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Browse by Category: Main > Physics
Class Information
Number: 257/672
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Lead frame > Small lead frame (e.g., "spider" frame) for connecting a large lead frame to a semiconductor chip
Description: Subject matter wherein the means used to interconnect a chip or die to a large lead frame is a small lead frame with contact elements radiating from










Patents under this class:
1 2 3 4 5 6 7 8 9 10

Patent Number Title Of Patent Date Issued
8710540 LED package with top and bottom electrodes Apr. 29, 2014
8673769 Methods and apparatuses for three dimensional integrated circuits Mar. 18, 2014
8669648 Power semiconductor module Mar. 11, 2014
8659133 Etched surface mount islands in a leadframe package Feb. 25, 2014
8653635 Power overlay structure with leadframe connections Feb. 18, 2014
8648456 Embedded integrated circuit package and method for manufacturing an embedded integrated circuit package Feb. 11, 2014
RE44699 Semiconductor integrated circuit having pads layout for increasing signal integrity and reducing chip size Jan. 14, 2014
8610150 Light-emitting diode lamp with an improved leadframe Dec. 17, 2013
8610253 Lead frame, semiconductor device, and method of manufacturing semiconductor device Dec. 17, 2013
8592962 Semiconductor device packages with protective layer and related methods Nov. 26, 2013
8587012 LED package and mold of manufacturing the same Nov. 19, 2013
8558360 Flip chip package and method of manufacturing the same Oct. 15, 2013
8536686 Semiconductor device Sep. 17, 2013
8525307 Semiconductor device, lead frame assembly, and method for fabricating the same Sep. 3, 2013
8525305 Lead carrier with print-formed package components Sep. 3, 2013
8519461 Device with post-contact back end of line through-hole via integration Aug. 27, 2013
8519518 Integrated circuit packaging system with lead encapsulation and method of manufacture thereof Aug. 27, 2013
8513811 Electronic device and method for connecting a die to a connection terminal Aug. 20, 2013
8502359 Semiconductor device Aug. 6, 2013
8482019 Electronic light emitting device and method for fabricating the same Jul. 9, 2013
8471381 Complete power management system implemented in a single surface mount package Jun. 25, 2013
8471371 Semiconductor wiring assembly, semiconductor composite wiring assembly, and resin-sealed semiconductor device Jun. 25, 2013
8445997 Stacked packaged integrated circuit devices May. 21, 2013
8441127 Bump-on-trace structures with wide and narrow portions May. 14, 2013
8426953 Semiconductor package with an embedded printed circuit board and stacked die Apr. 23, 2013
8410587 Integrated circuit package system Apr. 2, 2013
8405230 Semiconductor flip chip package having substantially non-collapsible spacer and method of manufacture thereof Mar. 26, 2013
8394675 Manufacturing light emitting diode (LED) packages Mar. 12, 2013
8390105 Lead frame substrate, manufacturing method thereof, and semiconductor apparatus Mar. 5, 2013
8377750 Integrated circuit packaging system with multiple row leads and method of manufacture thereof Feb. 19, 2013
8362598 Semiconductor device with electromagnetic interference shielding Jan. 29, 2013
8354741 Lead frame manufactured from low-priced material and not requiring strict process control, semiconductor package including the same, and method of manufacturing the lead frame and the semicond Jan. 15, 2013
8350393 Apparatus and method for predetermined component placement to a target platform Jan. 8, 2013
8334548 Semiconductor light emitting device Dec. 18, 2012
8318287 Integrated circuit package and method of making the same Nov. 27, 2012
8304294 Lead frame substrate and method of manufacturing the same Nov. 6, 2012
8278750 Heat conduction board and mounting method of electronic components Oct. 2, 2012
8269322 Tape wiring substrate and tape package using the same Sep. 18, 2012
8269355 Flexible contactless wire bonding structure and methodology for semiconductor device Sep. 18, 2012
8258610 Integrated circuit devices including a multi-layer structure with a contact extending therethrough Sep. 4, 2012
8258612 Encapsulant interposer system with integrated passive devices and manufacturing method therefor Sep. 4, 2012
8247835 LED package with top and bottom electrodes Aug. 21, 2012
8237250 Advanced quad flat non-leaded package structure and manufacturing method thereof Aug. 7, 2012
8217505 Packaged IC device comprising an embedded flex circuit on leadframe, and methods of making same Jul. 10, 2012
RE43443 Leadframe semiconductor integrated circuit device using the same, and method of and process for fabricating the two Jun. 5, 2012
8163604 Integrated circuit package system using etched leadframe Apr. 24, 2012
8158460 Method of forming metallic leadframes having laser-treated surfaces for improved adhesion to polymeric compounds Apr. 17, 2012
8153478 Method for manufacturing integrated circuit package system with under paddle leadfingers Apr. 10, 2012
8143707 Semiconductor device Mar. 27, 2012
8115286 Integrated sensor including sensing and processing die mounted on opposite sides of package substrate Feb. 14, 2012

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