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Class Information
Number: 257/667
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Lead frame > With dam or vent for encapsulant
Description: Subject matter with a portion or portions to block encapsulant flow, typically from flowing out of a mold during an encapsulation process, or vent means (e.g., grooves in lead frame leads) to permit egress to the atmosphere for air or other gases which are inside a mold during encapsulation.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7615851 |
Integrated circuit package system |
Nov. 10, 2009 |
| 7576416 |
Chip package having with asymmetric molding and turbulent plate downset design |
Aug. 18, 2009 |
| 7566953 |
Leadframe designs for plastic overmold packages |
Jul. 28, 2009 |
| 7556986 |
Tape supported memory card leadframe structure |
Jul. 7, 2009 |
| 7547960 |
Structure of a lead-frame matrix of photoelectron devices |
Jun. 16, 2009 |
| 7535085 |
Semiconductor package having improved adhesiveness and ground bonding |
May. 19, 2009 |
| 7531785 |
Circuit device and method of manufacturing the same |
May. 12, 2009 |
| 7525180 |
Semiconductor mount substrate, semiconductor device and method of manufacturing semiconductor package |
Apr. 28, 2009 |
| 7508054 |
Semiconductor device and a method of manufacturing the same |
Mar. 24, 2009 |
| 7504714 |
Chip package with asymmetric molding |
Mar. 17, 2009 |
| 7504715 |
Packaging of a microchip device |
Mar. 17, 2009 |
| 7489028 |
Die package |
Feb. 10, 2009 |
| 7485952 |
Drop resistant bumpers for fully molded memory cards |
Feb. 3, 2009 |
| 7479409 |
Integrated circuit package with elevated edge leadframe |
Jan. 20, 2009 |
| 7462924 |
Electrical connector with elongated ground contacts |
Dec. 9, 2008 |
| 7459797 |
Standoffs for centralizing internals in packaging process |
Dec. 2, 2008 |
| 7453139 |
Compliant terminal mountings with vented spaces and methods |
Nov. 18, 2008 |
| 7449770 |
Substrate with slot |
Nov. 11, 2008 |
| 7446397 |
Leadless semiconductor package |
Nov. 4, 2008 |
| 7443012 |
Semiconductor device |
Oct. 28, 2008 |
| 7436049 |
Lead frame, semiconductor chip package using the lead frame, and method of manufacturing the semiconductor chip package |
Oct. 14, 2008 |
| 7423331 |
Molded stiffener for thin substrates |
Sep. 9, 2008 |
| 7414301 |
Printed circuit board with soldering lands |
Aug. 19, 2008 |
| 7413933 |
Integrated circuit package with leadframe locked encapsulation and method of manufacture therefor |
Aug. 19, 2008 |
| 7408242 |
Carrier with reinforced leads that are to be connected to a chip |
Aug. 5, 2008 |
| 7394153 |
Encapsulation of electronic devices |
Jul. 1, 2008 |
| 7378300 |
Integrated circuit package system |
May. 27, 2008 |
| 7378301 |
Method for molding a small form factor digital memory card |
May. 27, 2008 |
| 7371606 |
Manufacturing method of a semiconductor device |
May. 13, 2008 |
| 7351612 |
Method for fabricating quad flat non-leaded package |
Apr. 1, 2008 |
| 7348681 |
Electronic component and manufacturing method of the electronic component |
Mar. 25, 2008 |
| 7342298 |
Metal lid with improved adhesion to package substrate |
Mar. 11, 2008 |
| 7321160 |
Multi-part lead frame |
Jan. 22, 2008 |
| 7294907 |
Solid-state imaging device and method for manufacturing the same |
Nov. 13, 2007 |
| 7288833 |
Stress-free lead frame |
Oct. 30, 2007 |
| 7288843 |
Integrated circuit chip support substrate for placing in a mold, and associated method |
Oct. 30, 2007 |
| 7285846 |
Integrated circuit package with ESD protection |
Oct. 23, 2007 |
| 7271036 |
Leadframe alteration to direct compound flow into package |
Sep. 18, 2007 |
| 7265453 |
Semiconductor component having dummy segments with trapped corner air |
Sep. 4, 2007 |
| 7247520 |
Microelectronic component assemblies and microelectronic component lead frame structures |
Jul. 24, 2007 |
| 7247928 |
Semiconductor device with electrical connection balls between an integrated circuit chip and a support plate, and process for fabricating it |
Jul. 24, 2007 |
| 7242035 |
Side view LED package having lead frame structure designed to improve resin flow |
Jul. 10, 2007 |
| 7224049 |
Method of fabricating lead frame and method of fabricating semiconductor device using the same, and lead frame and semiconductor device using the same |
May. 29, 2007 |
| 7217990 |
Tape package having test pad on reverse surface and method for testing the same |
May. 15, 2007 |
| 7217599 |
Integrated circuit package with leadframe locked encapsulation and method of manufacture therefor |
May. 15, 2007 |
| 7215009 |
Expansion plane for PQFP/TQFP IR--package design |
May. 8, 2007 |
| 7208826 |
Semiconductor device and method of manufacturing the same |
Apr. 24, 2007 |
| 7183617 |
Magnetic shielding for magnetically sensitive semiconductor devices |
Feb. 27, 2007 |
| 7164192 |
Semiconductor die package with reduced inductance and reduced die attach flow out |
Jan. 16, 2007 |
| 7148560 |
IC chip package structure and underfill process |
Dec. 12, 2006 |
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