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Class Information
Number: 257/677
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Lead frame > Of specified material other than copper (e.g., kovar (t.m.))
Description: Subject matter wherein the electrically conductive lead frame is made up of a specific material other copper, which is a common material for lead frames.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7443013 |
Flexible substrate for package of die |
Oct. 28, 2008 |
| 7408248 |
Lead frame for semiconductor device |
Aug. 5, 2008 |
| 7408242 |
Carrier with reinforced leads that are to be connected to a chip |
Aug. 5, 2008 |
| 7397114 |
Semiconductor integrated circuit device and method of manufacturing the same |
Jul. 8, 2008 |
| 7378727 |
Memory device and a method of forming a memory device |
May. 27, 2008 |
| 7372142 |
Vertical conduction power electronic device package and corresponding assembling method |
May. 13, 2008 |
| 7368807 |
Low cost method to produce high volume lead frames |
May. 6, 2008 |
| 7368326 |
Methods and apparatus to reduce growth formations on plated conductive leads |
May. 6, 2008 |
| 7358598 |
Process for fabricating a semiconductor package and semiconductor package with leadframe |
Apr. 15, 2008 |
| 7348660 |
Semiconductor package based on lead-on-chip architecture, the fabrication thereof and a leadframe for implementing in a semiconductor package |
Mar. 25, 2008 |
| 7329944 |
Leadframe for semiconductor device |
Feb. 12, 2008 |
| 7323769 |
High performance chip scale leadframe package with thermal dissipating structure and annular element and method of manufacturing package |
Jan. 29, 2008 |
| 7285845 |
Lead frame for semiconductor package |
Oct. 23, 2007 |
| 7278202 |
Method for making overlay surface mount resistor |
Oct. 9, 2007 |
| 7268021 |
Lead frame and method of manufacturing the same |
Sep. 11, 2007 |
| 7265445 |
Integrated circuit package |
Sep. 4, 2007 |
| 7256431 |
Insulating substrate and semiconductor device having a thermally sprayed circuit pattern |
Aug. 14, 2007 |
| 7256481 |
Leadframes for improved moisture reliability and enhanced solderability of semiconductor devices |
Aug. 14, 2007 |
| 7253029 |
Non-magnetic, hermetically-sealed micro device package |
Aug. 7, 2007 |
| 7245006 |
Palladium-spot leadframes for high adhesion semiconductor devices and method of fabrication |
Jul. 17, 2007 |
| 7242078 |
Surface mount multichip devices |
Jul. 10, 2007 |
| 7233056 |
Chip scale package with heat spreader |
Jun. 19, 2007 |
| 7215014 |
Solderable metal finish for integrated circuit package leads and method for forming |
May. 8, 2007 |
| 7193300 |
Plastic leadframe and compliant fastener |
Mar. 20, 2007 |
| 7112873 |
Flip chip metal bonding to plastic leadframe |
Sep. 26, 2006 |
| 7098527 |
Integrated circuit package electrical enhancement with improved lead frame design |
Aug. 29, 2006 |
| 7038306 |
Semiconductor integrated circuit device and method of manufacturing the same |
May. 2, 2006 |
| 7019391 |
NANO IC packaging |
Mar. 28, 2006 |
| 7005731 |
Plastic lead frames for semiconductor devices and packages including same |
Feb. 28, 2006 |
| 6956282 |
Stabilizer/spacer for semiconductor device |
Oct. 18, 2005 |
| 6953986 |
Leadframes for high adhesion semiconductor devices and method of fabrication |
Oct. 11, 2005 |
| 6943435 |
Lead pin with Au-Ge based brazing material |
Sep. 13, 2005 |
| 6891253 |
Semiconductor integrated circuit device and method of manufacturing the same |
May. 10, 2005 |
| 6891198 |
Film carrier tape for mounting an electronic part |
May. 10, 2005 |
| 6885037 |
IC package with stacked sheet metal substrate |
Apr. 26, 2005 |
| 6882048 |
Lead frame and semiconductor package having a groove formed in the respective terminals for limiting a plating area |
Apr. 19, 2005 |
| 6838757 |
Preplating of semiconductor small outline no-lead leadframes |
Jan. 4, 2005 |
| 6821820 |
Lead frame manufacturing method |
Nov. 23, 2004 |
| 6791182 |
Semiconductor device |
Sep. 14, 2004 |
| 6784524 |
Stress shield for microelectronic dice |
Aug. 31, 2004 |
| 6774456 |
Configuration of fuses in semiconductor structures with Cu metallization |
Aug. 10, 2004 |
| 6762485 |
Plastic lead frames for semiconductor devices |
Jul. 13, 2004 |
| 6750479 |
Semiconductor component and a method for identifying a semiconductor component |
Jun. 15, 2004 |
| 6724073 |
Plastic lead frames for semiconductor devices and packages including same |
Apr. 20, 2004 |
| 6713852 |
Semiconductor leadframes plated with thick nickel, minimum palladium, and pure tin |
Mar. 30, 2004 |
| 6710373 |
Means for mounting photoelectric sensing elements, light emitting diodes, or the like |
Mar. 23, 2004 |
| 6707680 |
Surface applied passives |
Mar. 16, 2004 |
| 6692992 |
Hardened Fe-Ni alloy for the manufacture of integrated circuit leaderframes and manufacturing process |
Feb. 17, 2004 |
| 6646330 |
Lead frame for semiconductor device, process for producing the same and semiconductor device using the same |
Nov. 11, 2003 |
| 6593643 |
Semiconductor device lead frame |
Jul. 15, 2003 |
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