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Class Information
Number: 257/680
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With window means
Description: Subject matter under 678 wherein the housing or package has a physical opening or area otherwise transparent to ultraviolet, visible, or infrared light.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 5557115 |
Light emitting semiconductor device with sub-mount |
Sep. 17, 1996 |
| 5550675 |
Semiconductor light receiving apparatus |
Aug. 27, 1996 |
| 5534725 |
Resin molded charge coupled device package and method for preparation thereof |
Jul. 9, 1996 |
| 5523608 |
Solid state imaging device having a solid state image sensor and its peripheral IC mounted on one package |
Jun. 4, 1996 |
| 5523586 |
Burn-in socket used in a burn-in test for semiconductor chips |
Jun. 4, 1996 |
| 5521992 |
Molded optical interconnect |
May. 28, 1996 |
| 5498906 |
Capacitive coupling configuration for an intergrated circuit package |
Mar. 12, 1996 |
| 5491361 |
Hydrogen out venting electronic package |
Feb. 13, 1996 |
| 5491362 |
Package structure having accessible chip |
Feb. 13, 1996 |
| 5477075 |
Solid state photodetector with light-responsive rear face |
Dec. 19, 1995 |
| 5473191 |
Hybrid integrated circuit device with apertured cover |
Dec. 5, 1995 |
| 5463229 |
Circuit board for optical devices |
Oct. 31, 1995 |
| 5440452 |
Surface mount components and semifinished products thereof |
Aug. 8, 1995 |
| 5438216 |
Light erasable multichip module |
Aug. 1, 1995 |
| 5408121 |
Semiconductor device, an image sensor device, and methods for producing the same |
Apr. 18, 1995 |
| 5399805 |
Metal electronic package with reduced seal width |
Mar. 21, 1995 |
| 5396086 |
LED spacer assembly |
Mar. 7, 1995 |
| 5371408 |
Integrated circuit package with removable shield |
Dec. 6, 1994 |
| 5357056 |
Chip carrier for optical device |
Oct. 18, 1994 |
| 5355016 |
Shielded EPROM package |
Oct. 11, 1994 |
| 5352852 |
Charge coupled device package with glass lid |
Oct. 4, 1994 |
| 5319242 |
Semiconductor package having an exposed die surface |
Jun. 7, 1994 |
| 5300808 |
EPROM package and method of optically erasing |
Apr. 5, 1994 |
| 5296724 |
Light emitting semiconductor device having an optical element |
Mar. 22, 1994 |
| 5293511 |
Package for a semiconductor device |
Mar. 8, 1994 |
| 5285107 |
Hybrid integrated circuit device |
Feb. 8, 1994 |
| 5278429 |
Semiconductor device having improved adhesive structure and method of producing same |
Jan. 11, 1994 |
| 5272374 |
Production method for an IC card and its IC card |
Dec. 21, 1993 |
| 5262675 |
Laser diode package |
Nov. 16, 1993 |
| 5256901 |
Ceramic package for memory semiconductor |
Oct. 26, 1993 |
| 5223746 |
Packaging structure for a solid-state imaging device with selectively aluminium coated leads |
Jun. 29, 1993 |
| 5220198 |
Solid state imaging apparatus in which a solid state imaging device chip and substrate are face-bonded with each other |
Jun. 15, 1993 |
| 5161087 |
Pivotal heat sink assembly |
Nov. 3, 1992 |
| 5155660 |
Semiconductor device |
Oct. 13, 1992 |
| 5150180 |
Packaged semiconductor device with high energy radiation absorbent glass |
Sep. 22, 1992 |
| 5122861 |
Solid state image pickup device having particular package structure |
Jun. 16, 1992 |
| 5121188 |
Laser module assembly |
Jun. 9, 1992 |
| 5109454 |
Light communication apparatus |
Apr. 28, 1992 |
| 5109455 |
Optic interface hybrid |
Apr. 28, 1992 |
| 5089861 |
Semiconductor laser device with mounting block |
Feb. 18, 1992 |
| 5087964 |
Package for a light-responsive semiconductor chip |
Feb. 11, 1992 |
| 5083192 |
Cluster mount for high intensity LEDs |
Jan. 21, 1992 |
| 5072284 |
Solid state image pickup device |
Dec. 10, 1991 |
| 5068713 |
Solid state image sensing device |
Nov. 26, 1991 |
| 5045921 |
Pad array carrier IC device using flexible tape |
Sep. 3, 1991 |
| 5043845 |
High-speed CCD sensor mounting system with improved signal to noise operation and thermal contact |
Aug. 27, 1991 |
| 5034800 |
Hollow plastic package for semiconductor devices |
Jul. 23, 1991 |
| 5027190 |
Carrier element to be incorporated into an identity card |
Jun. 25, 1991 |
| 5022035 |
Semiconductor laser device |
Jun. 4, 1991 |
| 5020065 |
Semiconductor laser device |
May. 28, 1991 |
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