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Class Information
Number: 257/683
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With means to prevent explosion of package
Description: Subject matter including means to prevent explosion of a housing or package.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7390742 |
Method for producing a rewiring printed circuit board |
Jun. 24, 2008 |
| 7166922 |
Continuous metal interconnects |
Jan. 23, 2007 |
| 7151308 |
Semiconductor chip package |
Dec. 19, 2006 |
| 7126210 |
System and method for venting pressure from an integrated circuit package sealed with a lid |
Oct. 24, 2006 |
| 7049685 |
Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices |
May. 23, 2006 |
| 7034383 |
Electronic component and panel and method for producing the same |
Apr. 25, 2006 |
| 6975017 |
Healing of micro-cracks in an on-chip dielectric |
Dec. 13, 2005 |
| 6963124 |
Locking of mold compound to conductive substrate panels |
Nov. 8, 2005 |
| 6919623 |
Hydrogen diffusion hybrid port and method of forming |
Jul. 19, 2005 |
| 6809407 |
Semiconductor device |
Oct. 26, 2004 |
| 6768191 |
Electronic component with stacked electronic elements |
Jul. 27, 2004 |
| 6762502 |
Semiconductor device packages including a plurality of layers substantially encapsulating leads thereof |
Jul. 13, 2004 |
| 6617680 |
Chip carrier, semiconductor package and fabricating method thereof |
Sep. 9, 2003 |
| 6576989 |
Locking of mold compound to conductive substrate panels |
Jun. 10, 2003 |
| 6541857 |
Method of forming BGA interconnections having mixed solder profiles |
Apr. 1, 2003 |
| 6448637 |
Hermetically sealed integrated circuit package incorporating pressure relief valve for equalizing interior and exterior pressures when placed in spaceborne environment |
Sep. 10, 2002 |
| 6410981 |
Vented semiconductor device package having separate substrate, strengthening ring and cap structures |
Jun. 25, 2002 |
| 6380632 |
Center bond flip-chip semiconductor device and method of making it |
Apr. 30, 2002 |
| 6326698 |
Semiconductor devices having protective layers thereon through which contact pads are exposed and stereolithographic methods of fabricating such semiconductor devices |
Dec. 4, 2001 |
| 6297549 |
Hermetically sealed semiconductor power module and large scale module comprising the same |
Oct. 2, 2001 |
| 6245597 |
Method for reducing die cracking in integrated circuits |
Jun. 12, 2001 |
| 6225687 |
Chip package with degassing holes |
May. 1, 2001 |
| 6191472 |
Hole geometry of a semiconductor package substrate |
Feb. 20, 2001 |
| 6184464 |
Protective containment apparatus for potted electronic circuits |
Feb. 6, 2001 |
| 6140707 |
Laminated integrated circuit package |
Oct. 31, 2000 |
| 5977568 |
Power semiconductor component with a pressure-equalizing contact plate |
Nov. 2, 1999 |
| 5977621 |
Power semiconductor module |
Nov. 2, 1999 |
| 5945733 |
Structure for attaching a semiconductor wafer section to a support |
Aug. 31, 1999 |
| 5818094 |
Package for housing a semiconductor element |
Oct. 6, 1998 |
| 5783426 |
Semiconductor device having semiconductor chip mounted in package having cavity and method for fabricating the same |
Jul. 21, 1998 |
| 5760336 |
Burn and explosion-resistant circuit package for a varistor chip |
Jun. 2, 1998 |
| 5744860 |
Power semiconductor module |
Apr. 28, 1998 |
| 5736780 |
Semiconductor device having circuit pattern along outer periphery of sealing resin and related processes |
Apr. 7, 1998 |
| 5629562 |
Conductive contact structure for two conductors |
May. 13, 1997 |
| 5491361 |
Hydrogen out venting electronic package |
Feb. 13, 1996 |
| 5446315 |
Resin-sealed semiconductor device containing porous fluorocarbon resin |
Aug. 29, 1995 |
| 5001299 |
Explosively formed electronic packages |
Mar. 19, 1991 |
| 4745455 |
Silicon packages for power semiconductor devices |
May. 17, 1988 |
| 4567504 |
Semiconductor component with a disc-shaped case |
Jan. 28, 1986 |
| 4426659 |
Housing for high-power semiconductor components with large diameter intermediate contact disks of differing thicknesses |
Jan. 17, 1984 |
| 4399452 |
Explosion-proof semiconductor device |
Aug. 16, 1983 |
| 4274106 |
Explosion proof vibration resistant flat package semiconductor device |
Jun. 16, 1981 |
| 4162514 |
Arrangement for semiconductor power components |
Jul. 24, 1979 |
| 4099201 |
Semiconductor rectifier assembly having an insulating material therein that evolves gases when exposed to an arc |
Jul. 4, 1978 |
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