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Class Information
Number: 257/669
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Lead frame > With stress relief
Description: Subject matter wherein means are provided to alleviate stresses and strains (e.g., mechanical or thermal stresses) to which a lead frame is subjected.

Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12

Patent Number Title Of Patent Date Issued
7154165 Flashless lead frame with horizontal singulation Dec. 26, 2006
7148561 Ball grid array substrate strip with warpage-preventive linkage structure Dec. 12, 2006
7141873 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument Nov. 28, 2006
7135760 Moisture resistant integrated circuit leadframe package Nov. 14, 2006
7122401 Area array type semiconductor package fabrication method Oct. 17, 2006
7115446 Flip chip bonding method for enhancing adhesion force in flip chip packaging process and metal layer-built structure of substrate for the same Oct. 3, 2006
7115975 Semiconductor device, process of producing semiconductor device, and ink jet recording head Oct. 3, 2006
7112252 Assembly method for semiconductor die and lead frame Sep. 26, 2006
7102209 Substrate for use in semiconductor manufacturing and method of making same Sep. 5, 2006
7092890 Method for manufacturing thin GaAs die with copper-back metal structures Aug. 15, 2006
7087984 Methods for protecting intermediate conductive elements of semiconductor device assemblies Aug. 8, 2006
7084517 Semiconductor device connecting structure, liquid crystal display unit based on the same connecting structure, and electronic apparatus using the same display unit Aug. 1, 2006
7084489 Computer system including at least one stress balanced semiconductor package Aug. 1, 2006
7081666 Lead frame structure with aperture or groove for flip chip in a leaded molded package Jul. 25, 2006
7067357 Semiconductor package and method of fabricating same Jun. 27, 2006
7064420 Integrated circuit leadframe with ground plane Jun. 20, 2006
7049685 Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices May. 23, 2006
7049686 Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument May. 23, 2006
7042069 Semiconductor device and method of manufacturing same, wiring board, electronic module, and electronic instrument May. 9, 2006
7042087 Hybrid integrated circuit device May. 9, 2006
7038322 Multi-chip module May. 2, 2006
7033865 Thermally conductive substrate, thermally conductive substrate manufacturing method and power module Apr. 25, 2006
7023075 Teardrop shaped lead frames Apr. 4, 2006
7012324 Lead frame with flag support structure Mar. 14, 2006
7002239 Leadless leadframe packaging panel featuring peripheral dummy leads Feb. 21, 2006
6992372 Film carrier tape for mounting electronic devices thereon Jan. 31, 2006
6983551 Interconnecting substrates for electrical coupling of microelectronic components Jan. 10, 2006
6979888 LOC semiconductor assembled with room temperature adhesive Dec. 27, 2005
6965158 Multi-layer substrates and fabrication processes Nov. 15, 2005
6956282 Stabilizer/spacer for semiconductor device Oct. 18, 2005
6949814 Mounting material, semiconductor device and method of manufacturing semiconductor device Sep. 27, 2005
6946723 Semiconductor device and manufacturing method thereof Sep. 20, 2005
6946724 Circuit device and method of manufacture thereof Sep. 20, 2005
6911719 Lead frame for resin sealed semiconductor device Jun. 28, 2005
6909184 TAB type semiconductor device Jun. 21, 2005
6900524 Resin molded semiconductor device on a lead frame and method of manufacturing the same May. 31, 2005
6897549 Frame for semiconductor package May. 24, 2005
6894372 Tape under frame for lead frame IC package assembly May. 17, 2005
6894370 Lead frame and semiconductor device having the same as well as method of resin-molding the same May. 17, 2005
6888230 Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor device May. 3, 2005
6888207 High voltage transistors with graded extension May. 3, 2005
6888229 Connection components with frangible leads and bus May. 3, 2005
6876067 Semiconductor device Apr. 5, 2005
6870254 Flip clip attach and copper clip attach on MOSFET device Mar. 22, 2005
6870245 Electric component with an integrated circuit mounted on an island of a lead frame Mar. 22, 2005
6870243 Thin GaAs die with copper back-metal structure Mar. 22, 2005
6867482 Tape carrier type semiconductor device, method for manufacturing the same, and flexible substrate Mar. 15, 2005
6867483 Stress-free lead frame Mar. 15, 2005
6867481 Lead frame structure with aperture or groove for flip chip in a leaded molded package Mar. 15, 2005
6861735 Resin molded type semiconductor device and a method of manufacturing the same Mar. 1, 2005

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