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Class Information
Number: 257/673
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Lead frame > With bumps on ends of lead fingers to connect to semiconductor
Description: Subject matter wherein bump contacts are located at or near the ends of lead fingers to provide contact with a semiconductor chip.










Patents under this class:
1 2 3 4 5 6 7 8 9 10 11

Patent Number Title Of Patent Date Issued
8704345 Semiconductor package and lead frame thereof Apr. 22, 2014
8680658 Conductive clip for semiconductor device package Mar. 25, 2014
8623754 Repairing anomalous stiff pillar bumps Jan. 7, 2014
8614502 Three dimensional semiconductor assembly board with bump/flange supporting board, coreless build-up circuitry and built-in electronic device Dec. 24, 2013
8581381 Integrated circuit (IC) package stacking and IC packages formed by same Nov. 12, 2013
8552540 Wafer level package with thermal pad for higher power dissipation Oct. 8, 2013
8541890 Substrate based unmolded package Sep. 24, 2013
8531015 Semiconductor device and method of forming a thin wafer without a carrier Sep. 10, 2013
8525307 Semiconductor device, lead frame assembly, and method for fabricating the same Sep. 3, 2013
8519517 Semiconductor system with fine pitch lead fingers and method of manufacturing thereof Aug. 27, 2013
8497160 Method for making solder-top enhanced semiconductor device of low parasitic packaging impedance Jul. 30, 2013
8461588 In-situ monitoring and method to determine accumulated printed wiring board thermal and/or vibration stress fatigue using a mirrored monitor chip and continuity circuit Jun. 11, 2013
8461669 Integrated power converter package with die stacking Jun. 11, 2013
8455986 Mosfet package Jun. 4, 2013
8445998 Leadframe structures for semiconductor packages May. 21, 2013
8426953 Semiconductor package with an embedded printed circuit board and stacked die Apr. 23, 2013
8421244 Semiconductor package and method of forming the same Apr. 16, 2013
8415779 Lead frame for semiconductor package Apr. 9, 2013
8409922 Semiconductor device and method of forming leadframe interposer over semiconductor die and TSV substrate for vertical electrical interconnect Apr. 2, 2013
8410587 Integrated circuit package system Apr. 2, 2013
8406004 Integrated circuit packaging system and method of manufacture thereof Mar. 26, 2013
8370777 Method of generating a leadframe IC package model, a leadframe modeler and an IC design system Feb. 5, 2013
8362614 Fine pitch grid array type semiconductor device Jan. 29, 2013
8350393 Apparatus and method for predetermined component placement to a target platform Jan. 8, 2013
8350380 Method for manufacturing leadframe, packaging method for using the leadframe and semiconductor package product Jan. 8, 2013
8338234 Hybrid integrated circuit device and manufacturing method thereof Dec. 25, 2012
8330258 System and method for improving solder joint reliability in an integrated circuit package Dec. 11, 2012
8304867 Crack arrest vias for IC devices Nov. 6, 2012
8298871 Method and leadframe for packaging integrated circuits Oct. 30, 2012
8283758 Microelectronic packages with enhanced heat dissipation and methods of manufacturing Oct. 9, 2012
8269322 Tape wiring substrate and tape package using the same Sep. 18, 2012
8269321 Low cost lead frame package and method for forming same Sep. 18, 2012
8264084 Solder-top enhanced semiconductor device for low parasitic impedance packaging Sep. 11, 2012
8253224 Semiconductor package with metal straps Aug. 28, 2012
8253239 Multi-chip semiconductor connector Aug. 28, 2012
8203201 Integrated circuit packaging system with leads and method of manufacture thereof Jun. 19, 2012
8193622 Thermally enhanced thin semiconductor package Jun. 5, 2012
RE43444 Semiconductor device having an improved connection arrangement between a semiconductor pellet and base substrate electrodes Jun. 5, 2012
8188581 Mechanical coupling in a multi-chip module using magnetic components May. 29, 2012
8159055 Semiconductor device, lead-frame product used for the same and method for manufacturing the same Apr. 17, 2012
8154110 Double-faced electrode package and its manufacturing method Apr. 10, 2012
8143707 Semiconductor device Mar. 27, 2012
8132709 Semiconductor device and method for manufacturing same Mar. 13, 2012
8129229 Method of manufacturing semiconductor package containing flip-chip arrangement Mar. 6, 2012
8129221 Semiconductor package and method of forming the same Mar. 6, 2012
8124461 Method for manufacturing leadframe, packaging method for using the leadframe and semiconductor package product Feb. 28, 2012
8114706 Selective removal of gold from a lead frame Feb. 14, 2012
8110905 Integrated circuit packaging system with leadframe interposer and method of manufacture thereof Feb. 7, 2012
8105932 Mixed wire semiconductor lead frame package Jan. 31, 2012
8102666 Integrated circuit package system Jan. 24, 2012

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