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Class Information
Number: 257/673
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Lead frame > With bumps on ends of lead fingers to connect to semiconductor
Description: Subject matter wherein bump contacts are located at or near the ends of lead fingers to provide contact with a semiconductor chip.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7626255 |
Device, system and electric element |
Dec. 1, 2009 |
| 7619303 |
Integrated circuit package |
Nov. 17, 2009 |
| 7612435 |
Method of packaging integrated circuits |
Nov. 3, 2009 |
| 7602053 |
Leadframe of a leadless flip-chip package and method for manufacturing the same |
Oct. 13, 2009 |
| 7592699 |
Hidden plating traces |
Sep. 22, 2009 |
| 7589400 |
Inverter and vehicle drive unit using the same |
Sep. 15, 2009 |
| 7582956 |
Flip chip in leaded molded package and method of manufacture thereof |
Sep. 1, 2009 |
| 7576656 |
Apparatuses and methods for high speed bonding |
Aug. 18, 2009 |
| 7572674 |
Method for manufacturing semiconductor device |
Aug. 11, 2009 |
| 7563647 |
Integrated circuit package system with interconnect support |
Jul. 21, 2009 |
| 7557432 |
Thermally enhanced power semiconductor package system |
Jul. 7, 2009 |
| 7554197 |
High frequency IC package and method for fabricating the same |
Jun. 30, 2009 |
| 7550827 |
Conductor frame for an electronic component and method for the production thereof |
Jun. 23, 2009 |
| 7550830 |
Stacked semiconductor package having fan-out structure through wire bonding |
Jun. 23, 2009 |
| 7541221 |
Integrated circuit package system with leadfinger support |
Jun. 2, 2009 |
| 7538415 |
Semiconductor chip assembly with bumped terminal, filler and insulative base |
May. 26, 2009 |
| 7525181 |
Tape wiring substrate and tape package using the same |
Apr. 28, 2009 |
| 7518239 |
Semiconductor device with substrate having penetrating hole having a protrusion |
Apr. 14, 2009 |
| 7511363 |
Copper interconnect |
Mar. 31, 2009 |
| 7508059 |
Stacked chip package with redistribution lines |
Mar. 24, 2009 |
| 7485952 |
Drop resistant bumpers for fully molded memory cards |
Feb. 3, 2009 |
| 7466014 |
Flip chip mounted semiconductor device package having a dimpled leadframe |
Dec. 16, 2008 |
| 7466013 |
Semiconductor die structure featuring a triple pad organization |
Dec. 16, 2008 |
| 7453140 |
Semiconductor chip assembly with laterally aligned filler and insulative base |
Nov. 18, 2008 |
| 7446400 |
Chip package structure and fabricating method thereof |
Nov. 4, 2008 |
| 7443015 |
Integrated circuit package system with downset lead |
Oct. 28, 2008 |
| 7443038 |
Flip-chip image sensor packages |
Oct. 28, 2008 |
| 7443013 |
Flexible substrate for package of die |
Oct. 28, 2008 |
| 7432585 |
Semiconductor device electronic component, circuit board, and electronic device |
Oct. 7, 2008 |
| 7432555 |
Testable electrostatic discharge protection circuits |
Oct. 7, 2008 |
| 7425758 |
Metal core foldover package structures |
Sep. 16, 2008 |
| 7425759 |
Semiconductor chip assembly with bumped terminal and filler |
Sep. 16, 2008 |
| 7411280 |
Chip support of a leadframe for an integrated circuit package |
Aug. 12, 2008 |
| 7408242 |
Carrier with reinforced leads that are to be connected to a chip |
Aug. 5, 2008 |
| 7408204 |
Flip-chip packaging structure for light emitting diode and method thereof |
Aug. 5, 2008 |
| 7405664 |
Radio frequency IC tag and method for manufacturing the same |
Jul. 29, 2008 |
| 7400032 |
Module assembly for stacked BGA packages |
Jul. 15, 2008 |
| 7396476 |
Method for reducing harmonic distortion in comb drive devices |
Jul. 8, 2008 |
| 7385279 |
Semiconductor device and a method of manufacturing the same |
Jun. 10, 2008 |
| 7371616 |
Clipless and wireless semiconductor die package and method for making the same |
May. 13, 2008 |
| 7372142 |
Vertical conduction power electronic device package and corresponding assembling method |
May. 13, 2008 |
| 7368810 |
Invertible microfeature device packages |
May. 6, 2008 |
| 7364947 |
Method for cutting lead terminal of package type electronic component |
Apr. 29, 2008 |
| 7361531 |
Methods and apparatus for Flip-Chip-On-Lead semiconductor package |
Apr. 22, 2008 |
| 7352054 |
Semiconductor device having conducting portion of upper and lower conductive layers |
Apr. 1, 2008 |
| 7352055 |
Semiconductor package with controlled solder bump wetting |
Apr. 1, 2008 |
| 7345358 |
Copper interconnect for semiconductor device |
Mar. 18, 2008 |
| 7339261 |
Semiconductor device |
Mar. 4, 2008 |
| 7332817 |
Die and die-package interface metallization and bump design and arrangement |
Feb. 19, 2008 |
| 7332806 |
Thin, thermally enhanced molded package with leadframe having protruding region |
Feb. 19, 2008 |
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