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Browse by Category: Main > Physics
Class Information
Number: 257/669
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Lead frame > With stress relief
Description: Subject matter wherein means are provided to alleviate stresses and strains (e.g., mechanical or thermal stresses) to which a lead frame is subjected.










Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12

Patent Number Title Of Patent Date Issued
6603195 Planarized plastic package modules for integrated circuits Aug. 5, 2003
6593527 Integrated circuit assembly with bar bond attachment Jul. 15, 2003
6590277 Reduced stress LOC assembly Jul. 8, 2003
6583355 Bladder insert for encapsulant displacement Jun. 24, 2003
6583499 Quad flat non-leaded package and leadframe for use in a quad flat non-leaded package Jun. 24, 2003
6580164 Semiconductor device and method of manufacturing same Jun. 17, 2003
6576994 Semiconductor device Jun. 10, 2003
6577014 Low-profile semiconductor device Jun. 10, 2003
6570245 Stress shield for microelectronic dice May. 27, 2003
6559526 Multiple-step inner lead of leadframe May. 6, 2003
6545349 Semiconductor device Apr. 8, 2003
6542374 Circuit board, method for manufacturing the circuit board, and display device and electronic equipment employing the circuit board Apr. 1, 2003
6541851 Lead frame for a semiconductor device Apr. 1, 2003
6541845 Components with releasable leads and methods of making releasable leads Apr. 1, 2003
6541857 Method of forming BGA interconnections having mixed solder profiles Apr. 1, 2003
6534845 Semiconductor device Mar. 18, 2003
6528868 Lead frame device and method for producing the same Mar. 4, 2003
6518651 Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument Feb. 11, 2003
6518650 Tape under frame for lead frame IC package assembly Feb. 11, 2003
6515370 Electronic component and semiconductor device, method for manufacturing the same, circuit board have the same mounted thereon, and electronic equipment having the circuit board Feb. 4, 2003
6507099 Multi-chip integrated circuit carrier Jan. 14, 2003
6501157 Substrate for accepting wire bonded or flip-chip components Dec. 31, 2002
6501160 Semiconductor device and a method of manufacturing the same and a mount structure Dec. 31, 2002
6498388 Semiconductor module with improved solder joint reliability Dec. 24, 2002
6495907 Conductor reticulation for improved device planarity Dec. 17, 2002
6495924 Semiconductor device, including an arrangement to provide a uniform press contact and converter using same Dec. 17, 2002
6492715 Integrated semiconductor package Dec. 10, 2002
6486537 Semiconductor package with warpage resistant substrate Nov. 26, 2002
6486539 Compression layer on the leadframe to reduce stress defects Nov. 26, 2002
6472727 Semiconductor device and manufacturing method thereof Oct. 29, 2002
6465878 Compliant microelectronic assemblies Oct. 15, 2002
6462405 Semiconductor package Oct. 8, 2002
6459147 Attaching semiconductor dies to substrates with conductive straps Oct. 1, 2002
6459145 Semiconductor device having an improved structure for preventing cracks, and improved small-sized semiconductor Oct. 1, 2002
6459143 Method of packaging fuses Oct. 1, 2002
6455923 Apparatus and methods for providing substrate structures having metallic layers for microelectronics devices Sep. 24, 2002
6455922 Deformation-absorbing leadframe for semiconductor devices Sep. 24, 2002
6452802 Symmetrical package for semiconductor die Sep. 17, 2002
6441473 Flip chip semiconductor device Aug. 27, 2002
6420779 Leadframe based chip scale package and method of producing the same Jul. 16, 2002
6402009 Apparatus and method for shaping lead frame for semiconductor device and lead frame for semiconductor device Jun. 11, 2002
6396131 Stress reduction feature for LOC lead frame May. 28, 2002
6396091 Chip scale package May. 28, 2002
6392295 Semiconductor device May. 21, 2002
6392287 Semiconductor package and fabricating method thereof May. 21, 2002
6388888 Semiconductor device and process for manufacturing the same, liquid crystal module and process for mounting the same May. 14, 2002
RE37690 Lead frame and semiconductor device May. 7, 2002
6384332 Bladder insert for encapsulant displacement May. 7, 2002
6384466 Multi-layer dielectric and method of forming same May. 7, 2002
6384475 Lead formation using grids May. 7, 2002

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