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Class Information
Number: 257/678
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package
Description: Subject matter wherein preformed physical means to cover or protect a solid-state electronic device is provided therefor.
Sub-classes under this class:
| Class Number |
Class Name |
Patents |
| 257/727 |
Device held in place by clamping |
570 |
| 257/708 |
Entirely of metal except for feedthrough |
132 |
| 257/728 |
For high frequency (e.g., microwave) device |
596 |
| 257/723 |
For plural devices |
1,810 |
| 257/687 |
Housing or package filled with solid or liquid electrically insulating material |
522 |
| 257/701 |
Insulating material |
764 |
| 257/685 |
Multiple housings |
591 |
| 257/730 |
Outside periphery of package having specified shape or configuration |
598 |
| 257/729 |
Portion of housing of specific materials |
223 |
| 257/679 |
Smart (e.g., credit) card package |
455 |
| 257/690 |
With contact or lead |
1,079 |
| 257/682 |
With desiccant, getter, or gas filling |
103 |
| 257/731 |
With housing mount |
179 |
| 257/688 |
With large area flexible electrodes in press contact with opposite sides of active semiconductor chip and surrounded by an insulating element, e.g., ring |
257 |
| 257/683 |
With means to prevent explosion of package |
44 |
| 257/712 |
With provision for cooling the housing or its contents |
1,335 |
| 257/684 |
With semiconductor element forming part (e.g., base, of housing) |
513 |
| 257/680 |
With window means |
565 |
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7095116 |
Aluminum-free under bump metallization structure |
Aug. 22, 2006 |
| 7091582 |
Electronic package with snap-on perimeter wall |
Aug. 15, 2006 |
| 7091583 |
Method and structure for prevention leakage of substrate strip |
Aug. 15, 2006 |
| 7091584 |
Semiconductor package assembly and method for electrically isolating modules |
Aug. 15, 2006 |
| 7091596 |
Semiconductor packages and leadframe assemblies |
Aug. 15, 2006 |
| 7087439 |
Method and apparatus for thermally assisted testing of integrated circuits |
Aug. 8, 2006 |
| 7084391 |
Image sensing module |
Aug. 1, 2006 |
| 7084496 |
Method and apparatus for providing optoelectronic communication with an electronic device |
Aug. 1, 2006 |
| 7084512 |
Circuit substrate and its manufacturing method |
Aug. 1, 2006 |
| 7081660 |
Hermetic package with internal ground pads |
Jul. 25, 2006 |
| 7081661 |
High-frequency module and method for manufacturing the same |
Jul. 25, 2006 |
| 7078789 |
Method of forming a metal film, semiconductor device and wiring board |
Jul. 18, 2006 |
| 7078790 |
Semiconductor stacked die devices and methods of forming semiconductor stacked die devices |
Jul. 18, 2006 |
| 7078795 |
High voltage module and method for producing same |
Jul. 18, 2006 |
| 7075172 |
Lead-frame for semiconductor devices |
Jul. 11, 2006 |
| 7075175 |
Systems and methods for testing packaged dies |
Jul. 11, 2006 |
| 7075178 |
Semiconductor laser |
Jul. 11, 2006 |
| 7071544 |
Wafer level assembly package |
Jul. 4, 2006 |
| 7071569 |
Electrical package capable of increasing the density of bonding pads and fine circuit lines inside a interconnection |
Jul. 4, 2006 |
| 7067907 |
Semiconductor package having angulated interconnect surfaces |
Jun. 27, 2006 |
| 7064003 |
Memory package |
Jun. 20, 2006 |
| 7064421 |
Wire bonding package |
Jun. 20, 2006 |
| 7064422 |
Electronic assembly with integrated IO and power contacts |
Jun. 20, 2006 |
| 7064423 |
IC module and IC card |
Jun. 20, 2006 |
| 7061081 |
Resin composition, heat-resistant resin paste and semiconductor device using them and method for manufacture thereof |
Jun. 13, 2006 |
| 7061082 |
Semiconductor die with attached heat sink and transfer mold |
Jun. 13, 2006 |
| 7061092 |
High-density modularity for ICS |
Jun. 13, 2006 |
| 7061106 |
Structure of image sensor module and a method for manufacturing of wafer level package |
Jun. 13, 2006 |
| 7053470 |
Multi-chip package having repairable embedded memories on a system chip with an EEPROM chip storing repair information |
May. 30, 2006 |
| 7053473 |
Compact integrated circuit package |
May. 30, 2006 |
| 7053488 |
Micro-mirror package |
May. 30, 2006 |
| 7053496 |
Hybrid package with non-insertable and insertable conductive features, complementary receptacle, and methods of fabrication, assembly, and operation therefor |
May. 30, 2006 |
| 7054162 |
Security module system, apparatus and process |
May. 30, 2006 |
| 7049689 |
Chip on glass package |
May. 23, 2006 |
| 7045459 |
Thin film encapsulation of MEMS devices |
May. 16, 2006 |
| 7045883 |
Thermally enhanced chip scale lead on chip semiconductor package and method of making same |
May. 16, 2006 |
| 7045884 |
Semiconductor device package |
May. 16, 2006 |
| 7045885 |
Placement of absorbing material in a semiconductor device |
May. 16, 2006 |
| 7042072 |
Semiconductor package and method of manufacturing the same which reduces warpage |
May. 9, 2006 |
| 7042073 |
Semiconductor device and manufacturing method thereof |
May. 9, 2006 |
| 7042074 |
Power semiconductor module and method for producing it |
May. 9, 2006 |
| 7042082 |
Method and apparatus for a backsided and recessed optical package connection |
May. 9, 2006 |
| 7038257 |
System and method for providing scalability in an integrated circuit |
May. 2, 2006 |
| 7038321 |
Method of attaching a flip chip device and circuit assembly formed thereby |
May. 2, 2006 |
| 7038322 |
Multi-chip module |
May. 2, 2006 |
| 7039263 |
Electrooptic assembly |
May. 2, 2006 |
| 7033664 |
Methods for producing packaged integrated circuit devices and packaged integrated circuit devices produced thereby |
Apr. 25, 2006 |
| 7033857 |
Method of manufacturing a semiconductor device |
Apr. 25, 2006 |
| 7034373 |
Wide band cross point switch using MEMS technology |
Apr. 25, 2006 |
| 7034383 |
Electronic component and panel and method for producing the same |
Apr. 25, 2006 |
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