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Class Information
Number: 257/670
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Lead frame > With separate tie bar element or plural tie bars
Description: Subject matter in which a frame element used to tie or connect a semiconductor chip pad/flag and/or lead fingers frame members is a separate element and not part of the lead frame itself or wherein plural tie bar elements are provided as part of a lead frame.










Sub-classes under this class:

Class Number Class Name Patents
257/671 Of insulating material 156


Patents under this class:
1 2 3 4 5 6 7 8 9 10 11

Patent Number Title Of Patent Date Issued
8710636 Lead frame array package with flip chip die attach Apr. 29, 2014
8673687 Etched hybrid die package Mar. 18, 2014
8674487 Semiconductor packages with lead extensions and related methods Mar. 18, 2014
8664038 Integrated circuit packaging system with stacked paddle and method of manufacture thereof Mar. 4, 2014
8664752 Semiconductor die package and method for making the same Mar. 4, 2014
8659129 Semiconductor device and method of manufacturing same Feb. 25, 2014
8648450 Semiconductor device including leadframe with a combination of leads and lands Feb. 11, 2014
8643156 Lead frame for assembling semiconductor device Feb. 4, 2014
8637976 Semiconductor device with lead terminals having portions thereof extending obliquely Jan. 28, 2014
8610253 Lead frame, semiconductor device, and method of manufacturing semiconductor device Dec. 17, 2013
8598693 Die pad package with a concave portion in the sealing resin Dec. 3, 2013
8592691 Printed wiring board Nov. 26, 2013
8592962 Semiconductor device packages with protective layer and related methods Nov. 26, 2013
8586419 Semiconductor packages including die and L-shaped lead and method of manufacture Nov. 19, 2013
8587098 Integrated circuit protruding pad package system and method for manufacturing thereof Nov. 19, 2013
8575742 Semiconductor device with increased I/O leadframe including power bars Nov. 5, 2013
8558358 Lead frame Oct. 15, 2013
8525307 Semiconductor device, lead frame assembly, and method for fabricating the same Sep. 3, 2013
8519518 Integrated circuit packaging system with lead encapsulation and method of manufacture thereof Aug. 27, 2013
8513786 Pre-bonded substrate for integrated circuit package and method of making the same Aug. 20, 2013
8513811 Electronic device and method for connecting a die to a connection terminal Aug. 20, 2013
8492882 Semiconductor device and method of manufacturing same Jul. 23, 2013
8487417 Package for a power semiconductor device Jul. 16, 2013
8487454 Leadframe, semiconductor device, and method of manufacturing the same Jul. 16, 2013
8472196 Power module Jun. 25, 2013
8471371 Semiconductor wiring assembly, semiconductor composite wiring assembly, and resin-sealed semiconductor device Jun. 25, 2013
8450841 Bonded wire semiconductor device May. 28, 2013
8441127 Bump-on-trace structures with wide and narrow portions May. 14, 2013
8432023 Increased I/O leadframe and semiconductor device including same Apr. 30, 2013
8421209 Semiconductor device with lead terminals having portions thereof extending obliquely Apr. 16, 2013
8422522 Semiconductor laser device Apr. 16, 2013
8410587 Integrated circuit package system Apr. 2, 2013
8389332 Integrated circuit packaging system with isolated pads and method of manufacture thereof Mar. 5, 2013
8368191 Semiconductor device and manufacturing method of the same Feb. 5, 2013
8362598 Semiconductor device with electromagnetic interference shielding Jan. 29, 2013
8358002 Window ball grid array (BGA) semiconductor packages Jan. 22, 2013
8358014 Structure and method for power field effect transistor Jan. 22, 2013
8355258 Support method and apparatus for printed circuit board Jan. 15, 2013
8350393 Apparatus and method for predetermined component placement to a target platform Jan. 8, 2013
8338962 Semiconductor package substrate and semiconductor package having the same Dec. 25, 2012
8334548 Semiconductor light emitting device Dec. 18, 2012
8334583 Leadframe strip and mold apparatus for an electronic component and method of encapsulating an electronic component Dec. 18, 2012
8324025 Power semiconductor device packaging Dec. 4, 2012
8304866 Fusion quad flat semiconductor package Nov. 6, 2012
8304865 Leadframe and chip package Nov. 6, 2012
8288858 Semiconductor device Oct. 16, 2012
8283762 Lead frame based semiconductor package and a method of manufacturing the same Oct. 9, 2012
8283757 Quad flat package with exposed common electrode bars Oct. 9, 2012
8274140 Semiconductor chip package assembly with deflection-resistant leadfingers Sep. 25, 2012
8269321 Low cost lead frame package and method for forming same Sep. 18, 2012

1 2 3 4 5 6 7 8 9 10 11










 
 
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