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Class Information
Number: 257/675
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Lead frame > With heat sink means
Description: Subject matter wherein a heat sink means is provided, either as part of the lead frame or in addition to the lead frame for cooling the active solid-state device.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8710538 Light-emitting device with a spacer at bottom surface Apr. 29, 2014
8704362 Resin-diamagnetic material composite structure Apr. 22, 2014
8686545 Semiconductor device and method for manufacturing the same Apr. 1, 2014
8674497 Stacked half-bridge package with a current carrying layer Mar. 18, 2014
8669646 Apparatus and method for grounding an IC package lid for EMI reduction Mar. 11, 2014
8669648 Power semiconductor module Mar. 11, 2014
8659130 Power module and power module manufacturing method Feb. 25, 2014
8653651 Semiconductor apparatus and method for manufacturing the same Feb. 18, 2014
8637887 Thermally enhanced semiconductor packages and related methods Jan. 28, 2014
8633060 Semiconductor device production method and semiconductor device Jan. 21, 2014
8624366 Semiconductor package structure and method of fabricating the same Jan. 7, 2014
8609506 On-chip heat spreader Dec. 17, 2013
8604610 Flexible power module semiconductor packages Dec. 10, 2013
8598694 Chip-package having a cavity and a manufacturing method thereof Dec. 3, 2013
8592851 Optical semiconductor device and circuit Nov. 26, 2013
8587116 Semiconductor module comprising an insert Nov. 19, 2013
8581375 Leadframe-based mold array package heat spreader and fabrication method therefor Nov. 12, 2013
8581374 Placing heat sink into packaging by strip formation assembly Nov. 12, 2013
8575744 Semiconductor device and lead frame thereof Nov. 5, 2013
8575746 Chip on flexible printed circuit type semiconductor package Nov. 5, 2013
8576567 Semiconductor device and display apparatus Nov. 5, 2013
8569871 Semiconductor device having a molded package Oct. 29, 2013
8564119 Integrated thermal structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system Oct. 22, 2013
8564121 Semiconductor device and manufacturing method of semiconductor device Oct. 22, 2013
8564114 Semiconductor package thermal tape window frame for heat sink attachment Oct. 22, 2013
8564108 Semiconductor device with heat spreader Oct. 22, 2013
8558359 Semiconductor package having lead frames Oct. 15, 2013
8558361 Power semiconductor module Oct. 15, 2013
8552541 Power device packages having thermal electric modules using peltier effect and methods of fabricating the same Oct. 8, 2013
8552554 Heat dissipation structure for electronic device and fabrication method thereof Oct. 8, 2013
8546923 Rigid power module suited for high-voltage applications Oct. 1, 2013
8546935 Semiconductor packages Oct. 1, 2013
8536687 Semiconductor device having separated heatsink and chip mounting portion Sep. 17, 2013
8531016 Thermally enhanced semiconductor package with exposed parallel conductive clip Sep. 10, 2013
8525309 Flip-chip QFN structure using etched lead frame Sep. 3, 2013
8525307 Semiconductor device, lead frame assembly, and method for fabricating the same Sep. 3, 2013
8508025 Folded leadframe multiple die package Aug. 13, 2013
8507940 Heat dissipation by through silicon plugs Aug. 13, 2013
8497560 LED package and method of assembling the same Jul. 30, 2013
8497571 Thin flip chip package structure Jul. 30, 2013
8497572 Semiconductor module and method of manufacturing the same Jul. 30, 2013
8497581 Semiconductor device and manufacturing method thereof Jul. 30, 2013
8492911 Stacked interconnect heat sink Jul. 23, 2013
8492878 Metal-contamination-free through-substrate via structure Jul. 23, 2013
8487339 Light-emitting diode chip package body and method for manufacturing same Jul. 16, 2013
8482023 Leadframe having a heat sink supporting part, fabricating method of a light emitting diode package using the same, and light emitting diode package fabricated by the method Jul. 9, 2013
8476656 Light-emitting diode Jul. 2, 2013
8470644 Exposed die package for direct surface mounting Jun. 25, 2013
8471372 Thin flip chip package structure Jun. 25, 2013
8466486 Thermal management system for multiple heat source devices Jun. 18, 2013

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