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Class Information
Number: 257/669
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Lead frame > With stress relief
Description: Subject matter wherein means are provided to alleviate stresses and strains (e.g., mechanical or thermal stresses) to which a lead frame is subjected.

Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12

Patent Number Title Of Patent Date Issued
7563647 Integrated circuit package system with interconnect support Jul. 21, 2009
7556987 Method of fabricating an integrated circuit with etched ring and die paddle Jul. 7, 2009
7550845 Ball grid array package with separated stiffener layer Jun. 23, 2009
7541665 Lead frame for a magnetic sensor Jun. 2, 2009
7525179 Lead frame structure with aperture or groove for flip chip in a leaded molded package Apr. 28, 2009
7521276 Compliant terminal mountings with vented spaces and methods Apr. 21, 2009
7518219 Integrated heat spreader lid Apr. 14, 2009
7511362 Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument Mar. 31, 2009
7504714 Chip package with asymmetric molding Mar. 17, 2009
7492044 System and method for decreasing stress on solder holding BGA module to computer motherboard Feb. 17, 2009
7470979 Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument Dec. 30, 2008
7459770 Lead frame structure having blocking surfaces and semiconductor package integrated with the lead frame structure Dec. 2, 2008
7453139 Compliant terminal mountings with vented spaces and methods Nov. 18, 2008
7446399 Pad structures to improve board-level reliability of solder-on-pad BGA structures Nov. 4, 2008
7446400 Chip package structure and fabricating method thereof Nov. 4, 2008
7439611 Circuit board with auxiliary wiring configuration to suppress breakage during bonding process Oct. 21, 2008
7420266 Circuit device and manufacturing method thereof Sep. 2, 2008
7414302 Flashless lead frame with horizontal singulation Aug. 19, 2008
7408242 Carrier with reinforced leads that are to be connected to a chip Aug. 5, 2008
7408246 Controlling warping in integrated circuit devices Aug. 5, 2008
7402894 Integrated circuit carrier Jul. 22, 2008
7388295 Multi-chip module Jun. 17, 2008
7364947 Method for cutting lead terminal of package type electronic component Apr. 29, 2008
7361977 Semiconductor assembly and packaging for high current and low inductance Apr. 22, 2008
7345356 Optical package with double formed leadframe Mar. 18, 2008
7342318 Semiconductor package free of substrate and fabrication method thereof Mar. 11, 2008
7339262 Tape circuit substrate and semiconductor apparatus employing the same Mar. 4, 2008
7339259 Semiconductor device Mar. 4, 2008
7307339 Semiconductor device having curved leads offset from the center of bonding pads Dec. 11, 2007
7294912 Semiconductor device Nov. 13, 2007
7288833 Stress-free lead frame Oct. 30, 2007
7279779 Substrate assembly for stressed systems Oct. 9, 2007
RE39854 Lead frame chip scale package Sep. 25, 2007
7268430 Semiconductor device and process for manufacturing the same Sep. 11, 2007
7253508 Semiconductor package with a flip chip on a solder-resist leadframe Aug. 7, 2007
7250671 Lead frame and method for manufacturing semiconductor package with the same Jul. 31, 2007
7247928 Semiconductor device with electrical connection balls between an integrated circuit chip and a support plate, and process for fabricating it Jul. 24, 2007
7239008 Semiconductor apparatus and method for fabricating the same Jul. 3, 2007
7239009 Lead frame and semiconductor device having the same as well as method of resin-molding the same Jul. 3, 2007
7217992 Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor device May. 15, 2007
7215009 Expansion plane for PQFP/TQFP IR--package design May. 8, 2007
7208817 Semiconductor device Apr. 24, 2007
7202561 Semiconductor package with heat dissipating structure and method of manufacturing the same Apr. 10, 2007
7193299 Conductor frame and housing for a radiation-emitting component, radiation-emitting component and display and/or illumination system using radiation-emitting components Mar. 20, 2007
7190055 Lead frame and semiconductor device Mar. 13, 2007
7186585 Method of manufacturing an integrated heat spreader lid Mar. 6, 2007
7183485 Microelectronic component assemblies having lead frames adapted to reduce package bow Feb. 27, 2007
7170150 Lead frame for semiconductor package Jan. 30, 2007
7166911 Packaged microchip with premolded-type package Jan. 23, 2007
7157368 Method of accelerating test of semiconductor device Jan. 2, 2007

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