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Browse by Category: Main > Physics
Class Information
Number: 257/669
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Lead frame > With stress relief
Description: Subject matter wherein means are provided to alleviate stresses and strains (e.g., mechanical or thermal stresses) to which a lead frame is subjected.










Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12

Patent Number Title Of Patent Date Issued
8710538 Light-emitting device with a spacer at bottom surface Apr. 29, 2014
8686544 Semiconductor device Apr. 1, 2014
8664752 Semiconductor die package and method for making the same Mar. 4, 2014
8652920 Substrate with embedded patterned capacitance Feb. 18, 2014
8610150 Light-emitting diode lamp with an improved leadframe Dec. 17, 2013
8610253 Lead frame, semiconductor device, and method of manufacturing semiconductor device Dec. 17, 2013
8610254 Apparatus for integrated circuit packaging Dec. 17, 2013
8604618 Structure and method for reducing vertical crack propagation Dec. 10, 2013
8575746 Chip on flexible printed circuit type semiconductor package Nov. 5, 2013
8558360 Flip chip package and method of manufacturing the same Oct. 15, 2013
8525311 Lead frame for semiconductor device Sep. 3, 2013
8525307 Semiconductor device, lead frame assembly, and method for fabricating the same Sep. 3, 2013
8519518 Integrated circuit packaging system with lead encapsulation and method of manufacture thereof Aug. 27, 2013
8492882 Semiconductor device and method of manufacturing same Jul. 23, 2013
8493739 Lightweight audio system for automotive applications and method Jul. 23, 2013
8470680 Substrate with embedded patterned capacitance Jun. 25, 2013
8466568 Multi-component device integrated into a matrix Jun. 18, 2013
8445998 Leadframe structures for semiconductor packages May. 21, 2013
8421197 Integrated circuit package system with warp-free chip Apr. 16, 2013
8410587 Integrated circuit package system Apr. 2, 2013
8410536 Substrate with embedded patterned capacitance Apr. 2, 2013
8390103 Apparatus for integrated circuit packaging Mar. 5, 2013
8384228 Package including wires contacting lead frame edge Feb. 26, 2013
8373257 Top exposed clip with window array Feb. 12, 2013
8358514 Electronic control device Jan. 22, 2013
8350393 Apparatus and method for predetermined component placement to a target platform Jan. 8, 2013
8351217 Wiring board Jan. 8, 2013
8344487 Stress mitigation in packaged microchips Jan. 1, 2013
8338925 Microelectronic assemblies having compliant layers Dec. 25, 2012
8324721 Integrated shunt resistor with external contact in a semiconductor package Dec. 4, 2012
8314345 Device mounting board and semiconductor module Nov. 20, 2012
8304867 Crack arrest vias for IC devices Nov. 6, 2012
8283772 Flip-flop semiconductor device packaging using bent leadfingers Oct. 9, 2012
8283756 Electronic component with buffer layer Oct. 9, 2012
8258608 Lead frame and intermediate product of semiconductor device Sep. 4, 2012
8253224 Semiconductor package with metal straps Aug. 28, 2012
8241958 Semiconductor device, semiconductor module, method for manufacturing semiconductor device, and lead frame Aug. 14, 2012
8237250 Advanced quad flat non-leaded package structure and manufacturing method thereof Aug. 7, 2012
8207597 Integrated circuit package system with flashless leads Jun. 26, 2012
8193628 Printed wiring board, a method of manufacturing printed wiring board, a sensor module, and a sensing device Jun. 5, 2012
8188583 Semiconductor device and method of manufacturing same May. 29, 2012
8183088 Semiconductor die package and method for making the same May. 22, 2012
8174131 Semiconductor device having a filled trench structure and methods for fabricating the same May. 8, 2012
8143707 Semiconductor device Mar. 27, 2012
8115284 Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board and electronic instrument Feb. 14, 2012
8110913 Integrated circuit package system with integral inner lead and paddle Feb. 7, 2012
8106493 Semiconductor device package having features formed by stamping Jan. 31, 2012
8097934 Delamination resistant device package having low moisture sensitivity Jan. 17, 2012
8058719 Integrated circuit with flexible planer leads Nov. 15, 2011
8021929 Apparatus and method configured to lower thermal stresses Sep. 20, 2011

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