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Class Information
Number: 257/671
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Lead frame > With separate tie bar element or plural tie bars > Of insulating material
Description: Subject matter wherein the separate tie bar element or the plural tie bars are made of electrically insulating material.

Patents under this class:
1 2 3 4

Patent Number Title Of Patent Date Issued
8643155 Liquid crystal display and chip on film thereof Feb. 4, 2014
8637976 Semiconductor device with lead terminals having portions thereof extending obliquely Jan. 28, 2014
8525307 Semiconductor device, lead frame assembly, and method for fabricating the same Sep. 3, 2013
8450152 Double-side exposed semiconductor device and its manufacturing method May. 28, 2013
8421209 Semiconductor device with lead terminals having portions thereof extending obliquely Apr. 16, 2013
8410587 Integrated circuit package system Apr. 2, 2013
8357566 Pre-encapsulated lead frames for microelectronic device packages, and associated methods Jan. 22, 2013
8350393 Apparatus and method for predetermined component placement to a target platform Jan. 8, 2013
8193622 Thermally enhanced thin semiconductor package Jun. 5, 2012
8159052 Apparatus and method for a chip assembly including a frequency extending device Apr. 17, 2012
8143707 Semiconductor device Mar. 27, 2012
8026591 Semiconductor device with lead terminals having portions thereof extending obliquely Sep. 27, 2011
8022517 Semiconductor chip package Sep. 20, 2011
7947534 Integrated circuit packaging system including a non-leaded package May. 24, 2011
7948091 Mounting structure for semiconductor element May. 24, 2011
7928543 Tape wiring substrate and tape package using the same Apr. 19, 2011
7888185 Semiconductor device assemblies and systems including at least one conductive pathway extending around a side of at least one semiconductor device Feb. 15, 2011
7863737 Integrated circuit package system with wire bond pattern Jan. 4, 2011
7839003 Semiconductor device including a coupling conductor having a concave and convex Nov. 23, 2010
7820480 Lead frame routed chip pads for semiconductor packages Oct. 26, 2010
7808088 Semiconductor device with improved high current performance Oct. 5, 2010
7800207 Method for connecting a die attach pad to a lead frame and product thereof Sep. 21, 2010
7772681 Semiconductor die package and method for making the same Aug. 10, 2010
7705444 Semiconductor device with lead frame having lead terminals with wide portions of trapezoidal cross section Apr. 27, 2010
7671382 Semiconductor device with thermoplastic resin to reduce warpage Mar. 2, 2010
7663210 Optical component assembly Feb. 16, 2010
7662672 Manufacturing process of leadframe-based BGA packages Feb. 16, 2010
7633164 Liquid crystal display device and manufacturing method therefor Dec. 15, 2009
7622804 Semiconductor device and method of manufacturing the same Nov. 24, 2009
7541220 Integrated circuit device having flexible leadframe Jun. 2, 2009
7525179 Lead frame structure with aperture or groove for flip chip in a leaded molded package Apr. 28, 2009
7466016 Bent lead transistor Dec. 16, 2008
7459770 Lead frame structure having blocking surfaces and semiconductor package integrated with the lead frame structure Dec. 2, 2008
7408242 Carrier with reinforced leads that are to be connected to a chip Aug. 5, 2008
7372130 Semiconductor device including a semiconductor chip formed on an insulating element such as a tape, and including an improved insulating arrangement May. 13, 2008
7339262 Tape circuit substrate and semiconductor apparatus employing the same Mar. 4, 2008
7304371 Lead frame having a lead with a non-uniform width Dec. 4, 2007
7245007 Exposed lead interposer leadframe package Jul. 17, 2007
7211880 Photoelectric conversion apparatus and manufacturing method of same May. 1, 2007
7205650 Composite devices of laminate type and processes Apr. 17, 2007
7122401 Area array type semiconductor package fabrication method Oct. 17, 2006
7102214 Pre-molded leadframe Sep. 5, 2006
7081666 Lead frame structure with aperture or groove for flip chip in a leaded molded package Jul. 25, 2006
7078780 Schottky barrier diode and method of making the same Jul. 18, 2006
6979888 LOC semiconductor assembled with room temperature adhesive Dec. 27, 2005
6956282 Stabilizer/spacer for semiconductor device Oct. 18, 2005
6953988 Semiconductor package Oct. 11, 2005
6946721 Leadframe of a conductive material and component with a leadframe of a conductive material Sep. 20, 2005
6933592 Substrate structure capable of reducing package singular stress Aug. 23, 2005
6888229 Connection components with frangible leads and bus May. 3, 2005

1 2 3 4

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