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Class Information
Number: 257/675
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Lead frame > With heat sink means
Description: Subject matter wherein a heat sink means is provided, either as part of the lead frame or in addition to the lead frame for cooling the active solid-state device.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7622803 |
Heat sink assembly and related methods for semiconductor vacuum processing systems |
Nov. 24, 2009 |
| 7622795 |
Light emitting diode package |
Nov. 24, 2009 |
| 7618849 |
Integrated circuit package with etched leadframe for package-on-package interconnects |
Nov. 17, 2009 |
| 7612437 |
Thermally enhanced single inline package (SIP) |
Nov. 3, 2009 |
| 7612448 |
Power module having a cooling device and semiconductor devices mounted on a resin substrate, method of producing same, and air conditioner |
Nov. 3, 2009 |
| 7608315 |
Insulator with high thermal conductivity and method for producing the same |
Oct. 27, 2009 |
| 7608915 |
Heat dissipation semiconductor package |
Oct. 27, 2009 |
| 7608923 |
Electronic device with flexible heat spreader |
Oct. 27, 2009 |
| 7608924 |
Liquid cooled power electronic circuit comprising stacked direct die cooled packages |
Oct. 27, 2009 |
| 7609732 |
Method for controlling a temperature of a thermo-electric cooler and a temperature controller using the same |
Oct. 27, 2009 |
| 7598603 |
Electronic component having a power switch with an anode thereof mounted on a die attach region of a heat sink |
Oct. 6, 2009 |
| 7598535 |
Light-emitting diode assembly and method of fabrication |
Oct. 6, 2009 |
| 7589401 |
Lightweight, hermetically sealed package having auxiliary, selectively contoured, low mass, pseudo wall insert for surface-mounting and dissipating heat from electronic circuit components |
Sep. 15, 2009 |
| 7589402 |
Semiconductor module and manufacturing method thereof |
Sep. 15, 2009 |
| 7586178 |
Alternative flip chip in leaded molded package design and method for manufacture |
Sep. 8, 2009 |
| 7586179 |
Wireless semiconductor package for efficient heat dissipation |
Sep. 8, 2009 |
| 7582964 |
Semiconductor package having non-ceramic based window frame |
Sep. 1, 2009 |
| 7582958 |
Semiconductor package |
Sep. 1, 2009 |
| 7579675 |
Semiconductor device having surface mountable external contact areas and method for producing the same |
Aug. 25, 2009 |
| 7580264 |
Power supply and fixing structure of heatsink and circuit board applicable to the same |
Aug. 25, 2009 |
| 7564123 |
Semiconductor package with fastened leads |
Jul. 21, 2009 |
| 7564124 |
Semiconductor die package including stacked dice and heat sink structures |
Jul. 21, 2009 |
| 7557432 |
Thermally enhanced power semiconductor package system |
Jul. 7, 2009 |
| 7557442 |
Power semiconductor arrangement |
Jul. 7, 2009 |
| 7554179 |
Multi-leadframe semiconductor package and method of manufacture |
Jun. 30, 2009 |
| 7541669 |
Semiconductor device package with base features to reduce leakage |
Jun. 2, 2009 |
| 7535085 |
Semiconductor package having improved adhesiveness and ground bonding |
May. 19, 2009 |
| 7531848 |
Light emission diode and method of fabricating thereof |
May. 12, 2009 |
| 7531895 |
Integrated circuit package and method of manufacture thereof |
May. 12, 2009 |
| 7528469 |
Semiconductor equipment having multiple semiconductor devices and multiple lead frames |
May. 5, 2009 |
| 7525182 |
Multi-package module and electronic device using the same |
Apr. 28, 2009 |
| 7525183 |
Surface mount multichip devices |
Apr. 28, 2009 |
| 7521789 |
Electrical assembly having heat sink protrusions |
Apr. 21, 2009 |
| 7521780 |
Integrated circuit package system with heat dissipation enclosure |
Apr. 21, 2009 |
| 7518219 |
Integrated heat spreader lid |
Apr. 14, 2009 |
| 7518233 |
Sealing structure for multi-chip module |
Apr. 14, 2009 |
| 7511365 |
Thermal enhanced low profile package structure |
Mar. 31, 2009 |
| 7508054 |
Semiconductor device and a method of manufacturing the same |
Mar. 24, 2009 |
| 7501700 |
Semiconductor power module having an electrically insulating heat sink and method of manufacturing the same |
Mar. 10, 2009 |
| 7498610 |
High power LED housing and fabrication method thereof |
Mar. 3, 2009 |
| 7498673 |
Heatplates for heatsink attachment for semiconductor chips |
Mar. 3, 2009 |
| 7489024 |
TMOS-infrared uncooled sensor and focal plane array |
Feb. 10, 2009 |
| 7482679 |
Leadframe for a semiconductor device |
Jan. 27, 2009 |
| 7479692 |
Integrated circuit package system with heat sink |
Jan. 20, 2009 |
| 7476967 |
Composite carbon nanotube thermal interface device |
Jan. 13, 2009 |
| 7470983 |
Semiconductor device reducing warping due to heat production |
Dec. 30, 2008 |
| 7468548 |
Thermal enhanced upper and dual heat sink exposed molded leadless package |
Dec. 23, 2008 |
| 7466016 |
Bent lead transistor |
Dec. 16, 2008 |
| 7459771 |
Assembly structure for electronic power integrated circuit formed on a semiconductor die and corresponding manufacturing process |
Dec. 2, 2008 |
| 7456499 |
Power light emitting die package with reflecting lens and the method of making the same |
Nov. 25, 2008 |
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