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Class Information
Number: 257/668
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Lead frame > On insulating carrier other than a printed circuit board
Description: Subject matter wherein the lead frame is mounted on an insulating carrier other than a printed circuit board.










Patents under this class:

Patent Number Title Of Patent Date Issued
8710681 Isolation rings for blocking the interface between package components and the respective molding compound Apr. 29, 2014
8710669 Semiconductor device manufacture in which minimum wiring pitch of connecting portion wiring layer is less than minimum wiring pitch of any other wiring layer Apr. 29, 2014
8664752 Semiconductor die package and method for making the same Mar. 4, 2014
8659145 Semiconductor device Feb. 25, 2014
8653669 Semiconductor package Feb. 18, 2014
8643155 Liquid crystal display and chip on film thereof Feb. 4, 2014
8643154 Semiconductor mounting device having multiple substrates connected via bumps Feb. 4, 2014
8642408 Semiconductor device Feb. 4, 2014
8637964 Low stray inductance power module Jan. 28, 2014
8629538 Power module package Jan. 14, 2014
8629537 Padless die support integrated circuit package system Jan. 14, 2014
8624365 Interposer based capacitors for semiconductor packaging Jan. 7, 2014
8614502 Three dimensional semiconductor assembly board with bump/flange supporting board, coreless build-up circuitry and built-in electronic device Dec. 24, 2013
8610237 Semiconductor apparatus Dec. 17, 2013
8604595 Multi-chip electronic package with reduced stress Dec. 10, 2013
8598694 Chip-package having a cavity and a manufacturing method thereof Dec. 3, 2013
8598692 Semiconductor device and method for manufacturing same Dec. 3, 2013
8591756 Method of manufacturing a metallized ceramic substrate Nov. 26, 2013
8581373 Tape package Nov. 12, 2013
8581372 Semiconductor storage device and a method of manufacturing the semiconductor storage device Nov. 12, 2013
8581113 Low cost high frequency device package and methods Nov. 12, 2013
8580647 Inductors with through VIAS Nov. 12, 2013
8575746 Chip on flexible printed circuit type semiconductor package Nov. 5, 2013
8575734 Lead frame Nov. 5, 2013
8570748 Planar electrical power electronic modules for high-temperature applications, and corresponding production methods Oct. 29, 2013
8558363 Lead frame substrate and method of manufacturing the same, and semiconductor device Oct. 15, 2013
8558359 Semiconductor package having lead frames Oct. 15, 2013
8546943 Ball grid array substrate with insulating layer and semiconductor chip package Oct. 1, 2013
8546942 Flip-chip semiconductor device having anisotropic electrical interconnection and substrate utilized for the package Oct. 1, 2013
8546922 Wiring board Oct. 1, 2013
8541886 Integrated circuit packaging system with via and method of manufacture thereof Sep. 24, 2013
8531014 Method and system for minimizing carrier stress of a semiconductor device Sep. 10, 2013
8525341 Printed circuit board having different sub-core layers and semicondutor package comprising the same Sep. 3, 2013
8525312 Area array quad flat no-lead (QFN) package Sep. 3, 2013
8525307 Semiconductor device, lead frame assembly, and method for fabricating the same Sep. 3, 2013
8519537 3D semiconductor package interposer with die cavity Aug. 27, 2013
8519526 Semiconductor package and fabrication method thereof Aug. 27, 2013
8508024 Chip package structure and package substrate Aug. 13, 2013
8492885 Semiconductor storage device and manufacturing method thereof Jul. 23, 2013
8482110 Electronic assemblies without solder and methods for their manufacture Jul. 9, 2013
8476745 Integrated circuit chip with reduced IR drop Jul. 2, 2013
8476111 Integrated circuit packaging system with intra substrate die and method of manufacture thereof Jul. 2, 2013
8471392 Semiconductor apparatus and endoscope apparatus Jun. 25, 2013
8471371 Semiconductor wiring assembly, semiconductor composite wiring assembly, and resin-sealed semiconductor device Jun. 25, 2013
8455300 Integrated circuit package system with embedded die superstructure and method of manufacture thereof Jun. 4, 2013
8446007 Non-uniform alignment of wafer bumps with substrate solders May. 21, 2013
8421219 Semiconductor component having adhesive squeeze-out prevention configuration and method of manufacturing the same Apr. 16, 2013
8411455 Mounting structure and motor Apr. 2, 2013
8410587 Integrated circuit package system Apr. 2, 2013
8409971 Integrated multicomponent device in a semiconducting die Apr. 2, 2013











 
 
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