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Class Information
Number: 257/680
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With window means
Description: Subject matter under 678 wherein the housing or package has a physical opening or area otherwise transparent to ultraviolet, visible, or infrared light.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7443017 |
Package having bond-sealed underbump |
Oct. 28, 2008 |
| 7443038 |
Flip-chip image sensor packages |
Oct. 28, 2008 |
| 7436002 |
Surface-mountable radiation-emitting component |
Oct. 14, 2008 |
| 7436053 |
Optical device and method for fabricating the same |
Oct. 14, 2008 |
| 7436069 |
Semiconductor device, having a through electrode semiconductor module employing thereof and method for manufacturing semiconductor device having a through electrode |
Oct. 14, 2008 |
| 7429784 |
Package structure |
Sep. 30, 2008 |
| 7427784 |
COB-typed LED package with phosphor |
Sep. 23, 2008 |
| 7427805 |
Light-emitting diode chip package body and packaging method thereof |
Sep. 23, 2008 |
| 7425758 |
Metal core foldover package structures |
Sep. 16, 2008 |
| 7423335 |
Sensor module package structure and method of the same |
Sep. 9, 2008 |
| 7423333 |
Cerdip type of solid-state image sensing device, structure and method for gripping cerdip type of solid-state image sensing device |
Sep. 9, 2008 |
| 7423334 |
Image sensor module with a protection layer and a method for manufacturing the same |
Sep. 9, 2008 |
| 7420754 |
Optical module and method for manufacturing the same |
Sep. 2, 2008 |
| 7417327 |
IC chip package with cover |
Aug. 26, 2008 |
| 7411284 |
Accessible electronic storage apparatus |
Aug. 12, 2008 |
| 7408205 |
Digital camera module |
Aug. 5, 2008 |
| 7397125 |
Semiconductor device with bonding pad support structure |
Jul. 8, 2008 |
| 7391102 |
Semiconductor apparatus configured with a lead frame having sufficient strenght to protect against external forces |
Jun. 24, 2008 |
| 7388282 |
Micro-electro-mechanical system (MEMS) package having hydrophobic layer |
Jun. 17, 2008 |
| 7378748 |
Solid-state imaging device and method for manufacturing the same |
May. 27, 2008 |
| 7372122 |
Image sensor chip package and method of fabricating the same |
May. 13, 2008 |
| 7368795 |
Image sensor module with passive component |
May. 6, 2008 |
| 7368758 |
Method for hermetically housing optical components, and optical components produced according to said method |
May. 6, 2008 |
| 7368695 |
Image sensor package and fabrication method |
May. 6, 2008 |
| 7367120 |
Method for producing a solid-state imaging device |
May. 6, 2008 |
| 7358602 |
Semiconductor chip, and semiconductor wafer including a variable thickness insulating layer |
Apr. 15, 2008 |
| 7348241 |
Cell structure of EPROM device and method for fabricating the same |
Mar. 25, 2008 |
| 7348604 |
Light-emitting module |
Mar. 25, 2008 |
| 7342263 |
Circuit device |
Mar. 11, 2008 |
| 7323720 |
Light-emitting device, image forming apparatus, and electronic apparatus with an integrated circuit mounted on a substrate |
Jan. 29, 2008 |
| 7323777 |
Semiconductor device, method of manufacturing the same, circuit board, and electronic instrument |
Jan. 29, 2008 |
| 7317199 |
Circuit device |
Jan. 8, 2008 |
| 7307773 |
Micro-optoelectromechanical system packages for a light modulator and methods of making the same |
Dec. 11, 2007 |
| 7301227 |
Package lid or heat spreader for microprocessor packages |
Nov. 27, 2007 |
| 7298030 |
Structure and method of making sealed capped chips |
Nov. 20, 2007 |
| 7294925 |
Optical scanner package having heating dam |
Nov. 13, 2007 |
| 7291902 |
Chip component and method for producing a chip component |
Nov. 6, 2007 |
| 7285445 |
Direct cooling of LEDs |
Oct. 23, 2007 |
| 7285850 |
Support elements for semiconductor devices with peripherally located bond pads |
Oct. 23, 2007 |
| 7282788 |
Image sensing chip package structure |
Oct. 16, 2007 |
| 7279782 |
FBGA and COB package structure for image sensor |
Oct. 9, 2007 |
| 7276787 |
Silicon chip carrier with conductive through-vias and method for fabricating same |
Oct. 2, 2007 |
| 7274101 |
Semiconductor package and method for manufacturing the same |
Sep. 25, 2007 |
| 7274096 |
Light transmissive cover, device provided with same and methods for manufacturing them |
Sep. 25, 2007 |
| 7274095 |
Interposers with receptacles for receiving semiconductor devices and assemblies and packages including such interposers |
Sep. 25, 2007 |
| 7274094 |
Leadless packaging for image sensor devices |
Sep. 25, 2007 |
| 7268436 |
Electronic device with cavity and a method for producing the same |
Sep. 11, 2007 |
| 7263768 |
Method of making a semiconductor device having an opening in a solder mask |
Sep. 4, 2007 |
| 7262500 |
Interconnection structure |
Aug. 28, 2007 |
| 7245007 |
Exposed lead interposer leadframe package |
Jul. 17, 2007 |
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