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Class Information
Number: 257/669
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Lead frame > With stress relief
Description: Subject matter wherein means are provided to alleviate stresses and strains (e.g., mechanical or thermal stresses) to which a lead frame is subjected.

Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12

Patent Number Title Of Patent Date Issued
5668404 Semiconductor device and production method thereof Sep. 16, 1997
5654877 Lead-on-chip integrated circuit apparatus Aug. 5, 1997
5640044 Semiconductor device and method of producing said semiconductor device Jun. 17, 1997
5637914 Lead frame and semiconductor device encapsulated by resin Jun. 10, 1997
5623163 Leadframe for semiconductor devices Apr. 22, 1997
5621242 Semiconductor package having support film formed on inner leads Apr. 15, 1997
5614759 Automated assembly of semiconductor devices using a pair of lead frames Mar. 25, 1997
5610436 Surface mount device with compensation for thermal expansion effects Mar. 11, 1997
5608260 Leadframe having contact pads defined by a polymer insulating film Mar. 4, 1997
5594274 Lead frame for use in a semiconductor device and method of manufacturing the semiconductor device using the same Jan. 14, 1997
5587606 Lead frame having deflectable and thereby precisely removed tie bars Dec. 24, 1996
5572346 Tape carrier for LCD driver package with anchor holes on either side of and spaced 0.2 mm to 10 mm from the chip mounting site Nov. 5, 1996
5572067 Sacrificial corner structures Nov. 5, 1996
5554885 Semiconductor device including means for dispersing and absorbing tensile forces acting on film tape Sep. 10, 1996
5550402 Electronic module of extra-thin construction Aug. 27, 1996
5545921 Personalized area leadframe coining or half etching for reduced mechanical stress at device edge Aug. 13, 1996
5541447 Lead frame Jul. 30, 1996
5541451 Packaged semiconductor device with external leads having anchor holes provided at polyamide/glass sealed regions Jul. 30, 1996
5539251 Tie bar over chip lead frame design Jul. 23, 1996
5528077 Flexible tab semiconductor device Jun. 18, 1996
5521428 Flagless semiconductor device May. 28, 1996
5517056 Molded carrier ring leadframe having a particular resin injecting area design for gate removal and semiconductor device employing the same May. 14, 1996
5506446 Electronic package having improved wire bonding capability Apr. 9, 1996
5486722 Lead frame having small pitch between outer leads Jan. 23, 1996
5471097 Resin encapsulated semiconductor device with an electrically insulating support and distortion preventing member Nov. 28, 1995
5468993 Semiconductor device with polygonal shaped die pad Nov. 21, 1995
5459634 Area array interconnect device and method of manufacture thereof Oct. 17, 1995
5457344 Test fixtures for C4 solder-bump technology Oct. 10, 1995
5448105 Semiconductor device having a leadframe and metal substrate Sep. 5, 1995
5432380 Apparatus for tape-mounting a semiconductor device Jul. 11, 1995
5384690 Flex laminate package for a parallel processor Jan. 24, 1995
5374832 Antifuse having TiW oxide film between two metal layers Dec. 20, 1994
5365106 Resin mold semiconductor device Nov. 15, 1994
5357139 Plastic encapsulated semiconductor device and lead frame Oct. 18, 1994
5355018 Stress-free semiconductor leadframe Oct. 11, 1994
5338972 Lead frame with deformable buffer portions Aug. 16, 1994
5338973 Carrier for film carrier type semiconductor device Aug. 16, 1994
5311399 High power ceramic microelectronic package May. 10, 1994
5309019 Low inductance lead frame for a semiconductor package May. 3, 1994
5304818 Lead frame Apr. 19, 1994
5304842 Dissimilar adhesive die attach for semiconductor devices Apr. 19, 1994
5293064 Lead frame and method of manufacturing a semiconductor device Mar. 8, 1994
5291372 Integral heat sink-terminal member structure of hybrid integrated circuit assembly and method of fabricating hybrid integrated circuit assembly using such structure Mar. 1, 1994
5289032 Tape automated bonding(tab)semiconductor device and method for making the same Feb. 22, 1994
5288539 Tab tape with a peeling-prevention structure for the conductive layer Feb. 22, 1994
5278446 Reduced stress plastic package Jan. 11, 1994
5276351 Electronic device and a manufacturing method for the same Jan. 4, 1994
5254869 Aluminum alloy/silicon chromium sandwich schottky diode Oct. 19, 1993
5250839 Multi-layer leadframes, electrically conductive plates used therefor and production of such conductive plates Oct. 5, 1993
5250842 Semiconductor devices using tab tape Oct. 5, 1993

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