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Class Information
Number: 257/676
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Lead frame > With structure for mounting semiconductor chip to lead frame (e.g., configuration of die bonding flag, absence of a die bonding flag, recess for led)
Description: Subject matter wherein the lead frame is provided with specified structure means to mount a semiconductor chip thereto, or is specified to not have a pad for mounting the chip.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7619307 |
Leadframe-based semiconductor package having arched bend in a supporting bar and leadframe for the package |
Nov. 17, 2009 |
| 7618848 |
Integrated circuit package system with supported stacked die |
Nov. 17, 2009 |
| 7618845 |
Fabrication of an integrated circuit package |
Nov. 17, 2009 |
| 7615853 |
Chip-stacked package structure having leadframe with multi-piece bus bar |
Nov. 10, 2009 |
| 7615851 |
Integrated circuit package system |
Nov. 10, 2009 |
| 7612457 |
Semiconductor device including a stress buffer |
Nov. 3, 2009 |
| 7612439 |
Semiconductor package having improved thermal performance |
Nov. 3, 2009 |
| 7612438 |
Active matrix substrate with height control member |
Nov. 3, 2009 |
| 7612436 |
Packaged microelectronic devices with a lead frame |
Nov. 3, 2009 |
| 7608916 |
Aluminum leadframes for semiconductor QFN/SON devices |
Oct. 27, 2009 |
| 7608914 |
Integrated circuit package with electrically isolated leads |
Oct. 27, 2009 |
| 7605452 |
Semiconductor light-emitting device, semiconductor light-emitting module, and method of manufacturing the semiconductor light-emitting module |
Oct. 20, 2009 |
| 7605451 |
RF power transistor having an encapsulated chip package |
Oct. 20, 2009 |
| 7602053 |
Leadframe of a leadless flip-chip package and method for manufacturing the same |
Oct. 13, 2009 |
| 7602052 |
Semiconductor device |
Oct. 13, 2009 |
| 7602050 |
Integrated circuit packaging |
Oct. 13, 2009 |
| 7601560 |
Method for producing an electronic circuit |
Oct. 13, 2009 |
| 7598605 |
Semiconductor device having capacitive insulation means and communication terminal using the device |
Oct. 6, 2009 |
| 7598600 |
Stackable power semiconductor package system |
Oct. 6, 2009 |
| 7598598 |
Offset etched corner leads for semiconductor package |
Oct. 6, 2009 |
| 7595549 |
Surface mount semiconductor device |
Sep. 29, 2009 |
| 7595548 |
Physical quantity sensor and manufacturing method therefor |
Sep. 29, 2009 |
| 7595547 |
Semiconductor die package including cup-shaped leadframe |
Sep. 29, 2009 |
| 7595468 |
Passive thermal solution for hand-held devices |
Sep. 29, 2009 |
| 7595226 |
Method of packaging an integrated circuit die |
Sep. 29, 2009 |
| 7592636 |
Radiation-emitting semiconductor component and method for the production thereof |
Sep. 22, 2009 |
| 7589404 |
Semiconductor device |
Sep. 15, 2009 |
| 7589403 |
Lead structure for a semiconductor component and method for producing the same |
Sep. 15, 2009 |
| 7588999 |
Method of forming a leaded molded array package |
Sep. 15, 2009 |
| 7586178 |
Alternative flip chip in leaded molded package design and method for manufacture |
Sep. 8, 2009 |
| 7582958 |
Semiconductor package |
Sep. 1, 2009 |
| 7582957 |
Integrated circuit package system with encapsulation lock |
Sep. 1, 2009 |
| 7582953 |
Package structure with leadframe on offset chip-stacked structure |
Sep. 1, 2009 |
| 7579677 |
Semiconductor device and method for manufacturing thereof |
Aug. 25, 2009 |
| 7579676 |
Leadless leadframe implemented in a leadframe-based BGA package |
Aug. 25, 2009 |
| 7576416 |
Chip package having with asymmetric molding and turbulent plate downset design |
Aug. 18, 2009 |
| 7575957 |
Leadless semiconductor package and method for manufacturing the same |
Aug. 18, 2009 |
| 7569918 |
Semiconductor package-on-package system including integrated passive components |
Aug. 4, 2009 |
| 7566954 |
Bonding configurations for lead-frame-based and substrate-based semiconductor packages |
Jul. 28, 2009 |
| 7566159 |
Side-emitting LED package with improved heat dissipation |
Jul. 28, 2009 |
| 7560311 |
Robust leaded molded packages and methods for forming the same |
Jul. 14, 2009 |
| 7554210 |
Semiconductor device with semiconductor chip mounted in package |
Jun. 30, 2009 |
| 7554183 |
Semiconductor device |
Jun. 30, 2009 |
| 7554182 |
Semiconductor device and package, and method of manufacturer therefor |
Jun. 30, 2009 |
| 7554181 |
Semiconductor device with non-overlapping chip mounting sections |
Jun. 30, 2009 |
| 7554180 |
Package having exposed integrated circuit device |
Jun. 30, 2009 |
| 7554179 |
Multi-leadframe semiconductor package and method of manufacture |
Jun. 30, 2009 |
| 7550829 |
Electronic package and semiconductor device using the same |
Jun. 23, 2009 |
| 7550828 |
Leadframe package for MEMS microphone assembly |
Jun. 23, 2009 |
| 7550827 |
Conductor frame for an electronic component and method for the production thereof |
Jun. 23, 2009 |
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