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Class Information
Number: 257/674
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Lead frame > With means for controlling lead tension
Description: Subject matter wherein means are provided for controlling the tension under which an electrical lead is placed including, for example, a bend in the lead, an area of reduced lead thickness, etc.










Patents under this class:
1 2 3 4 5 6 7

Patent Number Title Of Patent Date Issued
8704346 Semiconductor package and radiation lead frame Apr. 22, 2014
8692367 Wafer-level packaged device having self-assembled resilient leads Apr. 8, 2014
8650748 Universal chip carrier and method Feb. 18, 2014
8643156 Lead frame for assembling semiconductor device Feb. 4, 2014
8618643 Semiconductor device and lead frame used for the same Dec. 31, 2013
8614502 Three dimensional semiconductor assembly board with bump/flange supporting board, coreless build-up circuitry and built-in electronic device Dec. 24, 2013
8610253 Lead frame, semiconductor device, and method of manufacturing semiconductor device Dec. 17, 2013
8525311 Lead frame for semiconductor device Sep. 3, 2013
8525307 Semiconductor device, lead frame assembly, and method for fabricating the same Sep. 3, 2013
8492882 Semiconductor device and method of manufacturing same Jul. 23, 2013
8445998 Leadframe structures for semiconductor packages May. 21, 2013
8410587 Integrated circuit package system Apr. 2, 2013
8390105 Lead frame substrate, manufacturing method thereof, and semiconductor apparatus Mar. 5, 2013
8384228 Package including wires contacting lead frame edge Feb. 26, 2013
8378469 Apparatus and methods for packaging antennas with integrated circuit chips for millimeter wave applications Feb. 19, 2013
8355258 Support method and apparatus for printed circuit board Jan. 15, 2013
8334467 Lead frame design to improve reliability Dec. 18, 2012
8304868 Multi-component electronic system having leadframe with support-free with cantilever leads Nov. 6, 2012
8278748 Wafer-level packaged device having self-assembled resilient leads Oct. 2, 2012
8258609 Integrated circuit package system with lead support Sep. 4, 2012
8241958 Semiconductor device, semiconductor module, method for manufacturing semiconductor device, and lead frame Aug. 14, 2012
8237250 Advanced quad flat non-leaded package structure and manufacturing method thereof Aug. 7, 2012
RE43443 Leadframe semiconductor integrated circuit device using the same, and method of and process for fabricating the two Jun. 5, 2012
8193041 Semiconductor device and manufacturing method of the same Jun. 5, 2012
8188583 Semiconductor device and method of manufacturing same May. 29, 2012
8158460 Method of forming metallic leadframes having laser-treated surfaces for improved adhesion to polymeric compounds Apr. 17, 2012
8143707 Semiconductor device Mar. 27, 2012
8106493 Semiconductor device package having features formed by stamping Jan. 31, 2012
8097935 Quad flat package Jan. 17, 2012
8097496 Method of forming quad flat package Jan. 17, 2012
8067779 Light emitting device with a recess lead portion Nov. 29, 2011
8044495 Metallic leadframes having laser-treated surfaces for improved adhesion to polymeric compounds Oct. 25, 2011
8043898 Method of manufacturing semiconductor package with etch removal of carrier frame and base plating layer Oct. 25, 2011
8022517 Semiconductor chip package Sep. 20, 2011
7986032 Semiconductor package system with substrate having different bondable heights at lead finger tips Jul. 26, 2011
7955901 Method for producing a power semiconductor module comprising surface-mountable flat external contacts Jun. 7, 2011
7947534 Integrated circuit packaging system including a non-leaded package May. 24, 2011
7939921 Leadframe May. 10, 2011
7928540 Integrated circuit package system Apr. 19, 2011
7911062 Electronic component with varying rigidity leads using Pb-free solder Mar. 22, 2011
7875963 Semiconductor device including leadframe having power bars and increased I/O Jan. 25, 2011
7863737 Integrated circuit package system with wire bond pattern Jan. 4, 2011
7847390 Semiconductor device Dec. 7, 2010
7839003 Semiconductor device including a coupling conductor having a concave and convex Nov. 23, 2010
7838339 Semiconductor device package having features formed by stamping Nov. 23, 2010
7821111 Semiconductor device having grooved leads to confine solder wicking Oct. 26, 2010
7820480 Lead frame routed chip pads for semiconductor packages Oct. 26, 2010
7812463 Packaging integrated circuits for high stress environments Oct. 12, 2010
7804159 Semiconductor device and a method of manufacturing the same and a mounting structure of a semiconductor device Sep. 28, 2010
7791178 Lead frame unit, semiconductor package having a lead frame unit, stacked semiconductor package having a semiconductor package and methods of manufacturing the same Sep. 7, 2010

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