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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Browse by Category: Main > Physics
Class Information
Number: 257/683
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With means to prevent explosion of package
Description: Subject matter including means to prevent explosion of a housing or package.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8238108 Power semiconductor module system Aug. 7, 2012
8183674 Power semiconductor module comprising an explosion protection system May. 22, 2012
8107207 Potted electrical circuit with protective insulation Jan. 31, 2012
8107208 Insulated surge suppression circuit Jan. 31, 2012
7936056 Airtight package comprising a pressure adjustment unit May. 3, 2011
7875812 Method and apparatus for electrical component physical protection Jan. 25, 2011
7838983 Packaged semiconductor device and method of manufacturing the packaged semiconductor device Nov. 23, 2010
7791228 Energy supply of a measuring device Sep. 7, 2010
7683477 Semiconductor device including semiconductor chips having contact elements Mar. 23, 2010
7542302 Minimizing thickness of deadfronted display assemblies Jun. 2, 2009
7514777 Power semiconductor module Apr. 7, 2009
7504670 Sealing structure for mounting a semiconductor device to a substrate Mar. 17, 2009
7390742 Method for producing a rewiring printed circuit board Jun. 24, 2008
7166922 Continuous metal interconnects Jan. 23, 2007
7151308 Semiconductor chip package Dec. 19, 2006
7126210 System and method for venting pressure from an integrated circuit package sealed with a lid Oct. 24, 2006
7049685 Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices May. 23, 2006
7034383 Electronic component and panel and method for producing the same Apr. 25, 2006
6975017 Healing of micro-cracks in an on-chip dielectric Dec. 13, 2005
6963124 Locking of mold compound to conductive substrate panels Nov. 8, 2005
6919623 Hydrogen diffusion hybrid port and method of forming Jul. 19, 2005
6809407 Semiconductor device Oct. 26, 2004
6768191 Electronic component with stacked electronic elements Jul. 27, 2004
6762502 Semiconductor device packages including a plurality of layers substantially encapsulating leads thereof Jul. 13, 2004
6617680 Chip carrier, semiconductor package and fabricating method thereof Sep. 9, 2003
6576989 Locking of mold compound to conductive substrate panels Jun. 10, 2003
6541857 Method of forming BGA interconnections having mixed solder profiles Apr. 1, 2003
6448637 Hermetically sealed integrated circuit package incorporating pressure relief valve for equalizing interior and exterior pressures when placed in spaceborne environment Sep. 10, 2002
6410981 Vented semiconductor device package having separate substrate, strengthening ring and cap structures Jun. 25, 2002
6380632 Center bond flip-chip semiconductor device and method of making it Apr. 30, 2002
6326698 Semiconductor devices having protective layers thereon through which contact pads are exposed and stereolithographic methods of fabricating such semiconductor devices Dec. 4, 2001
6297549 Hermetically sealed semiconductor power module and large scale module comprising the same Oct. 2, 2001
6245597 Method for reducing die cracking in integrated circuits Jun. 12, 2001
6225687 Chip package with degassing holes May. 1, 2001
6191472 Hole geometry of a semiconductor package substrate Feb. 20, 2001
6184464 Protective containment apparatus for potted electronic circuits Feb. 6, 2001
6140707 Laminated integrated circuit package Oct. 31, 2000
5977621 Power semiconductor module Nov. 2, 1999
5977568 Power semiconductor component with a pressure-equalizing contact plate Nov. 2, 1999
5945733 Structure for attaching a semiconductor wafer section to a support Aug. 31, 1999
5818094 Package for housing a semiconductor element Oct. 6, 1998
5783426 Semiconductor device having semiconductor chip mounted in package having cavity and method for fabricating the same Jul. 21, 1998
5760336 Burn and explosion-resistant circuit package for a varistor chip Jun. 2, 1998
5744860 Power semiconductor module Apr. 28, 1998
5736780 Semiconductor device having circuit pattern along outer periphery of sealing resin and related processes Apr. 7, 1998
5629562 Conductive contact structure for two conductors May. 13, 1997
5491361 Hydrogen out venting electronic package Feb. 13, 1996
5446315 Resin-sealed semiconductor device containing porous fluorocarbon resin Aug. 29, 1995
5001299 Explosively formed electronic packages Mar. 19, 1991
4745455 Silicon packages for power semiconductor devices May. 17, 1988

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