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Class Information
Number: 257/676
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Lead frame > With structure for mounting semiconductor chip to lead frame (e.g., configuration of die bonding flag, absence of a die bonding flag, recess for led)
Description: Subject matter wherein the lead frame is provided with specified structure means to mount a semiconductor chip thereto, or is specified to not have a pad for mounting the chip.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7459771 |
Assembly structure for electronic power integrated circuit formed on a semiconductor die and corresponding manufacturing process |
Dec. 2, 2008 |
| 7459770 |
Lead frame structure having blocking surfaces and semiconductor package integrated with the lead frame structure |
Dec. 2, 2008 |
| 7459765 |
Semiconductor apparatus with decoupling capacitor |
Dec. 2, 2008 |
| 7459345 |
Packaging method for an electronic element |
Dec. 2, 2008 |
| 7456500 |
Light source module and method for production thereof |
Nov. 25, 2008 |
| 7456494 |
Surface mount electronic component and process for manufacturing same |
Nov. 25, 2008 |
| 7456493 |
Structure for mounting semiconductor part in which bump and land portion are hardly detached from each other and method of manufacturing mounting substrate used therein |
Nov. 25, 2008 |
| 7452755 |
Embedded metal heat sink for semiconductor device and method for manufacturing the same |
Nov. 18, 2008 |
| 7449774 |
Semiconductor power module having an electrically insulating heat sink and method of manufacturing the same |
Nov. 11, 2008 |
| 7449771 |
Multiple leadframe laminated IC package |
Nov. 11, 2008 |
| 7449370 |
Production process for manufacturing such semiconductor package |
Nov. 11, 2008 |
| 7446397 |
Leadless semiconductor package |
Nov. 4, 2008 |
| 7443015 |
Integrated circuit package system with downset lead |
Oct. 28, 2008 |
| 7443014 |
Electronic module and method of assembling the same |
Oct. 28, 2008 |
| 7439612 |
Integrated circuit package structure with gap through lead bar between a die edge and an attachment point corresponding to a conductive connector |
Oct. 21, 2008 |
| 7439610 |
High power shunt switch with high isolation and ease of assembly |
Oct. 21, 2008 |
| 7436077 |
Semiconductor device and method of manufacturing the same |
Oct. 14, 2008 |
| 7436049 |
Lead frame, semiconductor chip package using the lead frame, and method of manufacturing the semiconductor chip package |
Oct. 14, 2008 |
| 7436048 |
Multichip leadframe package |
Oct. 14, 2008 |
| 7435993 |
High temperature, high voltage SiC void-less electronic package |
Oct. 14, 2008 |
| 7435624 |
Method of reducing mechanical stress on a semiconductor die during fabrication |
Oct. 14, 2008 |
| 7425763 |
Electronic circuit package |
Sep. 16, 2008 |
| 7425756 |
Semiconductor device and electronic device |
Sep. 16, 2008 |
| 7425755 |
Semiconductor package, method for manufacturing the same and lead frame for use in the same |
Sep. 16, 2008 |
| 7425469 |
Method for encapsulating an electronic component using a foil layer |
Sep. 16, 2008 |
| 7420266 |
Circuit device and manufacturing method thereof |
Sep. 2, 2008 |
| 7419855 |
Apparatus and method for miniature semiconductor packages |
Sep. 2, 2008 |
| 7417309 |
Circuit device and portable device with symmetrical arrangement |
Aug. 26, 2008 |
| 7417198 |
Radiofrequency power semiconductor module with cavity housing, and method for producing it |
Aug. 26, 2008 |
| 7414303 |
Lead on chip semiconductor package |
Aug. 19, 2008 |
| 7414300 |
Molded semiconductor package |
Aug. 19, 2008 |
| 7413975 |
Interconnect substrate, semiconductor device, methods of manufacturing the same, circuit board, and electronic equipment |
Aug. 19, 2008 |
| 7411289 |
Integrated circuit package with partially exposed contact pads and process for fabricating the same |
Aug. 12, 2008 |
| 7411280 |
Chip support of a leadframe for an integrated circuit package |
Aug. 12, 2008 |
| 7408245 |
IC package encapsulating a chip under asymmetric single-side leads |
Aug. 5, 2008 |
| 7408244 |
Semiconductor package and stack arrangement thereof |
Aug. 5, 2008 |
| 7408242 |
Carrier with reinforced leads that are to be connected to a chip |
Aug. 5, 2008 |
| 7408204 |
Flip-chip packaging structure for light emitting diode and method thereof |
Aug. 5, 2008 |
| 7405469 |
Semiconductor device and method of manufacturing the same |
Jul. 29, 2008 |
| 7405468 |
Plastic package and method of fabricating the same |
Jul. 29, 2008 |
| 7402896 |
Integrated circuit (IC) carrier assembly incorporating serpentine suspension |
Jul. 22, 2008 |
| 7402895 |
Semiconductor package structure and method of manufacture |
Jul. 22, 2008 |
| 7402462 |
Folded frame carrier for MOSFET BGA |
Jul. 22, 2008 |
| 7400002 |
MOSFET package |
Jul. 15, 2008 |
| 7399658 |
Pre-molded leadframe and method therefor |
Jul. 15, 2008 |
| 7397113 |
Semiconductor device |
Jul. 8, 2008 |
| 7397112 |
Semiconductor package and lead frame therefor |
Jul. 8, 2008 |
| 7394146 |
MOSFET package |
Jul. 1, 2008 |
| 7391102 |
Semiconductor apparatus configured with a lead frame having sufficient strenght to protect against external forces |
Jun. 24, 2008 |
| 7391101 |
Semiconductor pressure sensor |
Jun. 24, 2008 |
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