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Class Information
Number: 257/684
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With semiconductor element forming part (e.g., base, of housing)
Description: Subject matter wherein part of the housing is formed by a semiconductor element.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7459838 |
Plasma display device, TCP applied thereto, and method of manufacturing the TCP |
Dec. 2, 2008 |
| 7456483 |
Semiconductor device, manufacturing method of semiconductor device and module for optical device |
Nov. 25, 2008 |
| 7456497 |
Electronic devices and its production methods |
Nov. 25, 2008 |
| 7453141 |
Semiconductor device package, method of manufacturing the same, and semiconductor device |
Nov. 18, 2008 |
| 7443016 |
Semiconductor device for use as multimedia memory card, has encapsulant with chamfer such that portion of substrate and chamfer are exposed from encapsulant and remaining portion of surface of |
Oct. 28, 2008 |
| 7443681 |
Heat dissipator for display apparatus and plasma display apparatus including the heat dissipator |
Oct. 28, 2008 |
| 7432533 |
Encapsulation of electronic devices with shaped spacers |
Oct. 7, 2008 |
| 7432593 |
Semiconductor package assembly and method for electrically isolating modules |
Oct. 7, 2008 |
| 7429501 |
Lid and method of employing a lid on an integrated circuit |
Sep. 30, 2008 |
| 7414299 |
Semiconductor package assembly and method for electrically isolating modules |
Aug. 19, 2008 |
| 7414663 |
Imaging element, imaging device, camera module and camera system |
Aug. 19, 2008 |
| 7411210 |
Semiconductor probe with resistive tip having metal shield thereon |
Aug. 12, 2008 |
| 7408250 |
Micromirror array device with compliant adhesive |
Aug. 5, 2008 |
| 7408251 |
Semiconductor packaging device comprising a semiconductor chip including a MOSFET |
Aug. 5, 2008 |
| 7402900 |
Semiconductor device substrate, semiconductor device, and manufacturing method thereof |
Jul. 22, 2008 |
| 7402901 |
Semiconductor device and method of manufacturing semiconductor device |
Jul. 22, 2008 |
| 7397111 |
Semiconductor wafer, an electronic component, and a component carrier for producing the electronic component |
Jul. 8, 2008 |
| 7393758 |
Wafer level packaging process |
Jul. 1, 2008 |
| 7391102 |
Semiconductor apparatus configured with a lead frame having sufficient strenght to protect against external forces |
Jun. 24, 2008 |
| 7388284 |
Integrated circuit package and method of attaching a lid to a substrate of an integrated circuit |
Jun. 17, 2008 |
| 7378748 |
Solid-state imaging device and method for manufacturing the same |
May. 27, 2008 |
| 7372137 |
Semiconductor device and manufacturing method thereof |
May. 13, 2008 |
| 7372074 |
Surface preparation for selective silicon fusion bonding |
May. 13, 2008 |
| 7368808 |
MEMS packaging using a non-silicon substrate for encapsulation and interconnection |
May. 6, 2008 |
| 7368813 |
Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, an |
May. 6, 2008 |
| 7368810 |
Invertible microfeature device packages |
May. 6, 2008 |
| 7361971 |
Semiconductor wafer protection structure and laminated protective sheet for use therein |
Apr. 22, 2008 |
| 7358604 |
Multichip circuit module and method for the production thereof |
Apr. 15, 2008 |
| 7355270 |
Semiconductor chip with coil antenna and communication system |
Apr. 8, 2008 |
| 7348604 |
Light-emitting module |
Mar. 25, 2008 |
| 7344915 |
Method for manufacturing a semiconductor package with a laminated chip cavity |
Mar. 18, 2008 |
| 7345360 |
Multiple chips image sensor package |
Mar. 18, 2008 |
| 7344919 |
Method for using gel package structure enhancing thermal dissipation between compressed printed circuit board and heat sink mechanical stiffener |
Mar. 18, 2008 |
| 7339194 |
Semiconductor laser device and manufacturing method thereof |
Mar. 4, 2008 |
| 7335970 |
Semiconductor device having a chip-size package |
Feb. 26, 2008 |
| 7332806 |
Thin, thermally enhanced molded package with leadframe having protruding region |
Feb. 19, 2008 |
| 7323768 |
Voltage contrast monitor for integrated circuit defects |
Jan. 29, 2008 |
| 7323769 |
High performance chip scale leadframe package with thermal dissipating structure and annular element and method of manufacturing package |
Jan. 29, 2008 |
| 7312521 |
Semiconductor device with holding member |
Dec. 25, 2007 |
| 7307341 |
Integrated packaged having magnetic components |
Dec. 11, 2007 |
| 7294925 |
Optical scanner package having heating dam |
Nov. 13, 2007 |
| 7291904 |
Downsized package for electric wave device |
Nov. 6, 2007 |
| 7291902 |
Chip component and method for producing a chip component |
Nov. 6, 2007 |
| 7291926 |
Multi-chip package structure |
Nov. 6, 2007 |
| 7271476 |
Wiring substrate for mounting semiconductor components |
Sep. 18, 2007 |
| 7265440 |
Methods and apparatus for packaging integrated circuit devices |
Sep. 4, 2007 |
| 7259032 |
Hermetically sealing a package to include a barrier metal |
Aug. 21, 2007 |
| 7259451 |
Invertible microfeature device packages |
Aug. 21, 2007 |
| 7253505 |
IC substrate with over voltage protection function |
Aug. 7, 2007 |
| 7250673 |
Signal isolation in a package substrate |
Jul. 31, 2007 |
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