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Class Information
Number: 257/680
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With window means
Description: Subject matter under 678 wherein the housing or package has a physical opening or area otherwise transparent to ultraviolet, visible, or infrared light.










Sub-classes under this class:

Class Number Class Name Patents
257/681 For erasing eprom 75


Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17

Patent Number Title Of Patent Date Issued
8710514 Power surface mount light emitting die package Apr. 29, 2014
8704337 Semiconductor device and method for manufacturing the same Apr. 22, 2014
8679872 Light emitting device package and manufacturing method thereof Mar. 25, 2014
8680674 Methods and structures for reducing heat exposure of thermally sensitive semiconductor devices Mar. 25, 2014
8674462 Sensor package Mar. 18, 2014
8664683 Carrier and optical semiconductor device based on such a carrier Mar. 4, 2014
8652965 Production method for thick film metal electrode and production method for thick film resist Feb. 18, 2014
8637978 System-in-a-package based flash memory card Jan. 28, 2014
8624371 Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor Jan. 7, 2014
8624383 Integrated circuit package and method for fabrication thereof Jan. 7, 2014
8604599 Semiconductor housing and method for the production of a semiconductor housing Dec. 10, 2013
8593561 Camera module and method for fabricating the same Nov. 26, 2013
8593817 Power semiconductor module and method for operating a power semiconductor module Nov. 26, 2013
8587107 Silicon carbide semiconductor Nov. 19, 2013
8587106 Wide band and radio frequency waveguide and hybrid integration in a silicon package Nov. 19, 2013
8558364 Inductive getter activation for high vacuum packaging Oct. 15, 2013
8552544 Package structure Oct. 8, 2013
8550639 Cover device for a micro-optomechanical component, and manufacturing method for such a cover device Oct. 8, 2013
8541873 Microelectronic packages having cavities for receiving microelectronic elements Sep. 24, 2013
8531018 Component comprising a chip in a cavity and a stress-reduced attachment Sep. 10, 2013
8519518 Integrated circuit packaging system with lead encapsulation and method of manufacture thereof Aug. 27, 2013
8498131 Interconnect structure Jul. 30, 2013
8497560 LED package and method of assembling the same Jul. 30, 2013
8476737 Environment-resistant module, micropackage and methods of manufacturing same Jul. 2, 2013
8477239 Integrated lens and chip assembly for a digital camera Jul. 2, 2013
8460971 Semiconductor device packaging structure and packaging method Jun. 11, 2013
8462510 Board-level package with tuned mass damping structure Jun. 11, 2013
8450847 Optoelectronic semiconductor chip fitted with a carrier May. 28, 2013
8450838 Electro-optic apparatus, electronic device, and method for manufacturing electro-optic apparatus May. 28, 2013
8440478 Light emitting device, package, light emitting device manufacturing method, package manufacturing method and package manufacturing die May. 14, 2013
8436385 Light emitting device package May. 7, 2013
8436433 Unattached contained semiconductor devices May. 7, 2013
8436452 Carrier for chip packages May. 7, 2013
8426954 Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor Apr. 23, 2013
8421219 Semiconductor component having adhesive squeeze-out prevention configuration and method of manufacturing the same Apr. 16, 2013
8411197 Image pickup device and production method thereof Apr. 2, 2013
8410561 Electronic device and method for manufacturing thereof Apr. 2, 2013
8395268 Semiconductor memory device Mar. 12, 2013
8395902 Modular chip stack and packaging technology with voltage segmentation, regulation, integrated decoupling capacitance and cooling structure and process Mar. 12, 2013
8384108 Light emitting device package Feb. 26, 2013
8378495 Integrated circuit (IC) having TSVS with dielectric crack suppression structures Feb. 19, 2013
8354742 Method and apparatus for a package having multiple stacked die Jan. 15, 2013
8351222 Package carrier for enclosing at least one microelectronic device Jan. 8, 2013
8351482 Multi-wavelength semiconductor laser device Jan. 8, 2013
8344492 Semiconductor device and method of manufacturing the same, and electronic apparatus Jan. 1, 2013
8345092 Imaging apparatus and endoscope Jan. 1, 2013
8329555 Method for producing a capping wafer for a sensor Dec. 11, 2012
8323998 Methods and apparatus for forming uniform layers of phosphor material on an LED encapsulation structure Dec. 4, 2012
8304285 Array-molded package-on-package having redistribution lines Nov. 6, 2012
8299589 Packaging device of image sensor Oct. 30, 2012

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