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Class Information
Number: 257/670
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Lead frame > With separate tie bar element or plural tie bars
Description: Subject matter in which a frame element used to tie or connect a semiconductor chip pad/flag and/or lead fingers frame members is a separate element and not part of the lead frame itself or wherein plural tie bar elements are provided as part of a lead frame.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7459770 |
Lead frame structure having blocking surfaces and semiconductor package integrated with the lead frame structure |
Dec. 2, 2008 |
| 7449771 |
Multiple leadframe laminated IC package |
Nov. 11, 2008 |
| 7446400 |
Chip package structure and fabricating method thereof |
Nov. 4, 2008 |
| 7429500 |
Method of manufacturing a semiconductor device |
Sep. 30, 2008 |
| 7420265 |
Integrated circuit package system with integrated circuit support |
Sep. 2, 2008 |
| 7414302 |
Flashless lead frame with horizontal singulation |
Aug. 19, 2008 |
| 7408242 |
Carrier with reinforced leads that are to be connected to a chip |
Aug. 5, 2008 |
| 7397113 |
Semiconductor device |
Jul. 8, 2008 |
| 7388280 |
Package stacking lead frame system |
Jun. 17, 2008 |
| 7388283 |
Method and device for integrating an illumination source and detector into the same IC package that allows angular illumination with a common planar leadframe |
Jun. 17, 2008 |
| 7378721 |
Chip on lead frame for small package speed sensor |
May. 27, 2008 |
| 7368807 |
Low cost method to produce high volume lead frames |
May. 6, 2008 |
| 7351612 |
Method for fabricating quad flat non-leaded package |
Apr. 1, 2008 |
| 7345357 |
High density chip scale leadframe package and method of manufacturing the package |
Mar. 18, 2008 |
| 7342297 |
Sawn power package |
Mar. 11, 2008 |
| 7339261 |
Semiconductor device |
Mar. 4, 2008 |
| 7298026 |
Large die package and method for the fabrication thereof |
Nov. 20, 2007 |
| 7288833 |
Stress-free lead frame |
Oct. 30, 2007 |
| 7274089 |
Integrated circuit package system with adhesive restraint |
Sep. 25, 2007 |
| 7262491 |
Die pad for semiconductor packages and methods of making and using same |
Aug. 28, 2007 |
| 7250673 |
Signal isolation in a package substrate |
Jul. 31, 2007 |
| 7242077 |
Leadframe with die pad |
Jul. 10, 2007 |
| 7233056 |
Chip scale package with heat spreader |
Jun. 19, 2007 |
| 7230323 |
Ground-enhanced semiconductor package and lead frame for the same |
Jun. 12, 2007 |
| 7211880 |
Photoelectric conversion apparatus and manufacturing method of same |
May. 1, 2007 |
| 7211887 |
connection arrangement for micro lead frame plastic packages |
May. 1, 2007 |
| 7192809 |
Low cost method to produce high volume lead frames |
Mar. 20, 2007 |
| 7187065 |
Semiconductor device and semiconductor device unit |
Mar. 6, 2007 |
| 7176557 |
Semiconductor device |
Feb. 13, 2007 |
| 7173321 |
Semiconductor package having multiple row of leads |
Feb. 6, 2007 |
| 7170150 |
Lead frame for semiconductor package |
Jan. 30, 2007 |
| 7157312 |
Surface mount package and method for forming multi-chip microsensor device |
Jan. 2, 2007 |
| 7154165 |
Flashless lead frame with horizontal singulation |
Dec. 26, 2006 |
| 7148561 |
Ball grid array substrate strip with warpage-preventive linkage structure |
Dec. 12, 2006 |
| 7132315 |
Leadframe, plastic-encapsulated semiconductor device, and method for fabricating the same |
Nov. 7, 2006 |
| 7132733 |
Semiconductor device |
Nov. 7, 2006 |
| 7122885 |
Flip-chip packaging |
Oct. 17, 2006 |
| 7122401 |
Area array type semiconductor package fabrication method |
Oct. 17, 2006 |
| 7109570 |
Integrated circuit package with leadframe enhancement and method of manufacturing the same |
Sep. 19, 2006 |
| 7105378 |
Method of forming a leadframe for a semiconductor package |
Sep. 12, 2006 |
| 7102209 |
Substrate for use in semiconductor manufacturing and method of making same |
Sep. 5, 2006 |
| 7102214 |
Pre-molded leadframe |
Sep. 5, 2006 |
| 7084490 |
Leads under chip IC package |
Aug. 1, 2006 |
| 7074654 |
Tape supported memory card leadframe structure |
Jul. 11, 2006 |
| 7071541 |
Plastic integrated circuit package and method and leadframe for making the package |
Jul. 4, 2006 |
| 7067357 |
Semiconductor package and method of fabricating same |
Jun. 27, 2006 |
| 7064420 |
Integrated circuit leadframe with ground plane |
Jun. 20, 2006 |
| 7042071 |
Leadframe, plastic-encapsulated semiconductor device, and method for fabricating the same |
May. 9, 2006 |
| 7034385 |
Topless semiconductor package |
Apr. 25, 2006 |
| 7030474 |
Plastic integrated circuit package and method and leadframe for making the package |
Apr. 18, 2006 |
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