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Class Information
Number: 257/668
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Lead frame > On insulating carrier other than a printed circuit board
Description: Subject matter wherein the lead frame is mounted on an insulating carrier other than a printed circuit board.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7459779 |
Pad arrangement of driver IC chip for LCD and related circuit pattern structure of TAB package |
Dec. 2, 2008 |
| 7453139 |
Compliant terminal mountings with vented spaces and methods |
Nov. 18, 2008 |
| 7449770 |
Substrate with slot |
Nov. 11, 2008 |
| 7446398 |
Bump pattern design for flip chip semiconductor package |
Nov. 4, 2008 |
| 7443013 |
Flexible substrate for package of die |
Oct. 28, 2008 |
| 7442968 |
Chip on film (COF) package having test pad for testing electrical function of chip and method for manufacturing same |
Oct. 28, 2008 |
| 7411295 |
Circuit board, device mounting structure, device mounting method, and electronic apparatus |
Aug. 12, 2008 |
| 7408242 |
Carrier with reinforced leads that are to be connected to a chip |
Aug. 5, 2008 |
| 7408204 |
Flip-chip packaging structure for light emitting diode and method thereof |
Aug. 5, 2008 |
| 7408244 |
Semiconductor package and stack arrangement thereof |
Aug. 5, 2008 |
| 7393754 |
Tape carrier type semiconductor device and method of producing the same |
Jul. 1, 2008 |
| 7388293 |
Interposer method of fabricating same, and semiconductor device using the same having two portions with different constructions |
Jun. 17, 2008 |
| 7385281 |
Semiconductor integrated circuit device |
Jun. 10, 2008 |
| 7385283 |
Three dimensional integrated circuit and method of making the same |
Jun. 10, 2008 |
| 7382042 |
COF flexible printed wiring board and method of producing the wiring board |
Jun. 3, 2008 |
| 7378723 |
Method and apparatus for decoupling conductive portions of a microelectronic device package |
May. 27, 2008 |
| 7372130 |
Semiconductor device including a semiconductor chip formed on an insulating element such as a tape, and including an improved insulating arrangement |
May. 13, 2008 |
| 7372139 |
Semiconductor chip package |
May. 13, 2008 |
| 7372131 |
Routing element for use in semiconductor device assemblies |
May. 13, 2008 |
| 7368805 |
Semiconductor device, flexible substrate, tape carrier, and electronic device including the semiconductor device |
May. 6, 2008 |
| 7365424 |
Microelectronic component assemblies with recessed wire bonds and methods of making same |
Apr. 29, 2008 |
| 7362491 |
Heated glass panels and methods for making electrical contact with electro-conductive films |
Apr. 22, 2008 |
| 7358602 |
Semiconductor chip, and semiconductor wafer including a variable thickness insulating layer |
Apr. 15, 2008 |
| 7354795 |
Methods for packaging and encapsulating semiconductor device assemblies that include tape substrates |
Apr. 8, 2008 |
| 7352061 |
Flexible core for enhancement of package interconnect reliability |
Apr. 1, 2008 |
| 7339260 |
Wiring board providing impedance matching |
Mar. 4, 2008 |
| 7339259 |
Semiconductor device |
Mar. 4, 2008 |
| 7339262 |
Tape circuit substrate and semiconductor apparatus employing the same |
Mar. 4, 2008 |
| 7339282 |
Topographically indexed support substrates |
Mar. 4, 2008 |
| 7335972 |
Heterogeneously integrated microsystem-on-a-chip |
Feb. 26, 2008 |
| 7329947 |
Heat treatment jig for semiconductor substrate |
Feb. 12, 2008 |
| 7327032 |
Semiconductor package accomplishing fan-out structure through wire bonding |
Feb. 5, 2008 |
| 7324352 |
High capacity thin module system and method |
Jan. 29, 2008 |
| 7321167 |
Flex tape architecture for integrated circuit signal ingress/egress |
Jan. 22, 2008 |
| 7316939 |
Semiconductor device manufacturing method and manufacturing apparatus |
Jan. 8, 2008 |
| 7317243 |
Encapsulated lead having step configuration |
Jan. 8, 2008 |
| 7301103 |
Printed-wiring board, printed-circuit board and electronic apparatus |
Nov. 27, 2007 |
| 7298027 |
SMT three phase inverter package and lead frame |
Nov. 20, 2007 |
| 7294853 |
Substrate for mounting a semiconductor |
Nov. 13, 2007 |
| 7288832 |
Chip-mounted film package |
Oct. 30, 2007 |
| 7285850 |
Support elements for semiconductor devices with peripherally located bond pads |
Oct. 23, 2007 |
| 7274105 |
Thermal conductive electronics substrate and assembly |
Sep. 25, 2007 |
| 7256496 |
Semiconductor device having adhesion increasing film to prevent peeling |
Aug. 14, 2007 |
| 7256431 |
Insulating substrate and semiconductor device having a thermally sprayed circuit pattern |
Aug. 14, 2007 |
| 7256858 |
Liquid crystal display having a switching pin and a dummy output pin in driver IC |
Aug. 14, 2007 |
| 7253504 |
Integrated circuit package and method |
Aug. 7, 2007 |
| 7253508 |
Semiconductor package with a flip chip on a solder-resist leadframe |
Aug. 7, 2007 |
| 7253505 |
IC substrate with over voltage protection function |
Aug. 7, 2007 |
| 7253503 |
Integrated circuit device packages and substrates for making the packages |
Aug. 7, 2007 |
| 7250575 |
Wiring board, semiconductor device and display module |
Jul. 31, 2007 |
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