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Class Information
Number: 257/684
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With semiconductor element forming part (e.g., base, of housing)
Description: Subject matter wherein part of the housing is formed by a semiconductor element.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8709877 Integrated circuit packaging system with an encapsulation and method of manufacture thereof Apr. 29, 2014
8704314 Mechanical memory transistor Apr. 22, 2014
8692364 Semiconductor device and method for manufacturing the same Apr. 8, 2014
8686461 Light emitting diode (LED) die having stepped substrates and method of fabrication Apr. 1, 2014
8680665 Encapsulation, MEMS and encapsulation method Mar. 25, 2014
8648454 Wafer-scale package structures with integrated antennas Feb. 11, 2014
8643169 Semiconductor sensor device with over-molded lid Feb. 4, 2014
8643127 Sensor device packaging Feb. 4, 2014
8637976 Semiconductor device with lead terminals having portions thereof extending obliquely Jan. 28, 2014
8637967 Method for fabricating a semiconductor chip and semiconductor chip Jan. 28, 2014
8638000 Micromechanical method and corresponding assembly for bonding semiconductor substrates and correspondingly bonded semiconductor chip Jan. 28, 2014
8633088 Glass frit wafer bond protective structure Jan. 21, 2014
8633582 Chip package and fabrication method thereof Jan. 21, 2014
8633583 Semiconductor package substrate and methods for forming same, in particular for MEMS devices Jan. 21, 2014
8629537 Padless die support integrated circuit package system Jan. 14, 2014
8624380 Vertical mount package for MEMS sensors Jan. 7, 2014
8624381 Integrated antennas in wafer level package Jan. 7, 2014
8624241 Semiconductor chip, stack-type semiconductor package Jan. 7, 2014
8610257 Semiconductor device and method for producing such a device Dec. 17, 2013
8602315 Molded chip card and method for manufacturing same Dec. 10, 2013
8587108 Package for semiconductor device including guide rings and manufacturing method of the same Nov. 19, 2013
8578591 Method for manufacturing a stacked device conductive path connectivity Nov. 12, 2013
8569883 Package for high power devices Oct. 29, 2013
8564141 Chip unit and stack package having the same Oct. 22, 2013
8558277 Semiconductor device and method of providing electrostatic discharge protection for integrated passive devices Oct. 15, 2013
8552540 Wafer level package with thermal pad for higher power dissipation Oct. 8, 2013
8553417 Heat-radiating substrate and method of manufacturing the same Oct. 8, 2013
8551799 Encapsulated micro-electro-mechanical device, in particular a MEMS acoustic transducer Oct. 8, 2013
8541874 Semiconductor device Sep. 24, 2013
8531015 Semiconductor device and method of forming a thin wafer without a carrier Sep. 10, 2013
8525316 Eutectic flow containment in a semiconductor fabrication process Sep. 3, 2013
8519542 Air through-silicon via structure Aug. 27, 2013
8513043 Method for MEMS device fabrication and device formed Aug. 20, 2013
8514579 Power semiconductor module including substrates spaced from each other Aug. 20, 2013
8508022 Ultra thin package for electric acoustic sensor chip of micro electro mechanical system Aug. 13, 2013
8508028 Chip package and method for forming the same Aug. 13, 2013
8497159 Method of manufacturing leadless integrated circuit packages having electrically routed contacts Jul. 30, 2013
8497575 Semiconductor packaging system with an aligned interconnect and method of manufacture thereof Jul. 30, 2013
8487428 Method and system for providing a reliable semiconductor assembly Jul. 16, 2013
8487400 High performance system-on-chip using post passivation process Jul. 16, 2013
8482109 Integrated circuit packaging system with dual connection and method of manufacture thereof Jul. 9, 2013
8476737 Environment-resistant module, micropackage and methods of manufacturing same Jul. 2, 2013
8471379 Semiconductor device Jun. 25, 2013
8467192 Method for producing a rollable web and a rollable web Jun. 18, 2013
8466997 Fan-out wafer level package for an optical sensor and method of manufacture thereof Jun. 18, 2013
8455999 Method for reducing chip warpage Jun. 4, 2013
8450739 Electrooptical device substrate and method for manufacturing the same, electrooptical device, and electronic apparatus May. 28, 2013
8450761 Package for light emitting element accommodation containing a substrate and a frame body, the frame body containing alumina and barium May. 28, 2013
8445323 Semiconductor package with semiconductor core structure and method of forming same May. 21, 2013
8446003 Semiconductor device including double-sided multi-electrode chip embedded in multilayer wiring substrate May. 21, 2013

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