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Class Information
Number: 257/678
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package
Description: Subject matter wherein preformed physical means to cover or protect a solid-state electronic device is provided therefor.


Sub-classes under this class:

Class Number Class Name Patents
257/727 Device held in place by clamping 590
257/708 Entirely of metal except for feedthrough 136
257/728 For high frequency (e.g., microwave) device 626
257/723 For plural devices 1,953
257/687 Housing or package filled with solid or liquid electrically insulating material 542
257/701 Insulating material 814
257/685 Multiple housings 661
257/730 Outside periphery of package having specified shape or configuration 632
257/729 Portion of housing of specific materials 234
257/679 Smart (e.g., credit) card package 482
257/690 With contact or lead 1,144
257/682 With desiccant, getter, or gas filling 109
257/731 With housing mount 193
257/688 With large area flexible electrodes in press contact with opposite sides of active semiconductor chip and surrounded by an insulating element, e.g., ring 279
257/683 With means to prevent explosion of package 47
257/712 With provision for cooling the housing or its contents 1,424
257/684 With semiconductor element forming part (e.g., base, of housing) 544
257/680 With window means 624


Patents under this class:

Patent Number Title Of Patent Date Issued
7619304 Panel and semiconductor component having a composite board with semiconductor chips and plastic package molding compound and method for the production thereof Nov. 17, 2009
7619303 Integrated circuit package Nov. 17, 2009
7615854 Semiconductor package that includes stacked semiconductor die Nov. 10, 2009
7615842 Inductor integrated chip Nov. 10, 2009
7612444 Semiconductor package with flow controller Nov. 3, 2009
7612441 Image-sensing chip package module adapted to dual-side soldering Nov. 3, 2009
7612440 Package for an integrated circuit Nov. 3, 2009
7608917 Power semiconductor module Oct. 27, 2009
7606049 Module thermal management system and method Oct. 20, 2009
7605478 Semiconductor package and method of manufacturing the same Oct. 20, 2009
7605459 Coreless substrate and manufacturing thereof Oct. 20, 2009
7605453 Chip module and chip card Oct. 20, 2009
7602057 Signal light using phosphor coated LEDs Oct. 13, 2009
7602056 On-die termination method for multi-chip packages Oct. 13, 2009
7602055 Semiconductor device and method for fabricating the same Oct. 13, 2009
7602054 Method of forming a molded array package device having an exposed tab and structure Oct. 13, 2009
7602052 Semiconductor device Oct. 13, 2009
7601563 Small form factor molded memory card and a method thereof Oct. 13, 2009
7598617 Stack package utilizing through vias and re-distribution lines Oct. 6, 2009
7598603 Electronic component having a power switch with an anode thereof mounted on a die attach region of a heat sink Oct. 6, 2009
7598125 Method for wafer level packaging and fabricating cap structures Oct. 6, 2009
7595553 Packaging board and manufacturing method therefor, semiconductor module and mobile apparatus Sep. 29, 2009
7595268 Semiconductor package having re-distribution lines for supplying power and a method for manufacturing the same Sep. 29, 2009
7595220 Image sensor package and fabrication method thereof Sep. 29, 2009
7592688 Semiconductor package Sep. 22, 2009
7589787 Solid state image sensing device Sep. 15, 2009
7589405 Memory cards and method of fabricating the memory cards Sep. 15, 2009
7589282 Wiring board and a semiconductor device using the same Sep. 15, 2009
7586193 Mm-wave antenna using conventional IC packaging Sep. 8, 2009
7586180 Semiconductor packaging device comprising a semiconductor chip including a MOSFET Sep. 8, 2009
7583511 Semiconductor die package with internal bypass capacitors Sep. 1, 2009
7582959 Driver module structure with flexible circuit board Sep. 1, 2009
7582958 Semiconductor package Sep. 1, 2009
7582952 Method for providing and removing discharging interconnect for chip-on-glass output leads and structures thereof Sep. 1, 2009
7579683 Memory interface optimized for stacked configurations Aug. 25, 2009
7579682 Power semiconductor module Aug. 25, 2009
7579681 Super high density module with integrated wafer level packages Aug. 25, 2009
7579678 Semiconductor microphone unit Aug. 25, 2009
7579628 Backlight device for liquid crystal display including a plurality of light emitting diodes within their own concaves aligned in a straight line within a larger concave Aug. 25, 2009
7576429 Packaged semiconductor device with dual exposed surfaces and method of manufacturing Aug. 18, 2009
7576422 Semiconductor device Aug. 18, 2009
7576420 Semiconductor integrated circuit device having reduced terminals and I/O area Aug. 18, 2009
7576419 Semiconductor device Aug. 18, 2009
7573126 Matching circuits on optoelectronic devices Aug. 11, 2009
7573125 Methods for reducing stress in microelectronic devices and microelectronic devices formed using such methods Aug. 11, 2009
7569933 Housing for accommodating microwave devices having an insulating cup member Aug. 4, 2009
7569922 Semiconductor device having a bonding wire and method for manufacturing the same Aug. 4, 2009
7569920 Electronic component having at least one vertical semiconductor power transistor Aug. 4, 2009
7569919 Multi-chip package for reducing test time Aug. 4, 2009
7567599 Semiconductor laser diode device with thermal conductive encapsulating resin and method for manufacturing the same Jul. 28, 2009



 
 
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