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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
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Class Information
Number: 257/678
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package
Description: Subject matter wherein preformed physical means to cover or protect a solid-state electronic device is provided therefor.


Sub-classes under this class:

Class Number Class Name Patents
257/727 Device held in place by clamping 569
257/708 Entirely of metal except for feedthrough 132
257/728 For high frequency (e.g., microwave) device 594
257/723 For plural devices 1,802
257/687 Housing or package filled with solid or liquid electrically insulating material 521
257/701 Insulating material 759
257/685 Multiple housings 586
257/730 Outside periphery of package having specified shape or configuration 596
257/729 Portion of housing of specific materials 223
257/679 Smart (e.g., credit) card package 453
257/690 With contact or lead 1,075
257/682 With desiccant, getter, or gas filling 100
257/731 With housing mount 179
257/688 With large area flexible electrodes in press contact with opposite sides of active semiconductor chip and surrounded by an insulating element, e.g., ring 256
257/683 With means to prevent explosion of package 44
257/712 With provision for cooling the housing or its contents 1,328
257/684 With semiconductor element forming part (e.g., base, of housing) 509
257/680 With window means 559


Patents under this class:

Patent Number Title Of Patent Date Issued
7459838 Plasma display device, TCP applied thereto, and method of manufacturing the TCP Dec. 2, 2008
7459783 Light emitting chip package and light source module Dec. 2, 2008
7459782 Stiffener for flip chip BGA package Dec. 2, 2008
7457337 Optical module having case grounding using bypass capacitor Nov. 25, 2008
7456497 Electronic devices and its production methods Nov. 25, 2008
7453157 Microelectronic packages and methods therefor Nov. 18, 2008
7453141 Semiconductor device package, method of manufacturing the same, and semiconductor device Nov. 18, 2008
7449784 Device package and methods for the fabrication and testing thereof Nov. 11, 2008
7449781 Printed wiring board Nov. 11, 2008
7446406 Circuit device and manufacturing method thereof Nov. 4, 2008
7446401 Structure of power semiconductor with twin metal and ceramic plates Nov. 4, 2008
7443016 Semiconductor device for use as multimedia memory card, has encapsulant with chamfer such that portion of substrate and chamfer are exposed from encapsulant and remaining portion of surface of Oct. 28, 2008
7443002 Encapsulated microstructure and method of producing one such microstructure Oct. 28, 2008
7439613 Substrate based unmolded package Oct. 21, 2008
7436052 Repatterned integrated circuit chip package Oct. 14, 2008
7436051 Component for fabricating an electronic device and method of fabricating an electronic device Oct. 14, 2008
7436050 Semiconductor device having a flexible printed circuit Oct. 14, 2008
7435664 Wafer-level bonding for mechanically reinforced ultra-thin die Oct. 14, 2008
7432586 Apparatus and method for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages Oct. 7, 2008
7432532 Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat Oct. 7, 2008
7430359 Micromechanical system containing a microfluidic lubricant channel Sep. 30, 2008
7429798 Integrated circuit package-in-package system Sep. 30, 2008
7429793 Semiconductor device having an electronic circuit disposed therein Sep. 30, 2008
7429784 Package structure Sep. 30, 2008
7429783 Image sensor package Sep. 30, 2008
7429782 Semiconductor stack block comprising semiconductor chips and methods for producing the same Sep. 30, 2008
7429781 Memory package Sep. 30, 2008
7429758 Optoelectronic component and method for producing it Sep. 30, 2008
7429497 Hybrid package with non-insertable and insertable conductive features, complementary receptacle, and methods of fabrication therefor Sep. 30, 2008
7428255 Semiconductor laser Sep. 23, 2008
7427807 Chip heat dissipation structure and manufacturing method Sep. 23, 2008
7427804 Optoelectronic semiconductor device and light signal input/output device Sep. 23, 2008
7425763 Electronic circuit package Sep. 16, 2008
7425757 Semiconductor power module Sep. 16, 2008
7425466 Wire bonding system and method of use Sep. 16, 2008
7423340 Semiconductor package free of substrate and fabrication method thereof Sep. 9, 2008
7423339 Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice Sep. 9, 2008
7423338 Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice Sep. 9, 2008
7423332 Vertical laminated electrical switch circuit Sep. 9, 2008
7421781 Method of forming a module component having a plurality of penetration holes Sep. 9, 2008
7420728 Methods of fabricating interferometric modulators by selectively removing a material Sep. 2, 2008
7420267 Image sensor assembly and method for fabricating the same Sep. 2, 2008
7417327 IC chip package with cover Aug. 26, 2008
7417309 Circuit device and portable device with symmetrical arrangement Aug. 26, 2008
7414304 Semiconductor device Aug. 19, 2008
7414269 Housing for a radiation-emitting component, method for the production thereof, and radiation-emitting component Aug. 19, 2008
7411286 Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice Aug. 12, 2008
7411283 Interconnect design for reducing radiated emissions Aug. 12, 2008
7411282 LSI package provided with interface module, and transmission line header employed in the package Aug. 12, 2008
7411281 Integrated circuit device package having both wire bond and flip-chip interconnections and method of making the same Aug. 12, 2008



 
 
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