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Class Information
Number: 257/678
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package
Description: Subject matter wherein preformed physical means to cover or protect a solid-state electronic device is provided therefor.
Sub-classes under this class:
| Class Number |
Class Name |
Patents |
| 257/727 |
Device held in place by clamping |
590 |
| 257/708 |
Entirely of metal except for feedthrough |
136 |
| 257/728 |
For high frequency (e.g., microwave) device |
626 |
| 257/723 |
For plural devices |
1,953 |
| 257/687 |
Housing or package filled with solid or liquid electrically insulating material |
542 |
| 257/701 |
Insulating material |
814 |
| 257/685 |
Multiple housings |
661 |
| 257/730 |
Outside periphery of package having specified shape or configuration |
632 |
| 257/729 |
Portion of housing of specific materials |
234 |
| 257/679 |
Smart (e.g., credit) card package |
482 |
| 257/690 |
With contact or lead |
1,144 |
| 257/682 |
With desiccant, getter, or gas filling |
109 |
| 257/731 |
With housing mount |
193 |
| 257/688 |
With large area flexible electrodes in press contact with opposite sides of active semiconductor chip and surrounded by an insulating element, e.g., ring |
279 |
| 257/683 |
With means to prevent explosion of package |
47 |
| 257/712 |
With provision for cooling the housing or its contents |
1,424 |
| 257/684 |
With semiconductor element forming part (e.g., base, of housing) |
544 |
| 257/680 |
With window means |
624 |
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7619304 |
Panel and semiconductor component having a composite board with semiconductor chips and plastic package molding compound and method for the production thereof |
Nov. 17, 2009 |
| 7619303 |
Integrated circuit package |
Nov. 17, 2009 |
| 7615854 |
Semiconductor package that includes stacked semiconductor die |
Nov. 10, 2009 |
| 7615842 |
Inductor integrated chip |
Nov. 10, 2009 |
| 7612444 |
Semiconductor package with flow controller |
Nov. 3, 2009 |
| 7612441 |
Image-sensing chip package module adapted to dual-side soldering |
Nov. 3, 2009 |
| 7612440 |
Package for an integrated circuit |
Nov. 3, 2009 |
| 7608917 |
Power semiconductor module |
Oct. 27, 2009 |
| 7606049 |
Module thermal management system and method |
Oct. 20, 2009 |
| 7605478 |
Semiconductor package and method of manufacturing the same |
Oct. 20, 2009 |
| 7605459 |
Coreless substrate and manufacturing thereof |
Oct. 20, 2009 |
| 7605453 |
Chip module and chip card |
Oct. 20, 2009 |
| 7602057 |
Signal light using phosphor coated LEDs |
Oct. 13, 2009 |
| 7602056 |
On-die termination method for multi-chip packages |
Oct. 13, 2009 |
| 7602055 |
Semiconductor device and method for fabricating the same |
Oct. 13, 2009 |
| 7602054 |
Method of forming a molded array package device having an exposed tab and structure |
Oct. 13, 2009 |
| 7602052 |
Semiconductor device |
Oct. 13, 2009 |
| 7601563 |
Small form factor molded memory card and a method thereof |
Oct. 13, 2009 |
| 7598617 |
Stack package utilizing through vias and re-distribution lines |
Oct. 6, 2009 |
| 7598603 |
Electronic component having a power switch with an anode thereof mounted on a die attach region of a heat sink |
Oct. 6, 2009 |
| 7598125 |
Method for wafer level packaging and fabricating cap structures |
Oct. 6, 2009 |
| 7595553 |
Packaging board and manufacturing method therefor, semiconductor module and mobile apparatus |
Sep. 29, 2009 |
| 7595268 |
Semiconductor package having re-distribution lines for supplying power and a method for manufacturing the same |
Sep. 29, 2009 |
| 7595220 |
Image sensor package and fabrication method thereof |
Sep. 29, 2009 |
| 7592688 |
Semiconductor package |
Sep. 22, 2009 |
| 7589787 |
Solid state image sensing device |
Sep. 15, 2009 |
| 7589405 |
Memory cards and method of fabricating the memory cards |
Sep. 15, 2009 |
| 7589282 |
Wiring board and a semiconductor device using the same |
Sep. 15, 2009 |
| 7586193 |
Mm-wave antenna using conventional IC packaging |
Sep. 8, 2009 |
| 7586180 |
Semiconductor packaging device comprising a semiconductor chip including a MOSFET |
Sep. 8, 2009 |
| 7583511 |
Semiconductor die package with internal bypass capacitors |
Sep. 1, 2009 |
| 7582959 |
Driver module structure with flexible circuit board |
Sep. 1, 2009 |
| 7582958 |
Semiconductor package |
Sep. 1, 2009 |
| 7582952 |
Method for providing and removing discharging interconnect for chip-on-glass output leads and structures thereof |
Sep. 1, 2009 |
| 7579683 |
Memory interface optimized for stacked configurations |
Aug. 25, 2009 |
| 7579682 |
Power semiconductor module |
Aug. 25, 2009 |
| 7579681 |
Super high density module with integrated wafer level packages |
Aug. 25, 2009 |
| 7579678 |
Semiconductor microphone unit |
Aug. 25, 2009 |
| 7579628 |
Backlight device for liquid crystal display including a plurality of light emitting diodes within their own concaves aligned in a straight line within a larger concave |
Aug. 25, 2009 |
| 7576429 |
Packaged semiconductor device with dual exposed surfaces and method of manufacturing |
Aug. 18, 2009 |
| 7576422 |
Semiconductor device |
Aug. 18, 2009 |
| 7576420 |
Semiconductor integrated circuit device having reduced terminals and I/O area |
Aug. 18, 2009 |
| 7576419 |
Semiconductor device |
Aug. 18, 2009 |
| 7573126 |
Matching circuits on optoelectronic devices |
Aug. 11, 2009 |
| 7573125 |
Methods for reducing stress in microelectronic devices and microelectronic devices formed using such methods |
Aug. 11, 2009 |
| 7569933 |
Housing for accommodating microwave devices having an insulating cup member |
Aug. 4, 2009 |
| 7569922 |
Semiconductor device having a bonding wire and method for manufacturing the same |
Aug. 4, 2009 |
| 7569920 |
Electronic component having at least one vertical semiconductor power transistor |
Aug. 4, 2009 |
| 7569919 |
Multi-chip package for reducing test time |
Aug. 4, 2009 |
| 7567599 |
Semiconductor laser diode device with thermal conductive encapsulating resin and method for manufacturing the same |
Jul. 28, 2009 |
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