory interface optimized for stacked configurations |
Aug. 25, 2009 |
| 7573125 |
Methods for reducing stress in microelectronic devices and microelectronic devices formed using such methods |
Aug. 11, 2009 |
| 7569920 |
Electronic component having at least one vertical semiconductor power transistor |
Aug. 4, 2009 |
| 7554179 |
Multi-leadframe semiconductor package and method of manufacture |
Jun. 30, 2009 |
| 7550812 |
Camera module and method of fabricating the same |
Jun. 23, 2009 |
| 7535089 |
Monolithically integrated light emitting devices |
May. 19, 2009 |
| 7535087 |
Semiconductor device with lead frames |
May. 19, 2009 |
| 7535085 |
Semiconductor package having improved adhesiveness and ground bonding |
May. 19, 2009 |
| 7528467 |
IC substrate with over voltage protection function |
May. 5, 2009 |
| 7528469 |
Semiconductor equipment having multiple semiconductor devices and multiple lead frames |
May. 5, 2009 |
| 7528472 |
Chip package mechanism |
May. 5, 2009 |
| 7525174 |
High performance system-on-chip using post passivation process |
Apr. 28, 2009 |
| 7524087 |
Optical device |
Apr. 28, 2009 |
| 7518200 |
Semiconductor integrated circuit chip with a nano-structure-surface passivation film |
Apr. 14, 2009 |
| 7511368 |
Carrier device for electronic chip |
Mar. 31, 2009 |
| 7511379 |
Surface mountable direct chip attach device and method including integral integrated circuit |
Mar. 31, 2009 |
| 7508057 |
Electronic component device |
Mar. 24, 2009 |
| 7504670 |
Sealing structure for mounting a semiconductor device to a substrate |
Mar. 17, 2009 |
| 7491579 |
Composable system-in-package integrated circuits and process of composing the same |
Feb. 17, 2009 |
| 7489013 |
Destructor integrated circuit chip, interposer electronic device and methods |
Feb. 10, 2009 |
| 7489021 |
Lead frame with included passive devices |
Feb. 10, 2009 |
| 7466030 |
Semiconductor device and fabrication process thereof |
Dec. 16, 2008 |
| 7466019 |
Rectangular semi-conducting support for microelectronics and method for making same |
Dec. 16, 2008 |
| 7466007 |
Post passivation interconnection schemes on top of IC chip |
Dec. 16, 2008 |
| 7464459 |
Method of forming a MEMS actuator and relay with vertical actuation |
Dec. 16, 2008 |
| 7459838 |
Plasma display device, TCP applied thereto, and method of manufacturing the TCP |
Dec. 2, 2008 |
| 7456483 |
Semiconductor device, manufacturing method of semiconductor device and module for optical device |
Nov. 25, 2008 |
| 7456497 |
Electronic devices and its production methods |
Nov. 25, 2008 |
| 7453141 |
Semiconductor device package, method of manufacturing the same, and semiconductor device |
Nov. 18, 2008 |
| 7443016 |
Semiconductor device for use as multimedia memory card, has encapsulant with chamfer such that portion of substrate and chamfer are exposed from encapsulant and remaining portion of surface of |
Oct. 28, 2008 |
| 7443681 |
Heat dissipator for display apparatus and plasma display apparatus including the heat dissipator |
Oct. 28, 2008 |
| 7432533 |
Encapsulation of electronic devices with shaped spacers |
Oct. 7, 2008 |
| 7432593 |
Semiconductor package assembly and method for electrically isolating modules |
Oct. 7, 2008 |
| 7429501 |
Lid and method of employing a lid on an integrated circuit |
Sep. 30, 2008 |
| 7414299 |
Semiconductor package assembly and method for electrically isolating modules |
Aug. 19, 2008 |
| 7414663 |
Imaging element, imaging device, camera module and camera system |
Aug. 19, 2008 |
| 7411210 |
Semiconductor probe with resistive tip having metal shield thereon |
Aug. 12, 2008 |
| 7408250 |
Micromirror array device with compliant adhesive |
Aug. 5, 2008 |
| 7408251 |
Semiconductor packaging device comprising a semiconductor chip including a MOSFET |
Aug. 5, 2008 |
| 7402900 |
Semiconductor device substrate, semiconductor device, and manufacturing method thereof |
Jul. 22, 2008 |
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