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Class Information
Number: 257/682
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With desiccant, getter, or gas filling
Description: Subject matter including a desiccant (i.e., a material for absorbing moisture); a getter (i.e., a material which absorbs undesirable semiconductor, housing or package contaminants); or wherein a gaseous material fills the housing or package.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7456502 |
Wiring board with connection electrode formed in opening and semiconductor device using the same |
Nov. 25, 2008 |
| 7443017 |
Package having bond-sealed underbump |
Oct. 28, 2008 |
| 7427806 |
Semiconductor component emitting and/or receiving electromagnetic radiation, and housing base for such a component |
Sep. 23, 2008 |
| 7417307 |
System and method for direct-bonding of substrates |
Aug. 26, 2008 |
| 7408225 |
Apparatus and method for forming thin film using upstream and downstream exhaust mechanisms |
Aug. 5, 2008 |
| 7402905 |
Methods of fabrication of wafer-level vacuum packaged devices |
Jul. 22, 2008 |
| 7377961 |
Hydrogen vent for optoelectronic packages with resistive thermal device (RTD) |
May. 27, 2008 |
| 7327019 |
Semiconductor device of a charge storage type |
Feb. 5, 2008 |
| 7311007 |
Pressure sensor |
Dec. 25, 2007 |
| 7309865 |
Electronic device having infrared sensing elements |
Dec. 18, 2007 |
| 7215015 |
Imaging system |
May. 8, 2007 |
| 7196406 |
ESD protection apparatus for an electrical device |
Mar. 27, 2007 |
| 7183637 |
Microelectronic mechanical system and methods |
Feb. 27, 2007 |
| 7180163 |
Support with integrated deposit of gas absorbing material for manufacturing microelectronic, microoptoelectronic or micromechanical devices |
Feb. 20, 2007 |
| 7161094 |
Modifying the electro-mechanical behavior of devices |
Jan. 9, 2007 |
| 7147908 |
Semiconductor package with getter formed over an irregular structure |
Dec. 12, 2006 |
| 7088751 |
Solid-state laser apparatus |
Aug. 8, 2006 |
| 7045885 |
Placement of absorbing material in a semiconductor device |
May. 16, 2006 |
| 7042075 |
Electronic device sealed under vacuum containing a getter and method of operation |
May. 9, 2006 |
| 7042076 |
Vacuum sealed microdevice packaging with getters |
May. 9, 2006 |
| 6998648 |
Protected organic electronic device structures incorporating pressure sensitive adhesive and desiccant |
Feb. 14, 2006 |
| 6992375 |
Anchor for device package |
Jan. 31, 2006 |
| 6979893 |
Packaged microelectromechanical device with lubricant |
Dec. 27, 2005 |
| 6979892 |
Laminated co-fired sandwiched element for non-thermal plasma reactor |
Dec. 27, 2005 |
| 6958260 |
Hydrogen gettering system |
Oct. 25, 2005 |
| 6953706 |
Method of providing a semiconductor package having an internal heat-activated hydrogen source |
Oct. 11, 2005 |
| 6951769 |
Method for stripping sacrificial layer in MEMS assembly |
Oct. 4, 2005 |
| 6949815 |
Semiconductor device with decoupling capacitors mounted on conductors |
Sep. 27, 2005 |
| 6929974 |
Feedthrough design and method for a hermetically sealed microdevice |
Aug. 16, 2005 |
| 6923625 |
Method of forming a reactive material and article formed thereby |
Aug. 2, 2005 |
| 6921952 |
Torsion spring for MEMS structure |
Jul. 26, 2005 |
| 6919623 |
Hydrogen diffusion hybrid port and method of forming |
Jul. 19, 2005 |
| 6914323 |
Methods and apparatus for attaching getters to MEMS device housings |
Jul. 5, 2005 |
| 6897551 |
Support for microelectronic, microoptoelectronic or micromechanical devices |
May. 24, 2005 |
| 6888232 |
Semiconductor package having a heat-activated source of releasable hydrogen |
May. 3, 2005 |
| 6870197 |
Dual panel type organic electroluminescent display device and method of fabricating the same |
Mar. 22, 2005 |
| 6861802 |
Organic electroluminescence panel |
Mar. 1, 2005 |
| 6853062 |
Single substrate hydrogen and microwave absorber for integrated microwave assembly and method of manufacturing same |
Feb. 8, 2005 |
| 6844623 |
Temporary coatings for protection of microelectronic devices during packaging |
Jan. 18, 2005 |
| 6825817 |
Dielectric interconnect frame incorporating EMI shield and hydrogen absorber for tile T/R modules |
Nov. 30, 2004 |
| 6822880 |
Multilayer thin film hydrogen getter and internal signal EMI shield for complex three dimensional electronic package components |
Nov. 23, 2004 |
| 6809413 |
Microelectronic device package with an integral window mounted in a recessed lip |
Oct. 26, 2004 |
| 6791174 |
Semiconductor device with gel resin vibration limiting member |
Sep. 14, 2004 |
| 6703701 |
Semiconductor device with integrated circuit elements of group III-V comprising means for preventing pollution by hydrogen |
Mar. 9, 2004 |
| 6674160 |
Multi-chip semiconductor device |
Jan. 6, 2004 |
| 6661084 |
Single level microelectronic device package with an integral window |
Dec. 9, 2003 |
| 6590280 |
Disk-like gettering unit, integrated circuit, encapsulated semiconductor device, and method for manufacturing the same |
Jul. 8, 2003 |
| 6548889 |
Hydrogen getter for integrated microelectronic assembly |
Apr. 15, 2003 |
| 6538312 |
Multilayered microelectronic device package with an integral window |
Mar. 25, 2003 |
| 6534850 |
Electronic device sealed under vacuum containing a getter and method of operation |
Mar. 18, 2003 |
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