| |
 |
|
Class Information
Number: 257/675
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Lead frame > With heat sink means
Description: Subject matter wherein a heat sink means is provided, either as part of the lead frame or in addition to the lead frame for cooling the active solid-state device.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7459771 |
Assembly structure for electronic power integrated circuit formed on a semiconductor die and corresponding manufacturing process |
Dec. 2, 2008 |
| 7456499 |
Power light emitting die package with reflecting lens and the method of making the same |
Nov. 25, 2008 |
| 7449774 |
Semiconductor power module having an electrically insulating heat sink and method of manufacturing the same |
Nov. 11, 2008 |
| 7449726 |
Power semiconductor apparatus |
Nov. 11, 2008 |
| 7420216 |
Reflection type light-emitting diode device |
Sep. 2, 2008 |
| 7410830 |
Leadless plastic chip carrier and method of fabricating same |
Aug. 12, 2008 |
| 7408242 |
Carrier with reinforced leads that are to be connected to a chip |
Aug. 5, 2008 |
| 7400029 |
LED illumination system |
Jul. 15, 2008 |
| 7382000 |
Semiconductor device |
Jun. 3, 2008 |
| 7378732 |
Semiconductor package |
May. 27, 2008 |
| 7372146 |
Semiconductor module |
May. 13, 2008 |
| 7365923 |
Heat sink tab for optical sub-assembly |
Apr. 29, 2008 |
| 7361940 |
Leadframe and packaged light emitting diode |
Apr. 22, 2008 |
| 7361978 |
Laser diode packaging |
Apr. 22, 2008 |
| 7361986 |
Heat stud for stacked chip package |
Apr. 22, 2008 |
| 7342304 |
Semiconductor package with heat dissipating structure |
Mar. 11, 2008 |
| 7335534 |
Semiconductor component and method of manufacture |
Feb. 26, 2008 |
| 7330353 |
Modular heat sink fin modules for CPU |
Feb. 12, 2008 |
| 7329949 |
Packaged microelectronic devices and methods for packaging microelectronic devices |
Feb. 12, 2008 |
| 7327581 |
Circuit device |
Feb. 5, 2008 |
| 7323769 |
High performance chip scale leadframe package with thermal dissipating structure and annular element and method of manufacturing package |
Jan. 29, 2008 |
| 7321161 |
LED package assembly with datum reference feature |
Jan. 22, 2008 |
| 7310238 |
Thin-film embedded capacitance, method for manufacturing thereof, and a printed wiring board |
Dec. 18, 2007 |
| 7309911 |
Method and stacked memory structure for implementing enhanced cooling of memory devices |
Dec. 18, 2007 |
| 7304418 |
Light source apparatus with light-emitting chip which generates light and heat |
Dec. 4, 2007 |
| 7298028 |
Printed circuit board for thermal dissipation and electronic device using the same |
Nov. 20, 2007 |
| 7298046 |
Semiconductor package having non-ceramic based window frame |
Nov. 20, 2007 |
| 7294912 |
Semiconductor device |
Nov. 13, 2007 |
| 7288839 |
Apparatus and methods for cooling semiconductor integrated circuit package structures |
Oct. 30, 2007 |
| 7273769 |
Method and apparatus for removing encapsulating material from a packaged microelectronic device |
Sep. 25, 2007 |
| 7259446 |
Heat sink packaging assembly for electronic components |
Aug. 21, 2007 |
| 7259445 |
Thermal enhanced package for block mold assembly |
Aug. 21, 2007 |
| 7254033 |
Method and apparatus for heat dissipation |
Aug. 7, 2007 |
| 7247932 |
Chip package with capacitor |
Jul. 24, 2007 |
| 7247930 |
Power management integrated circuit |
Jul. 24, 2007 |
| 7247929 |
Molded semiconductor device with heat conducting members |
Jul. 24, 2007 |
| 7245004 |
Semiconductor device |
Jul. 17, 2007 |
| 7245022 |
Semiconductor module with improved interposer structure and method for forming the same |
Jul. 17, 2007 |
| 7242028 |
Light emitting diode light source |
Jul. 10, 2007 |
| 7233056 |
Chip scale package with heat spreader |
Jun. 19, 2007 |
| 7230320 |
Electronic circuit device with reduced breaking and cracking |
Jun. 12, 2007 |
| 7224057 |
Thermal enhance package with universal heat spreader |
May. 29, 2007 |
| 7224047 |
Semiconductor device package with reduced leakage |
May. 29, 2007 |
| 7221042 |
Leadframe designs for integrated circuit plastic packages |
May. 22, 2007 |
| 7211891 |
Electronic heat pump device, laser component, optical pickup and electronic equipment |
May. 1, 2007 |
| 7208833 |
Electronic circuit device having circuit board electrically connected to semiconductor element via metallic plate |
Apr. 24, 2007 |
| 7202561 |
Semiconductor package with heat dissipating structure and method of manufacturing the same |
Apr. 10, 2007 |
| 7200007 |
Power stack |
Apr. 3, 2007 |
| 7199454 |
Optoelectronic semiconductor component |
Apr. 3, 2007 |
| 7196416 |
Electronic device and method of manufacturing same |
Mar. 27, 2007 |
|
|
|
