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Class Information
Number: 257/678
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package
Description: Subject matter wherein preformed physical means to cover or protect a solid-state electronic device is provided therefor.










Sub-classes under this class:

Class Number Class Name Patents
257/727 Device held in place by clamping 674
257/708 Entirely of metal except for feedthrough 164
257/728 For high frequency (e.g., microwave) device 812
257/723 For plural devices 2,775
257/687 Housing or package filled with solid or liquid electrically insulating material 788
257/701 Insulating material 1,075
257/685 Multiple housings 1,063
257/730 Outside periphery of package having specified shape or configuration 844
257/729 Portion of housing of specific materials 312
257/679 Smart (e.g., credit) card package 636
257/690 With contact or lead 1,837
257/682 With desiccant, getter, or gas filling 165
257/731 With housing mount 248
257/688 With large area flexible electrodes in press contact with opposite sides of active semiconductor chip and surrounded by an insulating element, e.g., ring 390
257/683 With means to prevent explosion of package 56
257/712 With provision for cooling the housing or its contents 1,910
257/684 With semiconductor element forming part (e.g., base, of housing) 823
257/680 With window means 834


Patents under this class:

Patent Number Title Of Patent Date Issued
8710638 Socket type MEMS device with stand-off portion Apr. 29, 2014
8710554 Biosensor kit Apr. 29, 2014
8709841 Woven mesh substrate with semiconductor elements, and method and device for manufacturing the same Apr. 29, 2014
8704384 Stacked die assembly Apr. 22, 2014
8704350 Stacked wafer level package and method of manufacturing the same Apr. 22, 2014
8704348 Polyol photosensitizers, carrier gas UV laser ablation sensitizers, and other additives and methods for making and using same Apr. 22, 2014
8704347 Packaged semiconductor chips Apr. 22, 2014
8704106 Ferroelectric component and manufacturing the same Apr. 22, 2014
8703539 Multiple die packaging interposer structure and method Apr. 22, 2014
8692364 Semiconductor device and method for manufacturing the same Apr. 8, 2014
8692363 Electric part package and manufacturing method thereof Apr. 8, 2014
8692362 Semiconductor structure having conductive vias and method for manufacturing the same Apr. 8, 2014
8692262 Light emitting device package and light unit having the same Apr. 8, 2014
8687668 Multi-wavelength semiconductor laser device Apr. 1, 2014
8686554 Vertically mountable semiconductor device package Apr. 1, 2014
8686551 Substrate for a microelectronic package and method of fabricating thereof Apr. 1, 2014
8686548 Wiring substrate, method for manufacturing wiring substrate, and semiconductor package including wiring substrate Apr. 1, 2014
8685792 Integrated circuit package system with interposer Apr. 1, 2014
8681510 Circuit board Mar. 25, 2014
8680663 Methods and apparatus for package on package devices with reduced strain Mar. 25, 2014
8680662 Wafer level edge stacking Mar. 25, 2014
8674511 Method of forming a semiconductor device with a contact pad on a sloped silicon dioxide surface Mar. 18, 2014
8674509 Integrated circuit die assembly with heat spreader Mar. 18, 2014
8674498 MEMS package and method for the production thereof Mar. 18, 2014
8674492 Power module Mar. 18, 2014
8674491 Semiconductor device Mar. 18, 2014
8674490 Semiconductor die package including IC driver and bridge Mar. 18, 2014
8674489 Interconnect structure with cavity having one or several contact rises on the wall of the cavity and method for producing same Mar. 18, 2014
8673773 Method for producing a nanoporous layer Mar. 18, 2014
8673741 Etching a laser-cut semiconductor before dicing a die attach film (DAF) or other material layer Mar. 18, 2014
8671565 Blind via capture pad structure fabrication method Mar. 18, 2014
8669138 Semiconductor device and method for manufacturing the same Mar. 11, 2014
8664780 Semiconductor package having plural semiconductor chips and method of forming the same Mar. 4, 2014
8664757 High density chip stacked package, package-on-package and method of fabricating the same Mar. 4, 2014
8664756 Reconstituted wafer package with high voltage discrete active dice and integrated field plate for high temperature leakage current stability Mar. 4, 2014
8664748 Package-level integrated circuit connection without top metal pads or bonding wire Mar. 4, 2014
8659154 Semiconductor device including adhesive covered element Feb. 25, 2014
8659134 Multi-chip package and manufacturing method Feb. 25, 2014
8659129 Semiconductor device and method of manufacturing same Feb. 25, 2014
8659046 Light emitting device package and method for fabricating the same Feb. 25, 2014
8653649 Device housing package and mounting structure Feb. 18, 2014
8653643 Semiconductor module Feb. 18, 2014
8653639 Layered chip package and method of manufacturing same Feb. 18, 2014
8653636 Contactless communication medium Feb. 18, 2014
8653612 Semiconductor device Feb. 18, 2014
8648453 Semiconductor device and method for manufacturing the same Feb. 11, 2014
8643161 Semiconductor device having double side electrode structure Feb. 4, 2014
8642397 Semiconductor wafer level package (WLP) and method of manufacture thereof Feb. 4, 2014
8642393 Package on package devices and methods of forming same Feb. 4, 2014
8637980 Adhesive applications using alkali silicate glass for electronics Jan. 28, 2014











 
 
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