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Class Information
Number: 257/676
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Lead frame > With structure for mounting semiconductor chip to lead frame (e.g., configuration of die bonding flag, absence of a die bonding flag, recess for led)
Description: Subject matter wherein the lead frame is provided with specified structure means to mount a semiconductor chip thereto, or is specified to not have a pad for mounting the chip.










Patents under this class:

Patent Number Title Of Patent Date Issued
8710637 Semiconductor device and method of manufacturing the same Apr. 29, 2014
8710540 LED package with top and bottom electrodes Apr. 29, 2014
8709876 Electronic device Apr. 29, 2014
8709875 Power device and method of packaging same Apr. 29, 2014
8704344 Ultra-small chip package and method for manufacturing the same Apr. 22, 2014
8704293 Three dimensional semiconductor memory device and method for fabricating the same Apr. 22, 2014
8692387 Stacked die semiconductor package Apr. 8, 2014
8692361 Electric device package comprising a laminate and method of making an electric device package comprising a laminate Apr. 8, 2014
8692138 Mold structure for light-emitting diode package Apr. 8, 2014
8692134 Brace for long wire bond Apr. 8, 2014
8691630 Semiconductor package structure and manufacturing method thereof Apr. 8, 2014
8686569 Die arrangement and method of forming a die arrangement Apr. 1, 2014
8686547 Stack die structure for stress reduction and facilitation of electromagnetic shielding Apr. 1, 2014
8686546 Combined packaged power semiconductor device Apr. 1, 2014
8683684 Method of manufacturing component embedded printed circuit board Apr. 1, 2014
8680661 Direct contact package for power transistors Mar. 25, 2014
8680660 Brace for bond wire Mar. 25, 2014
8680659 Semiconductor device Mar. 25, 2014
8680585 Light emitting diode package and method of manufacturing the same Mar. 25, 2014
RE44811 High power light emitting diode package Mar. 18, 2014
8674521 Semiconductor device package including a paste member Mar. 18, 2014
8674497 Stacked half-bridge package with a current carrying layer Mar. 18, 2014
8674488 Light emitting diode (LED) packages Mar. 18, 2014
8674487 Semiconductor packages with lead extensions and related methods Mar. 18, 2014
8674486 Isolation barrier device and methods of use Mar. 18, 2014
8674485 Semiconductor device including leadframe with downsets Mar. 18, 2014
8669654 Integrated circuit packaging system with die paddle and method of manufacture thereof Mar. 11, 2014
8669650 Flip chip semiconductor device Mar. 11, 2014
8669649 Integrated circuit packaging system with interlock and method of manufacture thereof Mar. 11, 2014
8669647 Method for semiconductor leadframes in low volume and rapid turnaround Mar. 11, 2014
8669646 Apparatus and method for grounding an IC package lid for EMI reduction Mar. 11, 2014
8664755 Power module package and method for manufacturing the same Mar. 4, 2014
8664754 High power semiconductor package with multiple conductive clips Mar. 4, 2014
8664753 Semiconductor device with protruding component portion and method of packaging Mar. 4, 2014
8659145 Semiconductor device Feb. 25, 2014
8659133 Etched surface mount islands in a leadframe package Feb. 25, 2014
8659132 Microelectronic package assembly, method for disconnecting a microelectronic package Feb. 25, 2014
8659131 Structure for multi-row lead frame and semiconductor package capable of minimizing an under-cut Feb. 25, 2014
8659050 Slim LED package Feb. 25, 2014
8653647 Plastic package and method of fabricating the same Feb. 18, 2014
8653636 Contactless communication medium Feb. 18, 2014
8652920 Substrate with embedded patterned capacitance Feb. 18, 2014
8652881 Integrated circuit package system with anti-peel contact pads Feb. 18, 2014
8648456 Embedded integrated circuit package and method for manufacturing an embedded integrated circuit package Feb. 11, 2014
8648452 Resin molded semiconductor device and manufacturing method thereof Feb. 11, 2014
8648451 Semiconductor package, test socket and related methods Feb. 11, 2014
8643160 High voltage and high power boost converter with co-packaged Schottky diode Feb. 4, 2014
8643159 Lead frame with grooved lead finger Feb. 4, 2014
8643158 Semiconductor package and lead frame therefor Feb. 4, 2014
8643157 Integrated circuit package system having perimeter paddle Feb. 4, 2014











 
 
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