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Class Information
Number: 257/680
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With window means
Description: Subject matter under 678 wherein the housing or package has a physical opening or area otherwise transparent to ultraviolet, visible, or infrared light.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7619304 |
Panel and semiconductor component having a composite board with semiconductor chips and plastic package molding compound and method for the production thereof |
Nov. 17, 2009 |
| 7612385 |
High power light-emitting diode package comprising substrate having beacon |
Nov. 3, 2009 |
| 7612440 |
Package for an integrated circuit |
Nov. 3, 2009 |
| 7612441 |
Image-sensing chip package module adapted to dual-side soldering |
Nov. 3, 2009 |
| 7612442 |
Semiconductor device |
Nov. 3, 2009 |
| 7605467 |
Package and electronic apparatus using the same |
Oct. 20, 2009 |
| 7605456 |
Inverter unit |
Oct. 20, 2009 |
| 7605455 |
Semiconductor device |
Oct. 20, 2009 |
| 7598617 |
Stack package utilizing through vias and re-distribution lines |
Oct. 6, 2009 |
| 7595549 |
Surface mount semiconductor device |
Sep. 29, 2009 |
| 7595220 |
Image sensor package and fabrication method thereof |
Sep. 29, 2009 |
| 7595268 |
Semiconductor package having re-distribution lines for supplying power and a method for manufacturing the same |
Sep. 29, 2009 |
| 7586185 |
Semiconductor device having a functional surface |
Sep. 8, 2009 |
| 7582944 |
Optical apparatus and optical module using the same |
Sep. 1, 2009 |
| 7582959 |
Driver module structure with flexible circuit board |
Sep. 1, 2009 |
| 7576401 |
Direct glass attached on die optical module |
Aug. 18, 2009 |
| 7576403 |
Method of manufacturing infrared rays receiver and structure thereof |
Aug. 18, 2009 |
| 7567235 |
Self-aligning optical sensor package |
Jul. 28, 2009 |
| 7566969 |
Semiconductor device with improved arrangement of a through-hole in a wiring substrate |
Jul. 28, 2009 |
| 7564125 |
Electronic array and methods for fabricating same |
Jul. 21, 2009 |
| 7557455 |
System and apparatus that reduce corrosion of an integrated circuit through its bond pads |
Jul. 7, 2009 |
| 7554184 |
Image sensor chip package |
Jun. 30, 2009 |
| 7554198 |
Flexible joint methodology to attach a die on an organic substrate |
Jun. 30, 2009 |
| 7550847 |
Packaged microelectronic devices and methods for packaging microelectronic devices |
Jun. 23, 2009 |
| 7550831 |
Electronic device and semiconductor device |
Jun. 23, 2009 |
| 7550812 |
Camera module and method of fabricating the same |
Jun. 23, 2009 |
| 7547955 |
Semiconductor imaging device and method for manufacturing the same |
Jun. 16, 2009 |
| 7547962 |
Chip package with a ring having a buffer groove that surrounds the active region of a chip |
Jun. 16, 2009 |
| 7541669 |
Semiconductor device package with base features to reduce leakage |
Jun. 2, 2009 |
| 7541671 |
Organic electronic devices having external barrier layer |
Jun. 2, 2009 |
| 7542302 |
Minimizing thickness of deadfronted display assemblies |
Jun. 2, 2009 |
| 7535085 |
Semiconductor package having improved adhesiveness and ground bonding |
May. 19, 2009 |
| 7535071 |
System and method of integrating optics into an IC package |
May. 19, 2009 |
| 7531785 |
Circuit device and method of manufacturing the same |
May. 12, 2009 |
| 7531906 |
Flip chip packaging using recessed interposer terminals |
May. 12, 2009 |
| 7529013 |
Optical modulator module package |
May. 5, 2009 |
| 7528474 |
Stacked semiconductor package assembly having hollowed substrate |
May. 5, 2009 |
| 7528472 |
Chip package mechanism |
May. 5, 2009 |
| 7528000 |
Method of fabricating optical device caps |
May. 5, 2009 |
| 7527990 |
Solid state imaging device and producing method thereof |
May. 5, 2009 |
| 7528491 |
Semiconductor components and assemblies including vias of varying lateral dimensions |
May. 5, 2009 |
| 7525186 |
Stack package having guard ring which insulates through-via interconnection plug and method for manufacturing the same |
Apr. 28, 2009 |
| 7521782 |
Optical device package structure |
Apr. 21, 2009 |
| 7521783 |
Ultra thin image sensor package structure and method for fabrication |
Apr. 21, 2009 |
| 7521807 |
Semiconductor device with inclined through holes |
Apr. 21, 2009 |
| 7518239 |
Semiconductor device with substrate having penetrating hole having a protrusion |
Apr. 14, 2009 |
| 7511367 |
Optical device and method for fabricating the same |
Mar. 31, 2009 |
| 7508059 |
Stacked chip package with redistribution lines |
Mar. 24, 2009 |
| 7508072 |
Semiconductor device with pad electrode for testing and manufacturing method of the same |
Mar. 24, 2009 |
| 7504666 |
Optical semiconductor package with compressible adjustment means |
Mar. 17, 2009 |
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