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Browse by Category: Main > Physics
Class Information
Number: 257/675
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Lead frame > With heat sink means
Description: Subject matter wherein a heat sink means is provided, either as part of the lead frame or in addition to the lead frame for cooling the active solid-state device.


Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12

Patent Number Title Of Patent Date Issued
7459771 Assembly structure for electronic power integrated circuit formed on a semiconductor die and corresponding manufacturing process Dec. 2, 2008
7456499 Power light emitting die package with reflecting lens and the method of making the same Nov. 25, 2008
7449774 Semiconductor power module having an electrically insulating heat sink and method of manufacturing the same Nov. 11, 2008
7449726 Power semiconductor apparatus Nov. 11, 2008
7420216 Reflection type light-emitting diode device Sep. 2, 2008
7410830 Leadless plastic chip carrier and method of fabricating same Aug. 12, 2008
7408242 Carrier with reinforced leads that are to be connected to a chip Aug. 5, 2008
7400029 LED illumination system Jul. 15, 2008
7382000 Semiconductor device Jun. 3, 2008
7378732 Semiconductor package May. 27, 2008
7372146 Semiconductor module May. 13, 2008
7365923 Heat sink tab for optical sub-assembly Apr. 29, 2008
7361940 Leadframe and packaged light emitting diode Apr. 22, 2008
7361978 Laser diode packaging Apr. 22, 2008
7361986 Heat stud for stacked chip package Apr. 22, 2008
7342304 Semiconductor package with heat dissipating structure Mar. 11, 2008
7335534 Semiconductor component and method of manufacture Feb. 26, 2008
7330353 Modular heat sink fin modules for CPU Feb. 12, 2008
7329949 Packaged microelectronic devices and methods for packaging microelectronic devices Feb. 12, 2008
7327581 Circuit device Feb. 5, 2008
7323769 High performance chip scale leadframe package with thermal dissipating structure and annular element and method of manufacturing package Jan. 29, 2008
7321161 LED package assembly with datum reference feature Jan. 22, 2008
7310238 Thin-film embedded capacitance, method for manufacturing thereof, and a printed wiring board Dec. 18, 2007
7309911 Method and stacked memory structure for implementing enhanced cooling of memory devices Dec. 18, 2007
7304418 Light source apparatus with light-emitting chip which generates light and heat Dec. 4, 2007
7298028 Printed circuit board for thermal dissipation and electronic device using the same Nov. 20, 2007
7298046 Semiconductor package having non-ceramic based window frame Nov. 20, 2007
7294912 Semiconductor device Nov. 13, 2007
7288839 Apparatus and methods for cooling semiconductor integrated circuit package structures Oct. 30, 2007
7273769 Method and apparatus for removing encapsulating material from a packaged microelectronic device Sep. 25, 2007
7259446 Heat sink packaging assembly for electronic components Aug. 21, 2007
7259445 Thermal enhanced package for block mold assembly Aug. 21, 2007
7254033 Method and apparatus for heat dissipation Aug. 7, 2007
7247932 Chip package with capacitor Jul. 24, 2007
7247930 Power management integrated circuit Jul. 24, 2007
7247929 Molded semiconductor device with heat conducting members Jul. 24, 2007
7245004 Semiconductor device Jul. 17, 2007
7245022 Semiconductor module with improved interposer structure and method for forming the same Jul. 17, 2007
7242028 Light emitting diode light source Jul. 10, 2007
7233056 Chip scale package with heat spreader Jun. 19, 2007
7230320 Electronic circuit device with reduced breaking and cracking Jun. 12, 2007
7224057 Thermal enhance package with universal heat spreader May. 29, 2007
7224047 Semiconductor device package with reduced leakage May. 29, 2007
7221042 Leadframe designs for integrated circuit plastic packages May. 22, 2007
7211891 Electronic heat pump device, laser component, optical pickup and electronic equipment May. 1, 2007
7208833 Electronic circuit device having circuit board electrically connected to semiconductor element via metallic plate Apr. 24, 2007
7202561 Semiconductor package with heat dissipating structure and method of manufacturing the same Apr. 10, 2007
7200007 Power stack Apr. 3, 2007
7199454 Optoelectronic semiconductor component Apr. 3, 2007
7196416 Electronic device and method of manufacturing same Mar. 27, 2007

1 2 3 4 5 6 7 8 9 10 11 12


 
 
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