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Class Information
Number: 257/667
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Lead frame > With dam or vent for encapsulant
Description: Subject matter with a portion or portions to block encapsulant flow, typically from flowing out of a mold during an encapsulation process, or vent means (e.g., grooves in lead frame leads) to permit egress to the atmosphere for air or other gases which are inside a mold during encapsulation.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7061082 |
Semiconductor die with attached heat sink and transfer mold |
Jun. 13, 2006 |
| 7049683 |
Semiconductor package including organo-metallic coating formed on surface of leadframe roughened using chemical etchant to prevent separation between leadframe and molding compound |
May. 23, 2006 |
| 7042730 |
Non-isolated heatsink(s) for power modules |
May. 9, 2006 |
| 7026192 |
Terminal land frame and method for manufacturing the same |
Apr. 11, 2006 |
| 7002240 |
Semiconductor leadframe for staggered board attach |
Feb. 21, 2006 |
| 6992385 |
Semiconductor device, a method of manufacturing the same and an electronic device |
Jan. 31, 2006 |
| 6979887 |
Support matrix with bonding channel for integrated semiconductors, and method for producing it |
Dec. 27, 2005 |
| 6972488 |
Semiconductor device in which a semiconductor chip mounted on a printed circuit is sealed with a molded resin |
Dec. 6, 2005 |
| 6967396 |
Semiconductor device |
Nov. 22, 2005 |
| 6949839 |
Aligned buried structures formed by surface transformation of empty spaces in solid state materials |
Sep. 27, 2005 |
| 6949822 |
Semiconductor multichip module package with improved thermal performance; reduced size and improved moisture resistance |
Sep. 27, 2005 |
| 6946722 |
Multi-part lead frame with dissimilar materials |
Sep. 20, 2005 |
| 6943434 |
Method for maintaining solder thickness in flipchip attach packaging processes |
Sep. 13, 2005 |
| 6924547 |
Memory card |
Aug. 2, 2005 |
| 6911719 |
Lead frame for resin sealed semiconductor device |
Jun. 28, 2005 |
| 6911725 |
Film substrate, semiconductor device, method of manufacturing film substrate, method of manufacturing semiconductor device and method of manufacturing circuit board with semiconductor device |
Jun. 28, 2005 |
| 6897092 |
Method of supporting a substrate film |
May. 24, 2005 |
| 6897093 |
Method of manufacturing a resin molded or encapsulation for small outline non-leaded (SON) or quad flat non-leaded (QFN) package |
May. 24, 2005 |
| 6893903 |
Semiconductor device and method for manufacturing the same |
May. 17, 2005 |
| 6894370 |
Lead frame and semiconductor device having the same as well as method of resin-molding the same |
May. 17, 2005 |
| 6891254 |
Semiconductor device with protrusions |
May. 10, 2005 |
| 6888227 |
Apparatus for routing signals |
May. 3, 2005 |
| 6888229 |
Connection components with frangible leads and bus |
May. 3, 2005 |
| 6888247 |
Interconnect structure with an enlarged air gaps disposed between conductive structures or surrounding a conductive structure within the same |
May. 3, 2005 |
| 6882033 |
High density direct connect LOC assembly |
Apr. 19, 2005 |
| 6882041 |
Thermally enhanced metal capped BGA package |
Apr. 19, 2005 |
| 6876066 |
Packaged microelectronic devices and methods of forming same |
Apr. 5, 2005 |
| 6873054 |
Semiconductor device and a method of manufacturing the same, a circuit board and an electronic apparatus |
Mar. 29, 2005 |
| 6867507 |
Lead frame |
Mar. 15, 2005 |
| 6856006 |
Encapsulation method and leadframe for leadless semiconductor packages |
Feb. 15, 2005 |
| 6853059 |
Semiconductor package having improved adhesiveness and ground bonding |
Feb. 8, 2005 |
| 6849915 |
Light sensitive semiconductor package and fabrication method thereof |
Feb. 1, 2005 |
| 6847103 |
Semiconductor package with exposed die pad and body-locking leadframe |
Jan. 25, 2005 |
| 6841859 |
Premolded cavity IC package |
Jan. 11, 2005 |
| 6838752 |
Semiconductor package with recessed leadframe and a recessed leadframe |
Jan. 4, 2005 |
| 6838750 |
Interconnect circuitry, multichip module, and methods of manufacturing thereof |
Jan. 4, 2005 |
| 6836004 |
Lead frame, and method for manufacturing semiconductor device and method for inspecting electrical properties of small device using the lead frame |
Dec. 28, 2004 |
| 6826829 |
Method for attaching a die with a low melting metal |
Dec. 7, 2004 |
| 6825550 |
Board-on-chip packages with conductive foil on the chip surface |
Nov. 30, 2004 |
| 6818971 |
Lead frame for resin-molded semiconductor device |
Nov. 16, 2004 |
| 6818968 |
Integrated circuit package and process for forming the same |
Nov. 16, 2004 |
| 6815835 |
Single sided adhesive tape for compound diversion on BOC substrates |
Nov. 9, 2004 |
| 6803646 |
Semiconductor device having first chip secured within resin layer and second chip secured on resin layer |
Oct. 12, 2004 |
| 6803258 |
Semiconductor device |
Oct. 12, 2004 |
| 6794738 |
Leadframe-to-plastic lock for IC package |
Sep. 21, 2004 |
| 6791167 |
Resin-molded device and manufacturing apparatus thereof |
Sep. 14, 2004 |
| 6784522 |
Electronic semiconductor device having a thermal spreader |
Aug. 31, 2004 |
| 6770962 |
Disposable mold runner gate for substrate based electronic packages |
Aug. 3, 2004 |
| 6756659 |
Die paddle clamping method for wire bond enhancement |
Jun. 29, 2004 |
| 6756660 |
Lead frame for a semiconductor device and a semiconductor device incorporating the lead frame |
Jun. 29, 2004 |
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