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Class Information
Number: 257/671
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Lead frame > With separate tie bar element or plural tie bars > Of insulating material
Description: Subject matter wherein the separate tie bar element or the plural tie bars are made of electrically insulating material.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7459770 |
Lead frame structure having blocking surfaces and semiconductor package integrated with the lead frame structure |
Dec. 2, 2008 |
| 7408242 |
Carrier with reinforced leads that are to be connected to a chip |
Aug. 5, 2008 |
| 7372130 |
Semiconductor device including a semiconductor chip formed on an insulating element such as a tape, and including an improved insulating arrangement |
May. 13, 2008 |
| 7339262 |
Tape circuit substrate and semiconductor apparatus employing the same |
Mar. 4, 2008 |
| 7304371 |
Lead frame having a lead with a non-uniform width |
Dec. 4, 2007 |
| 7245007 |
Exposed lead interposer leadframe package |
Jul. 17, 2007 |
| 7211880 |
Photoelectric conversion apparatus and manufacturing method of same |
May. 1, 2007 |
| 7205650 |
Composite devices of laminate type and processes |
Apr. 17, 2007 |
| 7122401 |
Area array type semiconductor package fabrication method |
Oct. 17, 2006 |
| 7102214 |
Pre-molded leadframe |
Sep. 5, 2006 |
| 7081666 |
Lead frame structure with aperture or groove for flip chip in a leaded molded package |
Jul. 25, 2006 |
| 7078780 |
Schottky barrier diode and method of making the same |
Jul. 18, 2006 |
| 6979888 |
LOC semiconductor assembled with room temperature adhesive |
Dec. 27, 2005 |
| 6956282 |
Stabilizer/spacer for semiconductor device |
Oct. 18, 2005 |
| 6953988 |
Semiconductor package |
Oct. 11, 2005 |
| 6946721 |
Leadframe of a conductive material and component with a leadframe of a conductive material |
Sep. 20, 2005 |
| 6933592 |
Substrate structure capable of reducing package singular stress |
Aug. 23, 2005 |
| 6888229 |
Connection components with frangible leads and bus |
May. 3, 2005 |
| 6867481 |
Lead frame structure with aperture or groove for flip chip in a leaded molded package |
Mar. 15, 2005 |
| 6861734 |
Resin-molded semiconductor device |
Mar. 1, 2005 |
| 6858922 |
Back-to-back connected power semiconductor device package |
Feb. 22, 2005 |
| 6858919 |
Semiconductor package |
Feb. 22, 2005 |
| 6853057 |
Lead frame for a plastic encapsulated semiconductor device |
Feb. 8, 2005 |
| 6831352 |
Semiconductor package for high frequency performance |
Dec. 14, 2004 |
| 6798046 |
Semiconductor package including ring structure connected to leads with vertically downset inner ends |
Sep. 28, 2004 |
| 6774465 |
Semiconductor power package module |
Aug. 10, 2004 |
| 6768211 |
Five layer adhesive/insulator/metal/insulator/adhesive tape for semiconductor die packaging |
Jul. 27, 2004 |
| 6750479 |
Semiconductor component and a method for identifying a semiconductor component |
Jun. 15, 2004 |
| 6744120 |
Flexible interconnect substrate of a tape-shaped semiconductor device, semiconductor device and circuit board |
Jun. 1, 2004 |
| 6740969 |
Electronic device |
May. 25, 2004 |
| 6713850 |
Tape carrier package structure with dummy pads and dummy leads for package reinforcement |
Mar. 30, 2004 |
| 6703694 |
Frame for semiconductor package including plural lead frames having thin parts or hollows adjacent the terminal roots |
Mar. 9, 2004 |
| 6693304 |
Laminated lead frame, and optical communication module and method of manufacturing the same |
Feb. 17, 2004 |
| 6677180 |
Method for manufacturing a low-profile semiconductor device |
Jan. 13, 2004 |
| 6661081 |
Semiconductor device and its manufacturing method |
Dec. 9, 2003 |
| 6646329 |
Power chip scale package |
Nov. 11, 2003 |
| 6642609 |
Leadframe for a semiconductor device having leads with land electrodes |
Nov. 4, 2003 |
| 6621166 |
Five layer adhesive/insulator/metal/insulator/adhesive tape for semiconductor die packaging |
Sep. 16, 2003 |
| 6589810 |
BGA package and method of fabrication |
Jul. 8, 2003 |
| 6590277 |
Reduced stress LOC assembly |
Jul. 8, 2003 |
| 6586821 |
Lead-frame forming for improved thermal performance |
Jul. 1, 2003 |
| 6570271 |
Apparatus for routing signals |
May. 27, 2003 |
| 6563201 |
System carrier for a semiconductor chip having a lead frame |
May. 13, 2003 |
| RE38043 |
Lead frame |
Mar. 25, 2003 |
| 6515353 |
Multi-layer lead frame for a semiconductor device |
Feb. 4, 2003 |
| 6509630 |
Flexible interconnecting substrate, film, carrier, tape-shaped semiconductor device, semiconductor device and method of manufacturing the same, circuit board, and electronic equipment |
Jan. 21, 2003 |
| 6498389 |
Ultra-thin semiconductor package device using a support tape |
Dec. 24, 2002 |
| 6476471 |
Microelectronic-device assemblies and methods that exclude extraneous elements from sensitive areas |
Nov. 5, 2002 |
| 6448635 |
Surface acoustical wave flip chip |
Sep. 10, 2002 |
| 6380635 |
Apparatus and methods for coupling conductive leads of semiconductor assemblies |
Apr. 30, 2002 |
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