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Class Information
Number: 257/669
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Lead frame > With stress relief
Description: Subject matter wherein means are provided to alleviate stresses and strains (e.g., mechanical or thermal stresses) to which a lead frame is subjected.










Patents under this class:
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Patent Number Title Of Patent Date Issued
6384478 Leadframe having a paddle with an isolated area May. 7, 2002
6373124 Lead frame and method of producing the same, and a semiconductor device using the same Apr. 16, 2002
6369439 Strip of semiconductor package Apr. 9, 2002
RE37637 Smart cards having thin die Apr. 9, 2002
6355975 Semiconductor device and manufacturing method thereof Mar. 12, 2002
6351133 Packaging and interconnection of contact structure Feb. 26, 2002
6344681 Semiconductor package produced by solder plating without solder residue Feb. 5, 2002
6342729 Tape carrier package Jan. 29, 2002
6342727 Tape carrier device for a tab Jan. 29, 2002
6339252 Electronic device package and leadframe Jan. 15, 2002
6338983 Leadframe for an encapsulated optocomponent Jan. 15, 2002
6337511 LOC semiconductor assembled with room temperature adhesive Jan. 8, 2002
6326678 Molded plastic package with heat sink and enhanced electrical performance Dec. 4, 2001
6323542 Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument Nov. 27, 2001
6320136 Layered printed-circuit-board and module using the same Nov. 20, 2001
6313402 Stress relief bend useful in an integrated circuit redistribution patch Nov. 6, 2001
6307755 Surface mount semiconductor package, die-leadframe combination and leadframe therefor and method of mounting leadframes to surfaces of semiconductor die Oct. 23, 2001
6303984 Lead frame including angle iron tie bar Oct. 16, 2001
6303985 Semiconductor lead frame and package with stiffened mounting paddle Oct. 16, 2001
6297546 Underfill coating for LOC package Oct. 2, 2001
6291776 Thermal deformation management for chip carriers Sep. 18, 2001
6288904 Chip module, in particular for implantation in a smart card body Sep. 11, 2001
6288907 High density integrated circuit module with complex electrical interconnect rails having electrical interconnect strain relief Sep. 11, 2001
6281566 Plastic package for electronic devices Aug. 28, 2001
6277225 Stress reduction feature for LOC lead frame Aug. 21, 2001
6274405 Semiconductor device, method of making the same, circuit board, and film carrier tape Aug. 14, 2001
6268645 Semiconductor device Jul. 31, 2001
6262474 Semiconductor device Jul. 17, 2001
6261863 Components with releasable leads and methods of making releasable leads Jul. 17, 2001
6256200 Symmetrical package for semiconductor die Jul. 3, 2001
6249042 Member for lead Jun. 19, 2001
6239489 Reinforcement of lead bonding in microelectronics packages May. 29, 2001
6238953 Lead frame, resin-encapsulated semiconductor device and fabrication process for the device May. 29, 2001
6232653 TSOP type semiconductor device May. 15, 2001
6229199 Packaged semiconductor device May. 8, 2001
6229205 Semiconductor device package having twice-bent tie bar and small die pad May. 8, 2001
6215191 Compliant lead structures for microelectronic devices Apr. 10, 2001
6211565 Apparatus for preventing electrostatic discharge in an integrated circuit Apr. 3, 2001
6211563 Semiconductor package with an improved leadframe Apr. 3, 2001
6208018 Piggyback multiple dice assembly Mar. 27, 2001
6208017 Semiconductor device with lead-on-chip structure Mar. 27, 2001
6204553 Lead frame structure Mar. 20, 2001
6201294 Ball grid array semiconductor package comprised of two lead frames Mar. 13, 2001
6194779 Plastic mold type semiconductor device Feb. 27, 2001
6195264 Laminate substrate having joining layer of photoimageable material Feb. 27, 2001
6195260 Flexible printed circuit board unit having electronic parts mounted thereon Feb. 27, 2001
6191490 Semiconductor package having a separated die pad Feb. 20, 2001
6184576 Packaging and interconnection of contact structure Feb. 6, 2001
6177725 Semiconductor device having an improved structure for preventing cracks, improved small-sized semiconductor and method of manufacturing the same Jan. 23, 2001
6177726 SiO2 wire bond insulation in semiconductor assemblies Jan. 23, 2001

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