 |
|
 |
| |
 |
|
Class Information
Number: 257/672
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Lead frame > Small lead frame (e.g., "spider" frame) for connecting a large lead frame to a semiconductor chip
Description: Subject matter wherein the means used to interconnect a chip or die to a large lead frame is a small lead frame with contact elements radiating from
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7459770 |
Lead frame structure having blocking surfaces and semiconductor package integrated with the lead frame structure |
Dec. 2, 2008 |
| 7459771 |
Assembly structure for electronic power integrated circuit formed on a semiconductor die and corresponding manufacturing process |
Dec. 2, 2008 |
| 7449370 |
Production process for manufacturing such semiconductor package |
Nov. 11, 2008 |
| 7449770 |
Substrate with slot |
Nov. 11, 2008 |
| 7446400 |
Chip package structure and fabricating method thereof |
Nov. 4, 2008 |
| 7443013 |
Flexible substrate for package of die |
Oct. 28, 2008 |
| 7425756 |
Semiconductor device and electronic device |
Sep. 16, 2008 |
| 7408204 |
Flip-chip packaging structure for light emitting diode and method thereof |
Aug. 5, 2008 |
| 7408242 |
Carrier with reinforced leads that are to be connected to a chip |
Aug. 5, 2008 |
| 7405467 |
Power module package structure |
Jul. 29, 2008 |
| 7400002 |
MOSFET package |
Jul. 15, 2008 |
| 7394146 |
MOSFET package |
Jul. 1, 2008 |
| 7391101 |
Semiconductor pressure sensor |
Jun. 24, 2008 |
| 7372142 |
Vertical conduction power electronic device package and corresponding assembling method |
May. 13, 2008 |
| 7345357 |
High density chip scale leadframe package and method of manufacturing the package |
Mar. 18, 2008 |
| 7326594 |
Connecting a plurality of bond pads and/or inner leads with a single bond wire |
Feb. 5, 2008 |
| 7309910 |
Micro lead frame packages and methods of manufacturing the same |
Dec. 18, 2007 |
| 7304371 |
Lead frame having a lead with a non-uniform width |
Dec. 4, 2007 |
| 7279780 |
Quad flat no-lead (QFN) grid array package, method of making and memory module and computer system including same |
Oct. 9, 2007 |
| 7280573 |
Semiconductor laser unit and optical pickup device |
Oct. 9, 2007 |
| 7274092 |
Semiconductor component and method of assembling the same |
Sep. 25, 2007 |
| 7256480 |
Lead frame package structure with high density of lead pins arrangement |
Aug. 14, 2007 |
| 7211883 |
Semiconductor chip package |
May. 1, 2007 |
| 7211887 |
connection arrangement for micro lead frame plastic packages |
May. 1, 2007 |
| 7208840 |
Semiconductor module, electronic device and electronic equipment, and method for manufacturing semiconductor module |
Apr. 24, 2007 |
| 7202112 |
Micro lead frame packages and methods of manufacturing the same |
Apr. 10, 2007 |
| 7183632 |
Surface-mountable light-emitting diode structural element |
Feb. 27, 2007 |
| 7157790 |
Single die stitch bonding |
Jan. 2, 2007 |
| 7138673 |
Semiconductor package having encapsulated chip attached to a mounting plate |
Nov. 21, 2006 |
| 7135759 |
Individualized low parasitic power distribution lines deposited over active integrated circuits |
Nov. 14, 2006 |
| 7122884 |
Robust leaded molded packages and methods for forming the same |
Oct. 17, 2006 |
| 7122883 |
Stacked semiconductor device including improved lead frame arrangement |
Oct. 17, 2006 |
| 7119423 |
Semiconductor device and method of manufacturing the same, electronic module, and electronic instrument |
Oct. 10, 2006 |
| 7119424 |
Semiconductor device and method for manufacturing the same |
Oct. 10, 2006 |
| 7109572 |
Quad flat no lead (QFN) grid array package |
Sep. 19, 2006 |
| 7105378 |
Method of forming a leadframe for a semiconductor package |
Sep. 12, 2006 |
| 7102209 |
Substrate for use in semiconductor manufacturing and method of making same |
Sep. 5, 2006 |
| 7102210 |
Lead frame, manufacturing method of the same, and semiconductor device using the same |
Sep. 5, 2006 |
| 7102215 |
Surface-mountable light-emitting diode structural element |
Sep. 5, 2006 |
| 7102211 |
Semiconductor device and hybrid integrated circuit device |
Sep. 5, 2006 |
| 7081666 |
Lead frame structure with aperture or groove for flip chip in a leaded molded package |
Jul. 25, 2006 |
| 7057267 |
Semiconductor device and method of fabrication thereof, electronic module, and electronic instrument |
Jun. 6, 2006 |
| 7055241 |
Method of fabricating an integrated circuit package |
Jun. 6, 2006 |
| 7042069 |
Semiconductor device and method of manufacturing same, wiring board, electronic module, and electronic instrument |
May. 9, 2006 |
| 7042071 |
Leadframe, plastic-encapsulated semiconductor device, and method for fabricating the same |
May. 9, 2006 |
| 7034385 |
Topless semiconductor package |
Apr. 25, 2006 |
| 7019391 |
NANO IC packaging |
Mar. 28, 2006 |
| 7012321 |
Stacked semiconductor device including improved lead frame arrangement |
Mar. 14, 2006 |
| 6995029 |
Fabricating surface mountable semiconductor components with leadframe strips |
Feb. 7, 2006 |
| 6979886 |
Short-prevented lead frame and method for fabricating semiconductor package with the same |
Dec. 27, 2005 |
|
|
|
 |
|
 |
|
| |
Randomly Featured Patents |
|
