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Class Information
Number: 257/669
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Lead frame > With stress relief
Description: Subject matter wherein means are provided to alleviate stresses and strains (e.g., mechanical or thermal stresses) to which a lead frame is subjected.










Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12

Patent Number Title Of Patent Date Issued
6861750 Ball grid array package with multiple interposers Mar. 1, 2005
6853058 Process for providing electrical connection between a semiconductor die and a semiconductor die receiving member Feb. 8, 2005
6849922 Organic electro-luminescent display device and method of fabricating the same Feb. 1, 2005
6847101 Microelectronic package having a compliant layer with bumped protrusions Jan. 25, 2005
6828659 Semiconductor device having a die pad supported by a die pad supporter Dec. 7, 2004
6825550 Board-on-chip packages with conductive foil on the chip surface Nov. 30, 2004
6822318 Stress isolating die attach structure and method Nov. 23, 2004
6818972 Reduction of chip carrier flexing during thermal cycling Nov. 16, 2004
6809408 Semiconductor package with die pad having recessed portion Oct. 26, 2004
6803258 Semiconductor device Oct. 12, 2004
6803324 Semiconductor device and its manufacturing method Oct. 12, 2004
6803647 Mounting structure of semiconductor device and mounting method thereof Oct. 12, 2004
6800932 Package for semiconductor die containing symmetrical lead and heat sink Oct. 5, 2004
6798046 Semiconductor package including ring structure connected to leads with vertically downset inner ends Sep. 28, 2004
6794737 Spring structure with stress-balancing layer Sep. 21, 2004
6794745 Lead on chip type semiconductor package Sep. 21, 2004
6784524 Stress shield for microelectronic dice Aug. 31, 2004
6778407 Portable data carrier Aug. 17, 2004
6777816 Multi-chip module Aug. 17, 2004
6770957 Adhesives, adhesive films and electric devices Aug. 3, 2004
6756658 Making two lead surface mounting high power microleadframe semiconductor packages Jun. 29, 2004
6750533 Substrate with dam bar structure for smooth flow of encapsulating resin Jun. 15, 2004
6744119 Leadframe having slots in a die pad Jun. 1, 2004
6744118 Frame for semiconductor package Jun. 1, 2004
6724070 Fine pitch lead frame Apr. 20, 2004
6720646 Power converter with improved lead frame arrangement including stand-up portion Apr. 13, 2004
6720645 Semiconductor device Apr. 13, 2004
6713849 Semiconductor utilizing grooves in lead and tab portions of lead frame to prevent peel off between the lead frame and the resin Mar. 30, 2004
6713850 Tape carrier package structure with dummy pads and dummy leads for package reinforcement Mar. 30, 2004
6710431 Semiconductor device and lead frame used therefor Mar. 23, 2004
6700182 Thermally conductive substrate, thermally conductive substrate manufacturing method and power module Mar. 2, 2004
6700206 Stacked semiconductor package and method producing same Mar. 2, 2004
6696749 Package structure having tapering support bars and leads Feb. 24, 2004
6696765 Multi-chip module Feb. 24, 2004
6686658 Semiconductor device, including an arrangement to provide a uniform press contact and converter using same Feb. 3, 2004
6677665 Dual-die integrated circuit package Jan. 13, 2004
6677180 Method for manufacturing a low-profile semiconductor device Jan. 13, 2004
6674156 Multiple row fine pitch leadless leadframe package with use of half-etch process Jan. 6, 2004
6664617 Semiconductor package Dec. 16, 2003
6664614 Lead frame and bottom lead semiconductor package using the lead frame Dec. 16, 2003
6661089 Semiconductor package which has no resinous flash formed on lead frame and method for manufacturing the same Dec. 9, 2003
6661080 Structure for backside saw cavity protection Dec. 9, 2003
6657288 Compression layer on the lead frame to reduce stress defects Dec. 2, 2003
6650020 Resin-sealed semiconductor device Nov. 18, 2003
6639306 Semiconductor package having a die pad with downward-extended tabs Oct. 28, 2003
6635954 Stress reduction feature for LOC lead frame Oct. 21, 2003
6624511 Hybrid integrated circuit device Sep. 23, 2003
6621166 Five layer adhesive/insulator/metal/insulator/adhesive tape for semiconductor die packaging Sep. 16, 2003
6617510 Stress relief bend useful in an integrated circuit redistribution patch Sep. 9, 2003
6610162 Methods for stress reduction feature for LOC lead frame Aug. 26, 2003

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