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Class Information
Number: 257/673
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Lead frame > With bumps on ends of lead fingers to connect to semiconductor
Description: Subject matter wherein bump contacts are located at or near the ends of lead fingers to provide contact with a semiconductor chip.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7453140 |
Semiconductor chip assembly with laterally aligned filler and insulative base |
Nov. 18, 2008 |
| 7446400 |
Chip package structure and fabricating method thereof |
Nov. 4, 2008 |
| 7443038 |
Flip-chip image sensor packages |
Oct. 28, 2008 |
| 7443015 |
Integrated circuit package system with downset lead |
Oct. 28, 2008 |
| 7443013 |
Flexible substrate for package of die |
Oct. 28, 2008 |
| 7432555 |
Testable electrostatic discharge protection circuits |
Oct. 7, 2008 |
| 7432585 |
Semiconductor device electronic component, circuit board, and electronic device |
Oct. 7, 2008 |
| 7425758 |
Metal core foldover package structures |
Sep. 16, 2008 |
| 7425759 |
Semiconductor chip assembly with bumped terminal and filler |
Sep. 16, 2008 |
| 7411280 |
Chip support of a leadframe for an integrated circuit package |
Aug. 12, 2008 |
| 7408204 |
Flip-chip packaging structure for light emitting diode and method thereof |
Aug. 5, 2008 |
| 7408242 |
Carrier with reinforced leads that are to be connected to a chip |
Aug. 5, 2008 |
| 7405664 |
Radio frequency IC tag and method for manufacturing the same |
Jul. 29, 2008 |
| 7400032 |
Module assembly for stacked BGA packages |
Jul. 15, 2008 |
| 7396476 |
Method for reducing harmonic distortion in comb drive devices |
Jul. 8, 2008 |
| 7385279 |
Semiconductor device and a method of manufacturing the same |
Jun. 10, 2008 |
| 7371616 |
Clipless and wireless semiconductor die package and method for making the same |
May. 13, 2008 |
| 7372142 |
Vertical conduction power electronic device package and corresponding assembling method |
May. 13, 2008 |
| 7368810 |
Invertible microfeature device packages |
May. 6, 2008 |
| 7364947 |
Method for cutting lead terminal of package type electronic component |
Apr. 29, 2008 |
| 7361531 |
Methods and apparatus for Flip-Chip-On-Lead semiconductor package |
Apr. 22, 2008 |
| 7352055 |
Semiconductor package with controlled solder bump wetting |
Apr. 1, 2008 |
| 7352054 |
Semiconductor device having conducting portion of upper and lower conductive layers |
Apr. 1, 2008 |
| 7345358 |
Copper interconnect for semiconductor device |
Mar. 18, 2008 |
| 7339261 |
Semiconductor device |
Mar. 4, 2008 |
| 7332806 |
Thin, thermally enhanced molded package with leadframe having protruding region |
Feb. 19, 2008 |
| 7332817 |
Die and die-package interface metallization and bump design and arrangement |
Feb. 19, 2008 |
| 7327032 |
Semiconductor package accomplishing fan-out structure through wire bonding |
Feb. 5, 2008 |
| 7326594 |
Connecting a plurality of bond pads and/or inner leads with a single bond wire |
Feb. 5, 2008 |
| 7323361 |
Packaging system for semiconductor devices |
Jan. 29, 2008 |
| 7319265 |
Semiconductor chip assembly with precision-formed metal pillar |
Jan. 15, 2008 |
| 7274088 |
Flip-chip semiconductor package with lead frame as chip carrier and fabrication method thereof |
Sep. 25, 2007 |
| 7265445 |
Integrated circuit package |
Sep. 4, 2007 |
| 7259044 |
Lead frame, method of manufacturing the same, and method of manufacturing a semiconductor device using the same |
Aug. 21, 2007 |
| 7253508 |
Semiconductor package with a flip chip on a solder-resist leadframe |
Aug. 7, 2007 |
| 7244635 |
Semiconductor device and method of manufacturing the same |
Jul. 17, 2007 |
| 7245007 |
Exposed lead interposer leadframe package |
Jul. 17, 2007 |
| 7235871 |
Stacked microelectronic dies |
Jun. 26, 2007 |
| 7233056 |
Chip scale package with heat spreader |
Jun. 19, 2007 |
| 7229855 |
Process for assembling a double-sided circuit component |
Jun. 12, 2007 |
| 7227251 |
Semiconductor device and a memory system including a plurality of IC chips in a common package |
Jun. 5, 2007 |
| 7224054 |
Semiconductor device and system having semiconductor device mounted thereon |
May. 29, 2007 |
| 7217995 |
Apparatus for stacking electrical components using insulated and interconnecting via |
May. 15, 2007 |
| 7215011 |
Flip chip in leaded molded package and method of manufacture thereof |
May. 8, 2007 |
| 7208825 |
Stacked semiconductor packages |
Apr. 24, 2007 |
| 7199459 |
Semiconductor package without bonding wires and fabrication method thereof |
Apr. 3, 2007 |
| 7193303 |
Supporting frame for surface-mount diode package |
Mar. 20, 2007 |
| 7190060 |
Three-dimensional stacked semiconductor package device with bent and flat leads and method of making same |
Mar. 13, 2007 |
| 7176557 |
Semiconductor device |
Feb. 13, 2007 |
| 7176056 |
Semiconductor integrated circuit device and method of manufacturing the same |
Feb. 13, 2007 |
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