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Class Information
Number: 257/669
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Lead frame > With stress relief
Description: Subject matter wherein means are provided to alleviate stresses and strains (e.g., mechanical or thermal stresses) to which a lead frame is subjected.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7459770 |
Lead frame structure having blocking surfaces and semiconductor package integrated with the lead frame structure |
Dec. 2, 2008 |
| 7453139 |
Compliant terminal mountings with vented spaces and methods |
Nov. 18, 2008 |
| 7446399 |
Pad structures to improve board-level reliability of solder-on-pad BGA structures |
Nov. 4, 2008 |
| 7446400 |
Chip package structure and fabricating method thereof |
Nov. 4, 2008 |
| 7439611 |
Circuit board with auxiliary wiring configuration to suppress breakage during bonding process |
Oct. 21, 2008 |
| 7420266 |
Circuit device and manufacturing method thereof |
Sep. 2, 2008 |
| 7414302 |
Flashless lead frame with horizontal singulation |
Aug. 19, 2008 |
| 7408242 |
Carrier with reinforced leads that are to be connected to a chip |
Aug. 5, 2008 |
| 7408246 |
Controlling warping in integrated circuit devices |
Aug. 5, 2008 |
| 7402894 |
Integrated circuit carrier |
Jul. 22, 2008 |
| 7388295 |
Multi-chip module |
Jun. 17, 2008 |
| 7364947 |
Method for cutting lead terminal of package type electronic component |
Apr. 29, 2008 |
| 7361977 |
Semiconductor assembly and packaging for high current and low inductance |
Apr. 22, 2008 |
| 7345356 |
Optical package with double formed leadframe |
Mar. 18, 2008 |
| 7342318 |
Semiconductor package free of substrate and fabrication method thereof |
Mar. 11, 2008 |
| 7339259 |
Semiconductor device |
Mar. 4, 2008 |
| 7339262 |
Tape circuit substrate and semiconductor apparatus employing the same |
Mar. 4, 2008 |
| 7307339 |
Semiconductor device having curved leads offset from the center of bonding pads |
Dec. 11, 2007 |
| 7294912 |
Semiconductor device |
Nov. 13, 2007 |
| 7288833 |
Stress-free lead frame |
Oct. 30, 2007 |
| 7279779 |
Substrate assembly for stressed systems |
Oct. 9, 2007 |
| RE39854 |
Lead frame chip scale package |
Sep. 25, 2007 |
| 7268430 |
Semiconductor device and process for manufacturing the same |
Sep. 11, 2007 |
| 7253508 |
Semiconductor package with a flip chip on a solder-resist leadframe |
Aug. 7, 2007 |
| 7250671 |
Lead frame and method for manufacturing semiconductor package with the same |
Jul. 31, 2007 |
| 7247928 |
Semiconductor device with electrical connection balls between an integrated circuit chip and a support plate, and process for fabricating it |
Jul. 24, 2007 |
| 7239008 |
Semiconductor apparatus and method for fabricating the same |
Jul. 3, 2007 |
| 7239009 |
Lead frame and semiconductor device having the same as well as method of resin-molding the same |
Jul. 3, 2007 |
| 7217992 |
Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor device |
May. 15, 2007 |
| 7215009 |
Expansion plane for PQFP/TQFP IR--package design |
May. 8, 2007 |
| 7208817 |
Semiconductor device |
Apr. 24, 2007 |
| 7202561 |
Semiconductor package with heat dissipating structure and method of manufacturing the same |
Apr. 10, 2007 |
| 7193299 |
Conductor frame and housing for a radiation-emitting component, radiation-emitting component and display and/or illumination system using radiation-emitting components |
Mar. 20, 2007 |
| 7190055 |
Lead frame and semiconductor device |
Mar. 13, 2007 |
| 7186585 |
Method of manufacturing an integrated heat spreader lid |
Mar. 6, 2007 |
| 7183485 |
Microelectronic component assemblies having lead frames adapted to reduce package bow |
Feb. 27, 2007 |
| 7170150 |
Lead frame for semiconductor package |
Jan. 30, 2007 |
| 7166911 |
Packaged microchip with premolded-type package |
Jan. 23, 2007 |
| 7157368 |
Method of accelerating test of semiconductor device |
Jan. 2, 2007 |
| 7154165 |
Flashless lead frame with horizontal singulation |
Dec. 26, 2006 |
| 7148561 |
Ball grid array substrate strip with warpage-preventive linkage structure |
Dec. 12, 2006 |
| 7141873 |
Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument |
Nov. 28, 2006 |
| 7135760 |
Moisture resistant integrated circuit leadframe package |
Nov. 14, 2006 |
| 7122401 |
Area array type semiconductor package fabrication method |
Oct. 17, 2006 |
| 7115446 |
Flip chip bonding method for enhancing adhesion force in flip chip packaging process and metal layer-built structure of substrate for the same |
Oct. 3, 2006 |
| 7115975 |
Semiconductor device, process of producing semiconductor device, and ink jet recording head |
Oct. 3, 2006 |
| 7112252 |
Assembly method for semiconductor die and lead frame |
Sep. 26, 2006 |
| 7102209 |
Substrate for use in semiconductor manufacturing and method of making same |
Sep. 5, 2006 |
| 7092890 |
Method for manufacturing thin GaAs die with copper-back metal structures |
Aug. 15, 2006 |
| 7087984 |
Methods for protecting intermediate conductive elements of semiconductor device assemblies |
Aug. 8, 2006 |
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