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Class Information
Number: 257/667
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Lead frame > With dam or vent for encapsulant
Description: Subject matter with a portion or portions to block encapsulant flow, typically from flowing out of a mold during an encapsulation process, or vent means (e.g., grooves in lead frame leads) to permit egress to the atmosphere for air or other gases which are inside a mold during encapsulation.










Patents under this class:
1 2 3 4 5 6 7 8 9 10

Patent Number Title Of Patent Date Issued
8680636 Package-type solid-state imaging apparatus with exhausting means Mar. 25, 2014
8664752 Semiconductor die package and method for making the same Mar. 4, 2014
8643156 Lead frame for assembling semiconductor device Feb. 4, 2014
8637976 Semiconductor device with lead terminals having portions thereof extending obliquely Jan. 28, 2014
8633062 Integrated circuit package system with integral inner lead and paddle and method of manufacture thereof Jan. 21, 2014
8624364 Integrated circuit packaging system with encapsulation connector and method of manufacture thereof Jan. 7, 2014
8587099 Leadframe having selective planishing Nov. 19, 2013
8575646 Creating an LED package with optical elements by using controlled wetting Nov. 5, 2013
8575765 Semiconductor package having underfill agent dispersion Nov. 5, 2013
8564107 Lead frame and method for manufacturing the same Oct. 22, 2013
8525307 Semiconductor device, lead frame assembly, and method for fabricating the same Sep. 3, 2013
8519521 Electronic device including a packaging substrate having a trench Aug. 27, 2013
8486733 Package having light-emitting element and fabrication method thereof Jul. 16, 2013
8482109 Integrated circuit packaging system with dual connection and method of manufacture thereof Jul. 9, 2013
8466009 Method of fabricating a semiconductor package with mold lock opening Jun. 18, 2013
8441127 Bump-on-trace structures with wide and narrow portions May. 14, 2013
8432025 Semiconductor device and plurality of dams Apr. 30, 2013
8426951 Multi-chip package having frame interposer Apr. 23, 2013
8421209 Semiconductor device with lead terminals having portions thereof extending obliquely Apr. 16, 2013
8420450 Method of molding semiconductor package Apr. 16, 2013
8420955 Lead pin for package substrate Apr. 16, 2013
8421219 Semiconductor component having adhesive squeeze-out prevention configuration and method of manufacturing the same Apr. 16, 2013
8410589 Lead frame, resin package, semiconductor device and resin package manufacturing method Apr. 2, 2013
8410587 Integrated circuit package system Apr. 2, 2013
8405227 Semiconductor device with a semiconductor chip connected in a flip chip manner Mar. 26, 2013
8405230 Semiconductor flip chip package having substantially non-collapsible spacer and method of manufacture thereof Mar. 26, 2013
8406004 Integrated circuit packaging system and method of manufacture thereof Mar. 26, 2013
8399966 Inserts for directing molding compound flow and semiconductor die assemblies Mar. 19, 2013
8399302 Method of manufacturing semiconductor device Mar. 19, 2013
8378467 Semiconductor device and method of manufacturing the same Feb. 19, 2013
8377751 Method for manufacturing semiconductor device Feb. 19, 2013
8368227 Semiconductor element and package having semiconductor element Feb. 5, 2013
8349658 Semiconductor device and method of forming conductive posts and heat sink over semiconductor die using leadframe Jan. 8, 2013
8350393 Apparatus and method for predetermined component placement to a target platform Jan. 8, 2013
8331104 Electronic device and circuit board Dec. 11, 2012
8258612 Encapsulant interposer system with integrated passive devices and manufacturing method therefor Sep. 4, 2012
8258019 Flip chip assembly process for ultra thin substrate and package on package assembly Sep. 4, 2012
8252615 Integrated circuit package system employing mold flash prevention technology Aug. 28, 2012
8252683 3D interconnection structure and method of manufacturing the same Aug. 28, 2012
8207599 Method and apparatus for directing molding compound flow and resulting semiconductor device packages Jun. 26, 2012
8203199 Tie bar and mold cavity bar arrangements for multiple leadframe stack package Jun. 19, 2012
8183088 Semiconductor die package and method for making the same May. 22, 2012
8178955 Semiconductor device May. 15, 2012
8174096 Stamped leadframe and method of manufacture thereof May. 8, 2012
8143707 Semiconductor device Mar. 27, 2012
8120150 Integrated circuit package system with dual connectivity Feb. 21, 2012
8097934 Delamination resistant device package having low moisture sensitivity Jan. 17, 2012
8076761 Reduced inductance IC leaded package Dec. 13, 2011
8067821 Flat semiconductor package with half package molding Nov. 29, 2011
8058107 Semiconductor die package using leadframe and clip and method of manufacturing Nov. 15, 2011

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