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Class Information
Number: 257/678
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package
Description: Subject matter wherein preformed physical means to cover or protect a solid-state electronic device is provided therefor.
Sub-classes under this class:
| Class Number |
Class Name |
Patents |
| 257/727 |
Device held in place by clamping |
569 |
| 257/708 |
Entirely of metal except for feedthrough |
132 |
| 257/728 |
For high frequency (e.g., microwave) device |
594 |
| 257/723 |
For plural devices |
1,802 |
| 257/687 |
Housing or package filled with solid or liquid electrically insulating material |
521 |
| 257/701 |
Insulating material |
759 |
| 257/685 |
Multiple housings |
586 |
| 257/730 |
Outside periphery of package having specified shape or configuration |
596 |
| 257/729 |
Portion of housing of specific materials |
223 |
| 257/679 |
Smart (e.g., credit) card package |
453 |
| 257/690 |
With contact or lead |
1,075 |
| 257/682 |
With desiccant, getter, or gas filling |
100 |
| 257/731 |
With housing mount |
179 |
| 257/688 |
With large area flexible electrodes in press contact with opposite sides of active semiconductor chip and surrounded by an insulating element, e.g., ring |
256 |
| 257/683 |
With means to prevent explosion of package |
44 |
| 257/712 |
With provision for cooling the housing or its contents |
1,328 |
| 257/684 |
With semiconductor element forming part (e.g., base, of housing) |
509 |
| 257/680 |
With window means |
559 |
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7459838 |
Plasma display device, TCP applied thereto, and method of manufacturing the TCP |
Dec. 2, 2008 |
| 7459783 |
Light emitting chip package and light source module |
Dec. 2, 2008 |
| 7459782 |
Stiffener for flip chip BGA package |
Dec. 2, 2008 |
| 7457337 |
Optical module having case grounding using bypass capacitor |
Nov. 25, 2008 |
| 7456497 |
Electronic devices and its production methods |
Nov. 25, 2008 |
| 7453157 |
Microelectronic packages and methods therefor |
Nov. 18, 2008 |
| 7453141 |
Semiconductor device package, method of manufacturing the same, and semiconductor device |
Nov. 18, 2008 |
| 7449784 |
Device package and methods for the fabrication and testing thereof |
Nov. 11, 2008 |
| 7449781 |
Printed wiring board |
Nov. 11, 2008 |
| 7446406 |
Circuit device and manufacturing method thereof |
Nov. 4, 2008 |
| 7446401 |
Structure of power semiconductor with twin metal and ceramic plates |
Nov. 4, 2008 |
| 7443016 |
Semiconductor device for use as multimedia memory card, has encapsulant with chamfer such that portion of substrate and chamfer are exposed from encapsulant and remaining portion of surface of |
Oct. 28, 2008 |
| 7443002 |
Encapsulated microstructure and method of producing one such microstructure |
Oct. 28, 2008 |
| 7439613 |
Substrate based unmolded package |
Oct. 21, 2008 |
| 7436052 |
Repatterned integrated circuit chip package |
Oct. 14, 2008 |
| 7436051 |
Component for fabricating an electronic device and method of fabricating an electronic device |
Oct. 14, 2008 |
| 7436050 |
Semiconductor device having a flexible printed circuit |
Oct. 14, 2008 |
| 7435664 |
Wafer-level bonding for mechanically reinforced ultra-thin die |
Oct. 14, 2008 |
| 7432586 |
Apparatus and method for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages |
Oct. 7, 2008 |
| 7432532 |
Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat |
Oct. 7, 2008 |
| 7430359 |
Micromechanical system containing a microfluidic lubricant channel |
Sep. 30, 2008 |
| 7429798 |
Integrated circuit package-in-package system |
Sep. 30, 2008 |
| 7429793 |
Semiconductor device having an electronic circuit disposed therein |
Sep. 30, 2008 |
| 7429784 |
Package structure |
Sep. 30, 2008 |
| 7429783 |
Image sensor package |
Sep. 30, 2008 |
| 7429782 |
Semiconductor stack block comprising semiconductor chips and methods for producing the same |
Sep. 30, 2008 |
| 7429781 |
Memory package |
Sep. 30, 2008 |
| 7429758 |
Optoelectronic component and method for producing it |
Sep. 30, 2008 |
| 7429497 |
Hybrid package with non-insertable and insertable conductive features, complementary receptacle, and methods of fabrication therefor |
Sep. 30, 2008 |
| 7428255 |
Semiconductor laser |
Sep. 23, 2008 |
| 7427807 |
Chip heat dissipation structure and manufacturing method |
Sep. 23, 2008 |
| 7427804 |
Optoelectronic semiconductor device and light signal input/output device |
Sep. 23, 2008 |
| 7425763 |
Electronic circuit package |
Sep. 16, 2008 |
| 7425757 |
Semiconductor power module |
Sep. 16, 2008 |
| 7425466 |
Wire bonding system and method of use |
Sep. 16, 2008 |
| 7423340 |
Semiconductor package free of substrate and fabrication method thereof |
Sep. 9, 2008 |
| 7423339 |
Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice |
Sep. 9, 2008 |
| 7423338 |
Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice |
Sep. 9, 2008 |
| 7423332 |
Vertical laminated electrical switch circuit |
Sep. 9, 2008 |
| 7421781 |
Method of forming a module component having a plurality of penetration holes |
Sep. 9, 2008 |
| 7420728 |
Methods of fabricating interferometric modulators by selectively removing a material |
Sep. 2, 2008 |
| 7420267 |
Image sensor assembly and method for fabricating the same |
Sep. 2, 2008 |
| 7417327 |
IC chip package with cover |
Aug. 26, 2008 |
| 7417309 |
Circuit device and portable device with symmetrical arrangement |
Aug. 26, 2008 |
| 7414304 |
Semiconductor device |
Aug. 19, 2008 |
| 7414269 |
Housing for a radiation-emitting component, method for the production thereof, and radiation-emitting component |
Aug. 19, 2008 |
| 7411286 |
Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice |
Aug. 12, 2008 |
| 7411283 |
Interconnect design for reducing radiated emissions |
Aug. 12, 2008 |
| 7411282 |
LSI package provided with interface module, and transmission line header employed in the package |
Aug. 12, 2008 |
| 7411281 |
Integrated circuit device package having both wire bond and flip-chip interconnections and method of making the same |
Aug. 12, 2008 |
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