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Class Information
Number: 257/675
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Lead frame > With heat sink means
Description: Subject matter wherein a heat sink means is provided, either as part of the lead frame or in addition to the lead frame for cooling the active solid-state device.


Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13

Patent Number Title Of Patent Date Issued
7622803 Heat sink assembly and related methods for semiconductor vacuum processing systems Nov. 24, 2009
7622795 Light emitting diode package Nov. 24, 2009
7618849 Integrated circuit package with etched leadframe for package-on-package interconnects Nov. 17, 2009
7612437 Thermally enhanced single inline package (SIP) Nov. 3, 2009
7612448 Power module having a cooling device and semiconductor devices mounted on a resin substrate, method of producing same, and air conditioner Nov. 3, 2009
7608315 Insulator with high thermal conductivity and method for producing the same Oct. 27, 2009
7608915 Heat dissipation semiconductor package Oct. 27, 2009
7608923 Electronic device with flexible heat spreader Oct. 27, 2009
7608924 Liquid cooled power electronic circuit comprising stacked direct die cooled packages Oct. 27, 2009
7609732 Method for controlling a temperature of a thermo-electric cooler and a temperature controller using the same Oct. 27, 2009
7598603 Electronic component having a power switch with an anode thereof mounted on a die attach region of a heat sink Oct. 6, 2009
7598535 Light-emitting diode assembly and method of fabrication Oct. 6, 2009
7589401 Lightweight, hermetically sealed package having auxiliary, selectively contoured, low mass, pseudo wall insert for surface-mounting and dissipating heat from electronic circuit components Sep. 15, 2009
7589402 Semiconductor module and manufacturing method thereof Sep. 15, 2009
7586178 Alternative flip chip in leaded molded package design and method for manufacture Sep. 8, 2009
7586179 Wireless semiconductor package for efficient heat dissipation Sep. 8, 2009
7582964 Semiconductor package having non-ceramic based window frame Sep. 1, 2009
7582958 Semiconductor package Sep. 1, 2009
7579675 Semiconductor device having surface mountable external contact areas and method for producing the same Aug. 25, 2009
7580264 Power supply and fixing structure of heatsink and circuit board applicable to the same Aug. 25, 2009
7564123 Semiconductor package with fastened leads Jul. 21, 2009
7564124 Semiconductor die package including stacked dice and heat sink structures Jul. 21, 2009
7557432 Thermally enhanced power semiconductor package system Jul. 7, 2009
7557442 Power semiconductor arrangement Jul. 7, 2009
7554179 Multi-leadframe semiconductor package and method of manufacture Jun. 30, 2009
7541669 Semiconductor device package with base features to reduce leakage Jun. 2, 2009
7535085 Semiconductor package having improved adhesiveness and ground bonding May. 19, 2009
7531848 Light emission diode and method of fabricating thereof May. 12, 2009
7531895 Integrated circuit package and method of manufacture thereof May. 12, 2009
7528469 Semiconductor equipment having multiple semiconductor devices and multiple lead frames May. 5, 2009
7525182 Multi-package module and electronic device using the same Apr. 28, 2009
7525183 Surface mount multichip devices Apr. 28, 2009
7521789 Electrical assembly having heat sink protrusions Apr. 21, 2009
7521780 Integrated circuit package system with heat dissipation enclosure Apr. 21, 2009
7518219 Integrated heat spreader lid Apr. 14, 2009
7518233 Sealing structure for multi-chip module Apr. 14, 2009
7511365 Thermal enhanced low profile package structure Mar. 31, 2009
7508054 Semiconductor device and a method of manufacturing the same Mar. 24, 2009
7501700 Semiconductor power module having an electrically insulating heat sink and method of manufacturing the same Mar. 10, 2009
7498610 High power LED housing and fabrication method thereof Mar. 3, 2009
7498673 Heatplates for heatsink attachment for semiconductor chips Mar. 3, 2009
7489024 TMOS-infrared uncooled sensor and focal plane array Feb. 10, 2009
7482679 Leadframe for a semiconductor device Jan. 27, 2009
7479692 Integrated circuit package system with heat sink Jan. 20, 2009
7476967 Composite carbon nanotube thermal interface device Jan. 13, 2009
7470983 Semiconductor device reducing warping due to heat production Dec. 30, 2008
7468548 Thermal enhanced upper and dual heat sink exposed molded leadless package Dec. 23, 2008
7466016 Bent lead transistor Dec. 16, 2008
7459771 Assembly structure for electronic power integrated circuit formed on a semiconductor die and corresponding manufacturing process Dec. 2, 2008
7456499 Power light emitting die package with reflecting lens and the method of making the same Nov. 25, 2008

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