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Class Information
Number: 257/677
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Lead frame > Of specified material other than copper (e.g., kovar (t.m.))
Description: Subject matter wherein the electrically conductive lead frame is made up of a specific material other copper, which is a common material for lead frames.










Patents under this class:
1 2 3 4 5

Patent Number Title Of Patent Date Issued
8680663 Methods and apparatus for package on package devices with reduced strain Mar. 25, 2014
8669581 Light emitting device package including UV light emitting diode Mar. 11, 2014
8664745 Integrated inductor Mar. 4, 2014
8637892 LED package and method for manufacturing same Jan. 28, 2014
8624363 Method for semiconductor leadframes in low volume and rapid turnaround Jan. 7, 2014
8587101 Multi-chip module (MCM) power quad flat no-lead (PQFN) semiconductor package utilizing a leadframe for electrical interconnections Nov. 19, 2013
8581379 Lead frame and semiconductor device Nov. 12, 2013
8564107 Lead frame and method for manufacturing the same Oct. 22, 2013
8564114 Semiconductor package thermal tape window frame for heat sink attachment Oct. 22, 2013
8546923 Rigid power module suited for high-voltage applications Oct. 1, 2013
8541871 Multilayered lead frame for a semiconductor light-emitting device Sep. 24, 2013
8525307 Semiconductor device, lead frame assembly, and method for fabricating the same Sep. 3, 2013
8487424 Routable array metal integrated circuit package fabricated using partial etching process Jul. 16, 2013
8421198 Integrated circuit package system with external interconnects at high density Apr. 16, 2013
8304886 Semiconductor device having integral structure of contact pad and conductive line Nov. 6, 2012
8304872 Lead frame, method for manufacturing the same and semiconductor device Nov. 6, 2012
8264072 Electronic device Sep. 11, 2012
8159055 Semiconductor device, lead-frame product used for the same and method for manufacturing the same Apr. 17, 2012
8133759 Leadframe Mar. 13, 2012
8124460 Integrated circuit package system employing an exposed thermally conductive coating Feb. 28, 2012
8120151 Optical semiconductor device and method for manufacturing the same Feb. 21, 2012
8120153 High-temperature, wirebondless, injection-molded, ultra-compact hybrid power module Feb. 21, 2012
8110904 Lead frame for semiconductor device and method of manufacturing of the same Feb. 7, 2012
8101962 Carrying structure of semiconductor Jan. 24, 2012
8063471 Copper alloy sheet for electric and electronic parts Nov. 22, 2011
8039934 Resin-encapsulated semiconductor device and its manufacturing method Oct. 18, 2011
8030744 Arrangement for electrically connecting semiconductor circuit arrangements to an external contact device and method for producing the same Oct. 4, 2011
7994616 Multilayered lead frame for a semiconductor light-emitting device Aug. 9, 2011
7956445 Packaged integrated circuit having gold removed from a lead frame Jun. 7, 2011
7947534 Integrated circuit packaging system including a non-leaded package May. 24, 2011
7944030 Lead frame and method of manufacturing the same May. 17, 2011
7932130 Method for forming an etched recess package on package system Apr. 26, 2011
7911062 Electronic component with varying rigidity leads using Pb-free solder Mar. 22, 2011
7911041 Semiconductor device with gold coatings, and process for producing it Mar. 22, 2011
7879651 Packaging conductive structure and method for forming the same Feb. 1, 2011
7868432 Multi-chip module for battery power control Jan. 11, 2011
7839003 Semiconductor device including a coupling conductor having a concave and convex Nov. 23, 2010
7816770 Device and method for hermetically sealing a cavity in an electronic component Oct. 19, 2010
7788800 Method for fabricating a leadframe Sep. 7, 2010
7772681 Semiconductor die package and method for making the same Aug. 10, 2010
7755194 Composite barrier layers with controlled copper interface surface roughness Jul. 13, 2010
7732333 Process for producing and apparatus for improving the bonding between a plastic and a metal Jun. 8, 2010
7714422 Electronic module with a semiconductor chip and a component housing and methods for producing the same May. 11, 2010
7709938 Arrangement for electrically connecting semiconductor circuit arrangements to an external contact device and method for producing the same May. 4, 2010
7705438 Electronic component and leadframe for producing the component Apr. 27, 2010
7692277 Multilayered lead frame for a semiconductor light-emitting device Apr. 6, 2010
7662672 Manufacturing process of leadframe-based BGA packages Feb. 16, 2010
7656020 Packaging conductive structure for a semiconductor substrate having a metallic layer Feb. 2, 2010
7635911 Chip carrier and system including a chip carrier and semiconductor chips Dec. 22, 2009
7619304 Panel and semiconductor component having a composite board with semiconductor chips and plastic package molding compound and method for the production thereof Nov. 17, 2009

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