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Class Information
Number: 257/674
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Lead frame > With means for controlling lead tension
Description: Subject matter wherein means are provided for controlling the tension under which an electrical lead is placed including, for example, a bend in the lead, an area of reduced lead thickness, etc.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7459770 |
Lead frame structure having blocking surfaces and semiconductor package integrated with the lead frame structure |
Dec. 2, 2008 |
| 7453140 |
Semiconductor chip assembly with laterally aligned filler and insulative base |
Nov. 18, 2008 |
| 7446399 |
Pad structures to improve board-level reliability of solder-on-pad BGA structures |
Nov. 4, 2008 |
| 7446400 |
Chip package structure and fabricating method thereof |
Nov. 4, 2008 |
| 7446403 |
Carrier structure stacking system and method |
Nov. 4, 2008 |
| 7439611 |
Circuit board with auxiliary wiring configuration to suppress breakage during bonding process |
Oct. 21, 2008 |
| 7425759 |
Semiconductor chip assembly with bumped terminal and filler |
Sep. 16, 2008 |
| 7425756 |
Semiconductor device and electronic device |
Sep. 16, 2008 |
| 7425470 |
Microelectronic component assemblies employing lead frames having reduced-thickness inner lengths |
Sep. 16, 2008 |
| 7420265 |
Integrated circuit package system with integrated circuit support |
Sep. 2, 2008 |
| 7408242 |
Carrier with reinforced leads that are to be connected to a chip |
Aug. 5, 2008 |
| 7361977 |
Semiconductor assembly and packaging for high current and low inductance |
Apr. 22, 2008 |
| 7345356 |
Optical package with double formed leadframe |
Mar. 18, 2008 |
| 7342299 |
Apparatus and methods for packaging antennas with integrated circuit chips for millimeter wave applications |
Mar. 11, 2008 |
| 7319265 |
Semiconductor chip assembly with precision-formed metal pillar |
Jan. 15, 2008 |
| 7307339 |
Semiconductor device having curved leads offset from the center of bonding pads |
Dec. 11, 2007 |
| 7304371 |
Lead frame having a lead with a non-uniform width |
Dec. 4, 2007 |
| 7288833 |
Stress-free lead frame |
Oct. 30, 2007 |
| RE39854 |
Lead frame chip scale package |
Sep. 25, 2007 |
| 7274092 |
Semiconductor component and method of assembling the same |
Sep. 25, 2007 |
| 7274089 |
Integrated circuit package system with adhesive restraint |
Sep. 25, 2007 |
| 7271036 |
Leadframe alteration to direct compound flow into package |
Sep. 18, 2007 |
| 7253508 |
Semiconductor package with a flip chip on a solder-resist leadframe |
Aug. 7, 2007 |
| 7247520 |
Microelectronic component assemblies and microelectronic component lead frame structures |
Jul. 24, 2007 |
| 7242077 |
Leadframe with die pad |
Jul. 10, 2007 |
| 7239008 |
Semiconductor apparatus and method for fabricating the same |
Jul. 3, 2007 |
| 7227198 |
Half-bridge package |
Jun. 5, 2007 |
| 7208840 |
Semiconductor module, electronic device and electronic equipment, and method for manufacturing semiconductor module |
Apr. 24, 2007 |
| 7196402 |
Interconnections |
Mar. 27, 2007 |
| 7193299 |
Conductor frame and housing for a radiation-emitting component, radiation-emitting component and display and/or illumination system using radiation-emitting components |
Mar. 20, 2007 |
| 7135760 |
Moisture resistant integrated circuit leadframe package |
Nov. 14, 2006 |
| 7132741 |
Semiconductor chip assembly with carved bumped terminal |
Nov. 7, 2006 |
| 7132315 |
Leadframe, plastic-encapsulated semiconductor device, and method for fabricating the same |
Nov. 7, 2006 |
| 7129575 |
Semiconductor chip assembly with bumped metal pillar |
Oct. 31, 2006 |
| 7122401 |
Area array type semiconductor package fabrication method |
Oct. 17, 2006 |
| 7119423 |
Semiconductor device and method of manufacturing the same, electronic module, and electronic instrument |
Oct. 10, 2006 |
| 7119424 |
Semiconductor device and method for manufacturing the same |
Oct. 10, 2006 |
| 7112872 |
Flexible semiconductor device with groove(s) on rear side of semiconductor substrate |
Sep. 26, 2006 |
| 7095099 |
Low profile package having multiple die |
Aug. 22, 2006 |
| 7081666 |
Lead frame structure with aperture or groove for flip chip in a leaded molded package |
Jul. 25, 2006 |
| 7049706 |
Semiconductor device with staggered electrodes and increased wiring width |
May. 23, 2006 |
| 7042103 |
Low stress semiconductor die attach |
May. 9, 2006 |
| 7023075 |
Teardrop shaped lead frames |
Apr. 4, 2006 |
| 7012324 |
Lead frame with flag support structure |
Mar. 14, 2006 |
| 7008826 |
Lead-frame-based semiconductor package and fabrication method thereof |
Mar. 7, 2006 |
| 7002239 |
Leadless leadframe packaging panel featuring peripheral dummy leads |
Feb. 21, 2006 |
| 6984884 |
Electric power semiconductor device |
Jan. 10, 2006 |
| 6984878 |
Leadless leadframe with an improved die pad for mold locking |
Jan. 10, 2006 |
| 6979888 |
LOC semiconductor assembled with room temperature adhesive |
Dec. 27, 2005 |
| 6979886 |
Short-prevented lead frame and method for fabricating semiconductor package with the same |
Dec. 27, 2005 |
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